公开(公告)号：US20240089642A1

公开(公告)日：2024-03-14

申请号：US18511858

申请日：2023-11-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wontae JEONG ,  Eungkyu PARK ,  Dongyeop LEE ,  Yonghwa KIM ,  Gihoon LEE ,  Jaehwan LEE ,  Seungbum CHOI ,  Hyounggil CHOI ,  Changryong HEO

IPC: H04R1/02 ,  H01F38/14 ,  H01M50/209 ,  H01M50/24 ,  H05K5/00 ,  H05K5/02 ,  H05K5/03 ,  H05K5/06

CPC classification number: H04R1/025 ,  H01F38/14 ,  H01M50/209 ,  H01M50/24 ,  H05K5/0004 ,  H05K5/0017 ,  H05K5/0086 ,  H05K5/0247 ,  H05K5/03 ,  H05K5/069 ,  H01M2220/30 ,  H04R2499/11

Abstract: An electronic device may include: a housing including a front plate oriented in a first direction, a rear plate oriented in a second direction opposite the first direction, and a side member enclosing at least a part of a space between the front plate and the rear plate. The electronic device further including a display disposed to be visible through the front plate; a printed circuit board disposed between the display and the rear plate; a support structure having a first face oriented in the first direction and supporting the display and a second face oriented in the second direction and supporting the printed circuit board; a conductive member disposed between the support structure and the rear plate; and a sealing structure disposed between the conductive member and the rear plate, the sealing structure extending along a periphery of the conductive member and formed in a closed curve shape.

公开(公告)号：US20200084528A1

公开(公告)日：2020-03-12

申请号：US16510733

申请日：2019-07-12

Applicant: Samsung Electronics Co., Ltd

Inventor： Wontae JEONG ,  Eungkyu PARK ,  Dongyeop LEE ,  Yonghwa KIM ,  Gihoon LEE ,  Jaehwan LEE ,  Seungbum CHOI ,  Hyounggil CHOI ,  Changryong HEO

IPC: H04R1/02 ,  H01M2/10 ,  H05K5/00 ,  H05K5/06 ,  H05K5/02 ,  H01F38/14 ,  H05K5/03

Abstract: An electronic device may include: a housing including a front plate oriented in a first direction, a rear plate oriented in a second direction opposite the first direction, and a side member enclosing at least a part of a space between the front plate and the rear plate. The electronic device further including a display disposed to be visible through the front plate; a printed circuit board disposed between the display and the rear plate; a support structure having a first face oriented in the first direction and supporting the display and a second face oriented in the second direction and supporting the printed circuit board,; a conductive member disposed between the support structure and the rear plate; and a sealing structure disposed between the conductive member and the rear plate, the sealing structure extending along a periphery of the conductive member and formed in a closed curve shape.

公开(公告)号：US20230020693A1

公开(公告)日：2023-01-19

申请号：US17933787

申请日：2022-09-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wontae JEONG ,  Eungkyu PARK ,  Dongyeop LEE ,  Yonghwa KIM ,  Gihoon LEE ,  Jaehwan LEE ,  Seungbum CHOI ,  Hyounggil CHOI ,  Changryong HEO

IPC: H04R1/02 ,  H05K5/00 ,  H05K5/02 ,  H01F38/14 ,  H05K5/03 ,  H05K5/06 ,  H01M50/24 ,  H01M50/209

Abstract: An electronic device may include: a housing including a front plate oriented in a first direction, a rear plate oriented in a second direction opposite the first direction, and a side member enclosing at least a part of a space between the front plate and the rear plate. The electronic device further including a display disposed to be visible through the front plate; a printed circuit board disposed between the display and the rear plate; a support structure having a first face oriented in the first direction and supporting the display and a second face oriented in the second direction and supporting the printed circuit board; a conductive member disposed between the support structure and the rear plate; and a sealing structure disposed between the conductive member and the rear plate, the sealing structure extending along a periphery of the conductive member and formed in a closed curve shape.

公开(公告)号：US20250103787A1

公开(公告)日：2025-03-27

申请号：US18824006

申请日：2024-09-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dongsu LEE ,  Wontae JEONG ,  Sungcheol PARK

IPC: G06F30/3953

Abstract: A routing method for an integrated circuit includes selecting design for testing (DFT) instances targeted by routing, routing positions respectively corresponding to the DFT instances, generating routing sequences for the DFT instances, deriving a start point and an end point based on indices included in each of the routing sequences, calculating a distance between the start point and the end point, and selecting a routing sequence as a result of the calculating of the distance.

公开(公告)号：US20200218498A1

公开(公告)日：2020-07-09

申请号：US16738779

申请日：2020-01-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Wontae JEONG ,  Eungkyu PARK ,  Dongyeop LEE ,  Jaehwan LEE ,  Hyounggil CHOI

IPC: G06F3/16 ,  G06F1/16 ,  G10K9/122 ,  H01L27/32

Abstract: An electronic device including a housing including a first plate facing a first direction, a second plate facing opposite to the first direction, and a side surface member surrounding a portion of a space between the first and second plates; a display panel disposed in a second direction of the first plate, and visually disposed through at least a portion of the first plate; a speaker disposed on one surface of the display panel facing in the second direction; a bracket including a first surface facing in the first direction and a second surface facing in the second direction, and disposed to support the display panel on the first surface; and a bonding configured to attach the display panel and the bracket. The bonding layer includes a gap formed by deleting a portion of the bonding layer to receive the speaker, and formed between the display panel and the bracket.