公开(公告)号：US09887048B2

公开(公告)日：2018-02-06

申请号：US14882846

申请日：2015-10-14

申请人： Samsung Electronics Co., Ltd.

发明人： Taeho Kim ,  Jangwook Choi ,  Yonghee Lee

IPC分类号： H01G11/66 ,  H01G11/52 ,  H01G11/86 ,  H01G11/28 ,  H01G11/14 ,  H01G11/68 ,  H01G11/84 ,  H01G11/36 ,  H01G11/38

CPC分类号： H01G11/66 ,  H01G11/14 ,  H01G11/28 ,  H01G11/36 ,  H01G11/38 ,  H01G11/52 ,  H01G11/68 ,  H01G11/84 ,  H01G11/86 ,  Y02E60/13

摘要： Provided is a stretchable supercapacitor and a method of manufacturing the same. The stretchable supercapacitor includes a separator between first and second current collectors. The first and second current collectors each including an active material. The second current collector is on the first current collector. The separator includes an electrolyte. Each of the separator, the first current collector and the second current collector includes an elastic polymer layer. The first and second current collectors may each have a 3-dimensional nano-pore structure. The stretchable supercapacitor may further include a first electrode in contact with the first current collector and a second electrode in contact with the second current collector. The elastic polymer layers may include at least one of styrene-b-butadiene-b-styrene (SBS), polyurethane, polyurethane acrylate, acrylate polymer, acrylate terpolymer, and silicone-based polymer.

公开(公告)号：US11964357B2

公开(公告)日：2024-04-23

申请号：US17857289

申请日：2022-07-05

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Seungchul Han ,  Yonghee Lee ,  Taemin Earmme ,  Byoungho Kwon ,  Kuntack Lee

IPC分类号： B24B37/005 ,  B24B37/20

CPC分类号： B24B37/005 ,  B24B37/20

摘要： A conditioner of a chemical mechanical polishing (CMP) apparatus includes a disk to polish a polishing pad of the CMP apparatus, a driver to rotate the disk, a lifter to lift the driver, an arm to rotate the lifter, and a connector to connect the driver to the lifter, the driver being tiltable with respect to the lifter.

公开(公告)号：US11654458B2

公开(公告)日：2023-05-23

申请号：US17081855

申请日：2020-10-27

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Yonghee Lee ,  Byoungho Kwon ,  Kuntack Lee

IPC分类号： B08B1/00 ,  B08B13/00 ,  B08B1/04 ,  A46B13/00 ,  A46B13/02 ,  B08B3/04 ,  B24B7/22 ,  B24B37/04 ,  B24B37/00 ,  B24B7/00

CPC分类号： B08B1/002 ,  A46B13/001 ,  A46B13/02 ,  B08B1/04 ,  B08B3/04 ,  B08B13/00 ,  A46B2200/30 ,  B24B7/00 ,  B24B7/22 ,  B24B37/00 ,  B24B37/04

摘要： A substrate-cleaning apparatus may include a tilting arm to which a roll brush and a motor are coupled, a support arm positioned on the tilting arm, a first spring and a second spring coupling the tilting arm to the support arm, a first air bag and a second air bag mounted between the tilting arm and the support arm, and a controller configured to adjust an internal pressure of each of the first air bag and the second air bag. The controller may adjust a difference in internal pressure between the first air bag and the second air bag to control the inclination of the roll brush, and may adjust the internal pressure of each of the first air bag and the second air bag to move the roll brush vertically.

公开(公告)号：US11590628B2

公开(公告)日：2023-02-28

申请号：US16747034

申请日：2020-01-20

申请人： Samsung Electronics Co., Ltd.

发明人： Yonghee Lee ,  Yungjun Kim ,  Hyunjoon Park ,  Taemin Earmme ,  Seungchul Han ,  Byoungho Kwon ,  Kuntack Lee

IPC分类号： B24B37/20 ,  B24B37/005 ,  B24B37/30

摘要： A chemical mechanical polishing apparatus includes a fixing portion; and a rotary body module including a rotating shaft rotatably installed on the fixing portion, a first rotating unit connected to the rotating shaft and on which a wafer is mounted, and a second rotating unit disposed around the first rotating unit and on which a retainer ring is mounted, wherein the fixing portion comprises a first driving member disposed above the first rotating unit and a second driving member disposed above the second rotating unit, wherein the first and second driving members are comprised of a magnet or an electromagnet, wherein a first magnet, disposed opposite to the first driving member, is provided in the first rotating unit, and a second magnet, disposed opposite to the second driving member, is provided in the second rotating unit, and wherein the first rotating unit and the second rotating unit are independently tilted.

公开(公告)号：US11471996B2

公开(公告)日：2022-10-18

申请号：US16662439

申请日：2019-10-24

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Seungchul Han ,  Yonghee Lee ,  Taemin Earmme ,  Byoungho Kwon ,  Kuntack Lee

IPC分类号： B24B37/005 ,  B24B37/20

摘要： A conditioner of a chemical mechanical polishing (CMP) apparatus includes a disk to polish a polishing pad of the CMP apparatus, a driver to rotate the disk, a lifter to lift the driver, an arm to rotate the lifter, and a connector to connect the driver to the lifter, the driver being tiltable with respect to the lifter.

公开(公告)号：US09888320B2

公开(公告)日：2018-02-06

申请号：US15172877

申请日：2016-06-03

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Hyungdong Roh ,  Myung-Jin Lee ,  Yonghee Lee

IPC分类号： H03G11/00 ,  H04R5/04 ,  H01R24/58 ,  H01R107/00 ,  H04R1/10 ,  H04R29/00

CPC分类号： H04R5/04 ,  H01R24/58 ,  H01R2107/00 ,  H04R1/1041 ,  H04R29/00 ,  H04R2420/03

摘要： Disclosed is an audio device including an audio codec circuit connected to a first channel electrode, a second channel electrode, and a microphone detection electrode, and a jack detection circuit connected to a first channel detection electrode, a ground detection electrode, and the microphone detection electrode, and, in response to voltages of the first channel detection electrode and the ground detection electrode corresponding to a ground voltage, the jack detection circuit detects insertion of a jack, applies the ground voltage to the ground detection electrode, and applies a bias voltage to the microphone detection electrode.