公开(公告)号：US20250022758A1

公开(公告)日：2025-01-16

申请号：US18424111

申请日：2024-01-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yongho KIM ,  Sunoo KIM ,  Jinwoo KIM ,  Boin NOH ,  Sejun PARK ,  Jaehee OH

IPC: H01L21/66 ,  H01L23/00

Abstract: A semiconductor device includes a semiconductor substrate, a connection pad disposed on an interlayer insulating layer and electrically connected to an interconnection structure, a passivation layer disposed on the connection pad and having a first opening and a second opening, each exposing at least a portion of the connection pad, a first bump that includes a first lower conductive layer in contact with the connection pad within the first opening and a first upper conductive layer on the first lower conductive layer, and a second bump that includes a second lower conductive layer in contact with the connection pad within the second opening and a second upper conductive layer on the second lower conductive layer. The first and second lower conductive layers include the same material, and the first upper conductive layer and the second upper conductive layer include different materials.

公开(公告)号：US20240304504A1

公开(公告)日：2024-09-12

申请号：US18598077

申请日：2024-03-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Boin NOH ,  Yongho KIM ,  Sunoo KIM

IPC: H01L21/66 ,  H01L23/00 ,  H01L23/498 ,  H01L25/065

CPC classification number: H01L22/32 ,  H01L23/49816 ,  H01L24/08 ,  H01L24/16 ,  H01L25/0652 ,  H01L2224/08146 ,  H01L2224/08155 ,  H01L2224/16146 ,  H01L2224/16157 ,  H01L2924/01029 ,  H01L2924/0665 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311

Abstract: A semiconductor package includes: a semiconductor chip including an active layer; a bump pad positioned on the active layer; a passivation layer covering the bump pad and including a first opening and a second opening, wherein the first opening exposes a first portion of the second surface of the bump pad, and the second opening exposes a second portion of the second surface of the bump pad; a first bump disposed on the first portion of the second surface of the bump pad, which is exposed through the first opening; and a test bump disposed on the second portion of the second surface of the bump pad, which is exposed through the second opening, wherein the first bump includes at least one metal layer, and a length of the test bump in a vertical direction is less than a length of the first bump in the vertical direction.

公开(公告)号：US20240055378A1

公开(公告)日：2024-02-15

申请号：US18135927

申请日：2023-04-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yongho KIM ,  Jeonghoon AHN

IPC: H01L23/00 ,  H01L21/768 ,  H01L25/18 ,  H01L25/065 ,  H01L21/02

CPC classification number: H01L24/08 ,  H01L21/76897 ,  H01L21/76898 ,  H01L25/18 ,  H01L25/0657 ,  H01L21/02164 ,  H01L21/0217 ,  H01L2224/08145

Abstract: A semiconductor chip and a semiconductor package, the semiconductor chip includes a semiconductor substrate; a through electrode penetrating the semiconductor substrate; a bonding pad including a first conductive pad connected to the through electrode, and a second conductive pad on a central portion of the first conductive pad, an outer portion of the first conductive pad protruding outwardly relative to a sidewall of the second conductive pad; and a pad insulating layer on the semiconductor substrate and surrounding a sidewall of the first conductive pad and the sidewall of the second conductive pad.

公开(公告)号：US20210097158A1

公开(公告)日：2021-04-01

申请号：US15733390

申请日：2018-12-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Boram LEE ,  Woohyoung LEE ,  Taeksoo CHUN ,  Sunah KIM ,  Yongho KIM ,  Kyoungsun CHO ,  Gahyun JOO

IPC: G06F21/32 ,  G06F21/45 ,  G10L15/04 ,  G10L15/22 ,  G10L17/24 ,  G06K9/00

Abstract: Various embodiments of the present invention relate to a method and an electronic device for authenticating a user by using a voice command. Here, the electronic device may comprise a memory, an input apparatus, and a processor, wherein the processor is configured to: receive a voice command from the input apparatus; acquire user identification information and voice print information from the voice command; search reference voice print information of each of multiple users stored in the memory, for reference voice print information corresponding to the acquired user identification information; and perform authentication on the basis of the acquired voice print information and the reference voice print information. Other embodiments are also possible.

公开(公告)号：US20200099545A1

公开(公告)日：2020-03-26

申请号：US16578753

申请日：2019-09-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yeseul HONG ,  Yongho KIM ,  Sunah KIM ,  Boram LEE ,  Taeksoo CHUN

IPC: H04L12/28

Abstract: A method and apparatus capable of forwarding notification or information related to a function, generated from a given device, to a user through a device near (or in proximity to) the user by interworking a plurality of electronic devices, are provided. An electronic device includes a communication interface and a processor. The processor is configured to obtain a first message related to notification from an external device, identify a target electronic device for notification output based on the location of a user and notification output performance of each of a plurality of electronic devices capable of communication with the electronic device, and transmit a second message related to the notification to the target electronic device so that the identified target electronic device outputs the notification.

公开(公告)号：US20200349947A1

公开(公告)日：2020-11-05

申请号：US16960764

申请日：2019-01-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yongho KIM ,  Taeksoo CHUN ,  Sunah KIM ,  Boram LEE ,  Kyoungsun CHO ,  Gahyun JOO

IPC: G10L15/22 ,  G10L15/08 ,  G10L15/30 ,  G06F3/16 ,  G06F1/3293 ,  G06F1/3231

Abstract: In an embodiment of the disclosure, disclosed is an electronic device including a communication module, a microphone, a first and a second wake-up recognition module, a memory, and a processor. The processor is configured to receive a first user utterance through the microphone, recognize the first user utterance based on at least one of the first or the second wake-up recognition module, when the recognized first user utterance includes specified at least one first trigger information, record at least part of the first user utterance by activating the recording function, transmit recorded data to an external device, and receive at least one of second user utterance information, which is predicted to occur at a time after the function of the speech recognition service is activated by the first wake-up recognition module, or at least one response information associated with the second user utterance from the external device.

公开(公告)号：US20240047399A1

公开(公告)日：2024-02-08

申请号：US18378166

申请日：2023-10-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yongho KIM

IPC: H01L23/00

CPC classification number: H01L24/14 ,  H01L2224/13147 ,  H01L2224/13139 ,  H01L2224/13124 ,  H01L2224/13118

Abstract: A semiconductor package includes: a first semiconductor device including a first pad and a first metal bump structure on the first pad; and a second semiconductor device on the first semiconductor device, and including a third pad and a second metal bump structure on the third pad, wherein the first and second metal bump structures are bonded to each other to electrically connect the first and second semiconductor devices to each other. Each of the first and second metal bumps structures includes first to third metal patterns. The first to third metal patterns of the first metal bump structure are on the first pad. The first to third metal patterns of the second metal bump structure are on the third pad. The first and third metal patterns include a first metal having a first coefficient of thermal expansion less than that of a second metal of the second metal pattern.

公开(公告)号：US20210264965A1

公开(公告)日：2021-08-26

申请号：US17003038

申请日：2020-08-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Woojin RIM ,  Yongho KIM ,  Hoonki KIM

IPC: G11C11/408 ,  G11C11/4074 ,  G11C11/4094 ,  G11C11/4097

Abstract: A memory device is provided. The memory device includes a cell array having memory cells; n word lines sequentially arranged and including a first word line, an n-th word line, and word lines interposed between the first word line and the n-th word line; bit lines; a first power node located adjacent to the first word line; a second power node located adjacent to the n-th word line; a first switch connected between the first power node and the cell array; a write driver located adjacent to the n-th word line and connected to the bit lines; and a switch controller configured to control the first switch to isolate the first power node from the memory cells during a write operation on memory cells connected to the first word line.

公开(公告)号：US20210166689A1

公开(公告)日：2021-06-03

申请号：US17108112

申请日：2020-12-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yongho KIM ,  Hyunjin KIM ,  Sunah KIM ,  Dayoung LEE ,  Jaeyoung LEE ,  Jungkun LEE

IPC: G10L15/22 ,  G06F3/16 ,  H04R1/00 ,  H04R1/08 ,  H04R1/02

Abstract: According to an embodiment of the disclosure, an electronic device may include a speaker, a microphone, a wireless communication circuit, and at least one processor connected to the speaker, the microphone, and the wireless communication circuit. The at least one processor may be configured to: in response to a user's voice command received through the microphone, perform a task corresponding to the voice command, based on an information amount contained in a result of the task, determine a type of the result to be visually appropriate or auditorily appropriate, and based on the type of the result, determine a device for providing the result as a screen device or a speaker.