公开(公告)号：US11900929B2

公开(公告)日：2024-02-13

申请号：US17108112

申请日：2020-12-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yongho Kim ,  Hyunjin Kim ,  Sunah Kim ,  Dayoung Lee ,  Jaeyoung Lee ,  Jungkun Lee

IPC: G10L15/22 ,  G10L15/26 ,  G10L17/00 ,  G06F3/16 ,  H04R1/00 ,  H04R1/02 ,  H04R1/08

CPC classification number: G10L15/22 ,  G06F3/167 ,  H04R1/00 ,  H04R1/028 ,  H04R1/08 ,  G10L2015/221 ,  G10L2015/223 ,  H04R2420/07

Abstract: According to an embodiment of the disclosure, an electronic device may include a speaker, a microphone, a wireless communication circuit, and at least one processor connected to the speaker, the microphone, and the wireless communication circuit. The at least one processor may be configured to: in response to a user's voice command received through the microphone, perform a task corresponding to the voice command, based on an information amount contained in a result of the task, determine a type of the result to be visually appropriate or auditorily appropriate, and based on the type of the result, determine a device for providing the result as a screen device or a speaker.

公开(公告)号：US11631406B2

公开(公告)日：2023-04-18

申请号：US16960764

申请日：2019-01-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yongho Kim ,  Taeksoo Chun ,  Sunah Kim ,  Boram Lee ,  Kyoungsun Cho ,  Gahyun Joo

IPC: G10L15/22 ,  G06F1/3231 ,  G06F1/3293 ,  G06F3/16 ,  G10L15/08 ,  G10L15/30

Abstract: In an embodiment of the disclosure, disclosed is an electronic device including a communication module, a microphone, a first and a second wake-up recognition module, a memory, and a processor. The processor is configured to receive a first user utterance through the microphone, recognize the first user utterance based on at least one of the first or the second wake-up recognition module, when the recognized first user utterance includes specified at least one first trigger information, record at least part of the first user utterance by activating the recording function, transmit recorded data to an external device, and receive at least one of second user utterance information, which is predicted to occur at a time after the function of the speech recognition service is activated by the first wake-up recognition module, or at least one response information associated with the second user utterance from the external device.

公开(公告)号：US11514973B2

公开(公告)日：2022-11-29

申请号：US17003038

申请日：2020-08-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Woojin Rim ,  Yongho Kim ,  Hoonki Kim

IPC: G11C11/408 ,  G11C11/4074 ,  G11C11/4097 ,  G11C11/4094 ,  G11C5/14 ,  G11C11/419 ,  G11C11/418 ,  G11C11/413 ,  G11C7/12 ,  G11C11/417 ,  G11C11/416

Abstract: A memory device is provided. The memory device includes a cell array having memory cells; n word lines sequentially arranged and including a first word line, an n-th word line, and word lines interposed between the first word line and the n-th word line; bit lines; a first power node located adjacent to the first word line; a second power node located adjacent to the n-th word line; a first switch connected between the first power node and the cell array; a write driver located adjacent to the n-th word line and connected to the bit lines; and a switch controller configured to control the first switch to isolate the first power node from the memory cells during a write operation on memory cells connected to the first word line.

公开(公告)号：US11960582B2

公开(公告)日：2024-04-16

申请号：US15733390

申请日：2018-12-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Boram Lee ,  Woohyoung Lee ,  Taeksoo Chun ,  Sunah Kim ,  Yongho Kim ,  Kyoungsun Cho ,  Gahyun Joo

IPC: G06F21/32 ,  G06F21/45 ,  G06V40/50 ,  G10L15/04 ,  G10L15/22 ,  G10L17/24

CPC classification number: G06F21/32 ,  G06F21/45 ,  G06V40/50 ,  G10L15/04 ,  G10L15/22 ,  G10L17/24 ,  G10L2015/223 ,  G10L2015/227

Abstract: Various embodiments of the present invention relate to a method and an electronic device for authenticating a user by using a voice command. Here, the electronic device may comprise a memory, an input apparatus, and a processor, wherein the processor is configured to: receive a voice command from the input apparatus; acquire user identification information and voice print information from the voice command; search reference voice print information of each of multiple users stored in the memory, for reference voice print information corresponding to the acquired user identification information; and perform authentication on the basis of the acquired voice print information and the reference voice print information. Other embodiments are also possible.

公开(公告)号：US11798908B2

公开(公告)日：2023-10-24

申请号：US17215131

申请日：2021-03-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yongho Kim

IPC: H01L21/768 ,  H01L23/522 ,  H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L23/528 ,  H01L23/532

CPC classification number: H01L24/14 ,  H01L2224/13118 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13147

Abstract: A semiconductor package includes: a first semiconductor device including a first pad and a first metal bump structure on the first pad; and a second semiconductor device on the first semiconductor device, and including a third pad and a second metal bump structure on the third pad, wherein the first and second metal bump structures are bonded to each other to electrically connect the first and second semiconductor devices to each other. Each of the first and second metal bumps structures includes first to third metal patterns. The first to third metal patterns of the first metal bump structure are on the first pad. The first to third metal patterns of the second metal bump structure are on the third pad. The first and third metal patterns include a first metal having a first coefficient of thermal expansion less than that of a second metal of the second metal pattern.

公开(公告)号：USD847150S1

公开(公告)日：2019-04-30

申请号：US29601099

申请日：2017-04-19

Applicant: Samsung Electronics Co., Ltd.

Designer： Gahyun Joo ,  Sunah Kim ,  Yongho Kim ,  Yongsoung Lee

公开(公告)号：US20210066251A1

公开(公告)日：2021-03-04

申请号：US16865649

申请日：2020-05-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yongho Kim

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/29

Abstract: A semiconductor chip stack includes first and second semiconductor chips. The first chip includes a first semiconductor substrate having an active surface and an inactive surface, a first insulating layer formed on the inactive surface, and first pads formed in the first insulating layer. The second semiconductor chip includes a second semiconductor substrate having an active surface and an inactive surface, a second insulating layer formed on the active surface, second pads formed in the second insulating layer, a polymer layer formed on the second insulating layer, UBM patterns buried in the polymer layer; and buried solders formed on the UBM patterns, respectively, and buried in the polymer layer. A lower surface of the buried solders is coplanar with that of the polymer layer, the buried solders contact the first pads, respectively, at a contact surface, and a cross-sectional area of the buried solders is greatest on the contact surface.

公开(公告)号：USD973080S1

公开(公告)日：2022-12-20

申请号：US29778611

申请日：2021-04-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Designer： Jangwoo Lee ,  Seoeun Park ,  Yongho Kim

公开(公告)号：US10163838B2

公开(公告)日：2018-12-25

申请号：US15499272

申请日：2017-04-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Soojeoung Park ,  Bona Baek ,  Yongho Kim

IPC: H01L23/00

Abstract: A semiconductor device includes a semiconductor chip, pads provided on the semiconductor chip, and insulating patterns provided on the semiconductor chip. The insulating patterns having openings exposing the pads, and conductive patterns are provided in the openings and coupled to the pads. When viewed in a plan view, two opposite ends of the pads are spaced apart from the conductive patterns and two opposite ends of the conductive patterns are spaced apart from the pads. Additionally, when viewed in a plan view, the conductive patterns include a first conductive pattern whose length is parallel to a first direction and a second conductive pattern whose length is parallel to a second direction. The first and second directions are oblique to each other.

公开(公告)号：US10134486B2

公开(公告)日：2018-11-20

申请号：US15699412

申请日：2017-09-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hoonki Kim ,  Yongho Kim ,  Changnam Park ,  Taejoong Song ,  Woojin Rim ,  Jonghoon Jung

IPC: G11C29/00 ,  G11C7/10 ,  G11C29/26 ,  G11C5/02

Abstract: A memory device includes a memory cell array including a plurality of memory cells arranged in a plurality of columns including a normal column and a redundancy column for repairing the normal column, a plurality of peripheral logic circuits including a normal peripheral logic circuit and a redundancy peripheral logic circuit for repairing the normal peripheral logic circuit, and a first path selection logic circuit configured to form first paths between the plurality of columns and the plurality of peripheral logic circuits, based on at least one defect from among a defect in at least one of the plurality of columns or a defect in at least one of the plurality of peripheral logic circuits.