公开(公告)号：US11742294B2

公开(公告)日：2023-08-29

申请号：US17306290

申请日：2021-05-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongho Park ,  Seunghwan Kim ,  Junyoung Oh ,  Yonghyun Kim ,  Yongkwan Lee ,  Junga Lee

IPC: H01L23/13 ,  H01L23/538 ,  H01L23/00 ,  H01L23/498 ,  H01L25/10 ,  H01L23/31

CPC classification number: H01L23/5385 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/5386 ,  H01L24/16 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/73204 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058

Abstract: A semiconductor package includes a first package substrate; a first semiconductor chip on the first package substrate; a first conductive connector on the first package substrate; and an interposer including a central portion on the first semiconductor chip and an outer portion having the first conductive connector attached thereto. The central portion of the interposer includes a bottom surface defining a recess from a bottom surface of the outer portion of the interposer in a vertical direction that is perpendicular to a top surface of the first package substrate. A thickness in the vertical direction of the outer portion of the interposer is greater than a thickness in the vertical direction of the central portion of the interposer.