公开(公告)号：US20220189823A1

公开(公告)日：2022-06-16

申请号：US17404136

申请日：2021-08-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yongmin Kim ,  Moonjong Kang ,  Miyoun Kim ,  Sungil Moon ,  Jongsu Park ,  Heonju Lee ,  Sunkak Jo

IPC: H01L21/768 ,  H01L21/311 ,  H01L27/11582 ,  H01L27/11575

Abstract: According to example embodiments, a method of manufacturing a semiconductor device is provided. The method includes forming an etching target layer on a substrate; forming a first photoresist layer on the etching target layer; forming a first alignment key under the first photoresist layer and a first alignment pattern aligned in a first direction perpendicular to a top surface of the substrate, by exposing and developing the first photoresist layer; forming a second alignment key under the first photoresist layer and a second alignment pattern aligned in the first direction, by exposing and developing the first photoresist layer; and forming a third alignment key aligned with the first alignment key in the first direction under the first photoresist layer and a fourth alignment key aligned with the second alignment key in the first direction on the etching target layer based on the first and second alignment patterns.

公开(公告)号：US08905239B2

公开(公告)日：2014-12-09

申请号：US13783657

申请日：2013-03-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Doojin Kim ,  Hyungjin Lee ,  Youngsik Kim ,  Sungbok Hong ,  Yongmin Kim ,  Chulmin Kim

IPC: B65D85/00 ,  H01L21/673

CPC classification number: H01L21/6735 ,  H01L21/6732

Abstract: A strip member loading magazine, which may load strip members such as semiconductor integrated circuit lead frames, for example, may include a bottom plate, a plurality of first slot plates provided at opposite sides of the bottom plate, a top plate fixed to a top portion of the first slot plates to be parallel to the bottom plate, second slot plates disposed to face each other between the first slot plates and be able to be moved, and locking units fastening the second slot plates to at least the top or bottom plate, the second slot plates being fastened parallel to the first slot plates.

Abstract translation: 例如，可以装载诸如半导体集成电路引线框架的条状部件的条形部件装载仓可以包括底板，设置在底板的相对侧的多个第一狭槽板，固定到顶部的顶板 所述第一狭槽板的一部分平行于所述底板，所述第二狭槽板设置成在所述第一狭槽板之间彼此面对并且能够移动;以及锁定单元，其将所述第二狭槽板紧固到至少所述顶板或底板 第二槽板平行于第一槽板固定。

公开(公告)号：US11984536B2

公开(公告)日：2024-05-14

申请号：US17308345

申请日：2021-05-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taehun Kim ,  Yongmin Kim ,  Sungwon Ko ,  Bokyoung Kim ,  Jinhwan Kim ,  Wongoo Hur

IPC: H01L33/38 ,  H01L33/46 ,  H01L33/62 ,  H01L33/32 ,  H01L33/42

CPC classification number: H01L33/382 ,  H01L33/46 ,  H01L33/62 ,  H01L33/32 ,  H01L33/42

Abstract: A semiconductor light emitting device includes a first electrode layer, a light emitting structure on the first electrode layer, a transparent electrode layer between the first electrode layer and the light emitting structure, an interlayer insulating layer between the transparent electrode layer and the first electrode layer, and having first and second openings, a second electrode layer between the first electrode layer and the interlayer insulating layer, and connected to the transparent electrode layer, and an electrode pad contacting the second electrode layer, each of the first openings and at least one of the second openings define one group to have at least first and second groups, the first group being closer to the electrode pad than the second group is, and a distance between the first and second openings in the first group being greater than a distance between the first and second openings in the second group.

公开(公告)号：US09881865B1

公开(公告)日：2018-01-30

申请号：US15221338

申请日：2016-07-27

Applicant: Samsung Electronics Co., Ltd. ,  THE BOARD OF TRUSTEES OF THE LELAND STANFORD JUNIOR UNIVERSITY

Inventor： Ki-Hyun Kim ,  Friedrich B. Prinz ,  Jinsung Kang ,  Youngdong Lee ,  John Provine ,  Peter Schindler ,  Stephen P. Walch ,  Yongmin Kim ,  Hyo Jin Kim

IPC: H01L23/522 ,  H01L23/532 ,  H01L23/528 ,  H01L23/535 ,  H01L27/108 ,  H01L21/768

CPC classification number: H01L23/5225 ,  H01L21/76816 ,  H01L21/76832 ,  H01L21/76877 ,  H01L23/5226 ,  H01L23/5283 ,  H01L23/53257 ,  H01L23/53295 ,  H01L23/535 ,  H01L27/10823 ,  H01L27/10876 ,  H01L27/10885

Abstract: A method of forming a composite dielectric material can be provided by performing a first deposition cycle to form a first dielectric material and performing a second deposition cycle to form a second dielectric material on the first dielectric material, wherein the first and second dielectric materials comprise different dielectric materials selected from a list consisting of a transition metal nitride, a transition metal oxide, a transition metal carbide, a transition metal silicide, a post-transition metal nitride, a post-transition metal oxide, a post-transition metal carbide, a post-transition metal silicide, a metalloid nitride, a metalloid oxide, and a metalloid carbide.

公开(公告)号：US20130256186A1

公开(公告)日：2013-10-03

申请号：US13783657

申请日：2013-03-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doojin Kim ,  Hyungjin Lee ,  Youngsik Kim ,  Sungbok Hong ,  Yongmin Kim ,  Chulmin Kim

IPC: H01L21/673

CPC classification number: H01L21/6735 ,  H01L21/6732

Abstract: A strip member loading magazine, which may load strip members such as semiconductor integrated circuit lead frames, for example, may include a bottom plate, a plurality of first slot plates provided at opposite sides of the bottom plate, a top plate fixed to a top portion of the first slot plates to be parallel to the bottom plate, second slot plates disposed to face each other between the first slot plates and be able to be moved, and locking units fastening the second slot plates to at least the top or bottom plate, the second slot plates being fastened parallel to the first slot plates.

Abstract translation: 例如，可以装载诸如半导体集成电路引线框架的条状部件的条形部件装载仓可以包括底板，设置在底板的相对侧的多个第一狭槽板，固定到顶部的顶板 所述第一狭槽板的一部分平行于所述底板，所述第二狭槽板设置成在所述第一狭槽板之间彼此面对并且能够移动;以及锁定单元，其将所述第二狭槽板紧固到至少所述顶板或底板 第二槽板平行于第一槽板固定。

公开(公告)号：US11789550B2

公开(公告)日：2023-10-17

申请号：US17870361

申请日：2022-07-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yongmin Kim ,  Juwan Park

IPC: G06F3/0354 ,  G06F3/041

CPC classification number: G06F3/03545 ,  G06F3/0414

Abstract: An electronic device is provided. The electronic device includes a housing, a nib which is disposed in the housing, includes a pen tip protruding to the outside through the second end, and includes a dielectric coil wound multiple times therein, a printed circuit board electrically connected to the dielectric coil, a board seating part which is at least partially coupled to the nib and in which a printed circuit board is seated, an elastic member seating part disposed in the housing such that the elastic member seating part and the board seating part are at least partially fitted to each other, and an elastic member disposed between the elastic member seating part and the board seating part, when the nib is pressed in a direction toward the inside of the housing by the pen pressure, the pen pressure is transmitted to the elastic member via the board seating part.