公开(公告)号：US20140120774A1

公开(公告)日：2014-05-01

申请号：US13920732

申请日：2013-06-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Che-Heung KIM ,  Young-hun BYUN ,  Seong-woon BOOH

IPC: H01L31/05

CPC classification number: H01L31/0504 ,  H01L23/3735 ,  H01L23/49811 ,  H01L24/48 ,  H01L24/49 ,  H01L25/072 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/4846 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/30107 ,  Y02E10/50 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: Provided are a substrate for a power module having a uniform parallel switching characteristic and a power module including the same. The substrate for the power module includes a plurality of areas on which input terminals are mounted, an area on which an output terminal is mounted, a plurality of areas on which devices are mounted, and an area on which a plurality of control pins are mounted. The plurality of areas on which the devices are mounted are bilaterally symmetric about the area on which the plurality of control pins are mounted. The plurality of areas on which the input terminals are mounted, respectively, are provided into three areas spaced apart from each other and bilaterally symmetric to each other. The plurality of areas on which the device are mounted are bilaterally symmetric about the area on which the control pins are mounted.

Abstract translation: 提供具有均匀并联开关特性的功率模块的基板和包括该基板的功率模块。 用于功率模块的基板包括安装有输入端子的多个区域，安装有输出端子的区域，安装有设备的多个区域以及安装有多个控制引脚的区域 。 安装有这些装置的多个区域是关于多个控制销安装在其上的区域的左右对称的。 分别安装有输入端子的多个区域被设置为彼此间隔开并彼此双边对称的三个区域。 安装设备的多个区域关于安装控制销的区域是双边对称的。

公开(公告)号：US20140021620A1

公开(公告)日：2014-01-23

申请号：US13739372

申请日：2013-01-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Baik-woo LEE ,  Young-hun BYUN ,  Seong-woon BOOH ,  Chang-mo JEONG

IPC: H01L23/498 ,  H01L21/02

CPC classification number: H01L23/49866 ,  H01L21/02697 ,  H01L23/3735 ,  H01L24/03 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/03424 ,  H01L2224/03464 ,  H01L2224/0508 ,  H01L2224/05644 ,  H01L2224/05664 ,  H01L2224/06181 ,  H01L2224/291 ,  H01L2224/29139 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48864 ,  H01L2224/73265 ,  H01L2224/8384 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2924/01322 ,  H01L2924/13033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

Abstract: According to example embodiments of inventive concepts, a power device includes a semiconductor structure having a first surface facing a second surface, an upper electrode, and a lower electrode. The upper electrode may include a first contact layer that is on the first surface of the semiconductor structure, and a first bonding pad layer that is on the first contact layer and is formed of a metal containing nickel (Ni). The lower electrode may include a second contact layer that is under the second surface of the semiconductor structure, and a second bonding pad layer that is under the second contact layer and is formed of a metal containing Ni.

Abstract translation: 根据本发明构思的示例实施例，功率器件包括具有面向第二表面的第一表面，上电极和下电极的半导体结构。 上电极可以包括在半导体结构的第一表面上的第一接触层和位于第一接触层上并由含镍（Ni）的金属形成的第一接合焊盘层。 下部电极可以包括在半导体结构的第二表面下方的第二接触层和位于第二接触层下方并由含有Ni的金属形成的第二接合焊盘层。