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公开(公告)号:US20240332378A1
公开(公告)日:2024-10-03
申请号:US18463488
申请日:2023-09-08
Applicant: Samsung Electronics Co., Ltd.
Inventor: Younggwon KIM , Seung Geun JUNG , Myung Gil KANG , Gyeom KIM , Dongwon KIM
IPC: H01L29/417 , H01L21/768 , H01L23/522 , H01L29/08 , H01L29/40
CPC classification number: H01L29/41733 , H01L21/76805 , H01L23/5226 , H01L29/0847 , H01L29/401 , H01L23/53295 , H01L29/42392 , H01L29/66439 , H01L29/66742 , H01L29/775 , H01L29/78696
Abstract: A semiconductor device may include a substrate, a lower pattern on the substrate, a channel pattern on the lower pattern, a source/drain pattern on both sides of the channel pattern, a gate structure surrounding the channel pattern, a contact electrode electrically connected to the source/drain pattern, an etch stop layer between the gate structure and the contact electrode, and a contact interface layer on the source/drain pattern. The contact interface layer may include a first region between the source/drain pattern and the contact electrode and a second region between the source/drain pattern and the etch stop layer.
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公开(公告)号:US20240096995A1
公开(公告)日:2024-03-21
申请号:US18231841
申请日:2023-08-09
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Beomjin PARK , Myunggil KANG , Dongwon KIM , Younggwon KIM , Hyumin YOO , Soojin JEONG
IPC: H01L29/423 , H01L29/06 , H01L29/08 , H01L29/66 , H01L29/775 , H01L29/786
CPC classification number: H01L29/42392 , H01L29/0673 , H01L29/0847 , H01L29/66545 , H01L29/775 , H01L29/78696
Abstract: A semiconductor device, may include an active region extending in a first direction; a plurality of channel layers on the active region to be spaced apart from each other; a gate structure, surrounding the plurality of channel layers, respectively; and source/drain regions on the active region on at least one side of the gate structure, and contacting the plurality of channel layers, wherein the gate structure may include an upper portion on an uppermost channel layer among the plurality of channel layers and lower portions between each of the plurality of channel layers in a region vertically overlapping the plurality of channel layers, wherein a width of each of the plurality of channel layers in the first direction may be less than a width of lower portions of the gate structure, adjacent to the respective channel layers among the lower portions of the gate structure in the first direction.
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公开(公告)号:US20240178293A1
公开(公告)日:2024-05-30
申请号:US18228824
申请日:2023-08-01
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hyumin YOO , Beomjin PARK , Myung Gil KANG , Dongwon KIM , Younggwon KIM
IPC: H01L29/423 , H01L27/092 , H01L29/06 , H01L29/08 , H01L29/417 , H01L29/775 , H01L29/786
CPC classification number: H01L29/42392 , H01L27/092 , H01L29/0673 , H01L29/0847 , H01L29/41733 , H01L29/41783 , H01L29/775 , H01L29/78696 , H01L29/7848
Abstract: Disclosed is a semiconductor device comprising a substrate including an active pattern, a channel pattern on the active pattern and including semiconductor patterns spaced apart from and vertically stacked on each other, a source/drain pattern connected to the semiconductor patterns having a p-type, a gate electrode on the semiconductor patterns and including inner electrodes between neighboring semiconductor patterns and an outer electrode on an uppermost semiconductor pattern, and a gate dielectric layer between the gate electrode and the semiconductor patterns and including an inner gate dielectric layer adjacent to the inner electrode and an outer gate dielectric layer that extends from bottom to lateral surfaces of the outer electrode. The outer electrode and the outer gate dielectric layer have an inverted T shape.
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公开(公告)号:US20240072149A1
公开(公告)日:2024-02-29
申请号:US18195749
申请日:2023-05-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Younggwon KIM , Myunggil Kang , Dongwon Kim , Beomjin Park , Inu Jeon , Soojin Jeong
IPC: H01L29/423 , H01L29/06 , H01L29/417 , H01L29/66 , H01L29/775 , H01L29/786
CPC classification number: H01L29/42392 , H01L29/0673 , H01L29/41775 , H01L29/66545 , H01L29/775 , H01L29/78696
Abstract: A semiconductor device includes a substrate including an active region extending in a first direction, a gate electrode layer crossing the active region and extending in a second direction, a plurality of channel layers on the active region, spaced apart from each other in a third direction, perpendicular to an upper surface of the substrate, and disposed sequentially from the active region, and surrounded by the gate electrode layer, gate spacer layers disposed on side surfaces of the gate electrode layer in the first direction, and source/drain regions disposed on the active region, on sides of the gate electrode layer, and connected to the plurality of channel layers. An uppermost channel layer among the plurality of channel layers includes channel portions separated from each other in the first direction and disposed below the gate spacer layers.
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