公开(公告)号：US11482410B2

公开(公告)日：2022-10-25

申请号：US17398219

申请日：2021-08-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hunjae Jang ,  Seungmin Shin ,  Kuntack Lee ,  Seungho Kim ,  Younghoo Kim ,  Taehong Kim ,  Sunghyun Park

IPC: H01L21/02 ,  B08B3/08 ,  B08B7/00 ,  B08B3/10

Abstract: A wafer-cleaning apparatus includes an inner pin that supports a wafer. The wafer-cleaning apparatus further includes a nozzle disposed above the inner pin, a light source disposed under the inner pin, a window disposed between the light source and the wafer, and a window protector disposed between the wafer and the window. The nozzle supplies a chemical liquid to the wafer and the inner pin distributes a portion of the chemical liquid on an upper surface of the wafer by rotating the wafer. The window protector receives a portion of the chemical liquid that flows out of the wafer and the light source supplies the light to the wafer through the window protector and the window.

公开(公告)号：US12225634B2

公开(公告)日：2025-02-11

申请号：US17348753

申请日：2021-06-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taehong Kim ,  Younghoo Kim ,  Sunghyun Park ,  Kuntack Lee

IPC: H01L21/67 ,  H01L21/687 ,  H05B1/02

Abstract: A substrate heating apparatus includes: a plurality of heating lamps disposed on a chuck stage; a window disposed on the chuck stage and including a window base and a central lens, wherein the chuck stage and the window are each configured to support a substrate above the heating lamps; and a mirror disposed between the heating lamps and the chuck stage, the mirror including a mirror base, a central reflector, and an edge reflector, wherein the plurality of heating lamps are configured to heat the substrate by emitting light through the window onto the substrate and emitting light onto the mirror, wherein the mirror is configured to reflect the light through the window onto the substrate, including reflecting portions of the light via the central and edge reflectors, and wherein the central lens is configured to focus the light onto the central portion of the substrate.

公开(公告)号：US20230244150A1

公开(公告)日：2023-08-03

申请号：US18186359

申请日：2023-03-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jihoon Jeong ,  Seohyun Kim ,  Sukhoon Kim ,  Younghoo Kim ,  Sangjine Park ,  Kuntack Lee

IPC: G03F7/16 ,  G03F7/20

CPC classification number: G03F7/16 ,  G03F7/70033

Abstract: A substrate processing apparatus includes a processing chamber providing a processing space for processing a substrate and processing a substrate, a substrate support configured to support the substrate, a blocking plate below the substrate support and configured to prevent supercritical fluid from being directly sprayed onto the substrate, a first supply device configured to supply supercritical fluid under a first condition to the processing chamber, a second supply device configured to supply supercritical fluid under a second condition at a higher temperature than that of supercritical fluid under the first condition to the processing chamber, a discharge device configured to discharge supercritical fluid from the processing chamber, and a control device configured to control operations of the first supply device, the second supply device, and the discharge device. The control device is configured to direct the first supply device to supply supercritical fluid prior to the second supply device.

公开(公告)号：US20230010670A1

公开(公告)日：2023-01-12

申请号：US17582620

申请日：2022-01-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sangjine Park ,  Jihoon Jeong ,  Younghoo Kim ,  Kuntack Lee

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/02

Abstract: Provided is a substrate drying apparatus. The substrate drying apparatus may include an upper chamber body including an inlet configured to introduce a supercritical fluid into a chamber space, a lower chamber body including an outlet configured to discharge the supercritical fluid outside the chamber space, and a stage configured to be loaded with a wet substrate and arranged in the chamber space, wherein the upper chamber body and the lower chamber body are configured such that the chamber space is closed by bringing the upper chamber body into contact with the lower chamber body, and the chamber space is opened by separating the upper chamber body from the lower chamber body, and the stage comprises a heater configured to heat the substrate and the supercritical fluid.

公开(公告)号：US20250155816A1

公开(公告)日：2025-05-15

申请号：US19025489

申请日：2025-01-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangjine PARK ,  Jihoon Jeong ,  Younghoo Kim ,  Kuntack Lee

IPC: G03F7/16

Abstract: A method for drying a wafer includes: supplying supercritical fluid to a drying chamber; stopping a supply of the supercritical fluid and drying a developer in the drying chamber; and exhausting the supercritical fluid from the drying chamber, wherein the exhausting the supercritical fluid includes: exhausting the supercritical fluid through a main exhaust line connected to the drying chamber by opening a main valve, based on pressure of the drying chamber being above a first pressure, based on the pressure of the drying chamber decreasing to the first pressure, exhausting the supercritical fluid through a negative pressure tank installed in an auxiliary exhaust line by closing the main valve and opening a first valve and a second valve that are installed in the auxiliary exhaust line.

公开(公告)号：US12057323B2

公开(公告)日：2024-08-06

申请号：US17559766

申请日：2021-12-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangjine Park ,  Seohyun Kim ,  Sukhoon Kim ,  Jihoon Jeong ,  Younghoo Kim ,  Kuntack Lee

IPC: H01L21/3213 ,  G03F7/20 ,  G03F7/30 ,  G03F7/32 ,  H01L21/308 ,  H01L21/311

CPC classification number: H01L21/32139 ,  G03F7/2004 ,  G03F7/3021 ,  G03F7/325 ,  H01L21/308 ,  H01L21/31144

Abstract: A substrate processing method includes providing a surface tension reducing agent as a gas onto a substrate, the substrate having an exposed photoresist layer and layer of developer on the exposed photoresist layer, and causing a bulk flow of the developer in order to remove the developer from the substrate.

公开(公告)号：US20230004089A1

公开(公告)日：2023-01-05

申请号：US17673978

申请日：2022-02-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangjine PARK ,  Jihoon Jeong ,  Younghoo Kim ,  Kuntack Lee

IPC: G03F7/16

Abstract: An apparatus for drying a wafer, includes: a drying chamber; a supercritical fluid supply module configured to supply supercritical fluid to the drying chamber; a main exhaust line connected to the drying chamber and in which a main valve is installed; and an auxiliary exhaust unit connected to the main exhaust line. The auxiliary exhaust unit includes: an auxiliary exhaust line connected to the main exhaust line and configured to exhaust the supercritical fluid from the drying chamber when the main valve is closed; a negative pressure tank installed in the auxiliary exhaust line; a first valve, installed in the auxiliary exhaust line, that is configured to be opened when the main valve is closed; and a second valve, installed in the auxiliary exhaust line, that is configured to be opened in conjunction with the first valve.

公开(公告)号：US20220199440A1

公开(公告)日：2022-06-23

申请号：US17381507

申请日：2021-07-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seohyun Kim ,  Younghoo Kim ,  Sangjine Park ,  Kuntack Lee ,  Jihoon Jeong

IPC: H01L21/677 ,  G03F7/20

Abstract: An apparatus for processing a substrate may include a wet chamber, a dry chamber, a first transfer robot and a shared shutter. The wet chamber may be configured to process the substrate using a chemical. The dry chamber may be adjacent the wet chamber and configured to dry the substrate processed by the wet chamber. The first transfer robot may be configured to transfer the substrate between the wet chamber and the dry chamber. The shared shutter may be between the wet chamber and the dry chamber. A connection opening through which the substrate may be transferred may be formed between the wet chamber and the dry chamber. The shared shutter may be configured to open and close the connection opening.

公开(公告)号：US12216408B2

公开(公告)日：2025-02-04

申请号：US17673978

申请日：2022-02-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangjine Park ,  Jihoon Jeong ,  Younghoo Kim ,  Kuntack Lee

IPC: G03F7/16

Abstract: An apparatus for drying a wafer, includes: a drying chamber; a supercritical fluid supply module configured to supply supercritical fluid to the drying chamber; a main exhaust line connected to the drying chamber and in which a main valve is installed; and an auxiliary exhaust unit connected to the main exhaust line. The auxiliary exhaust unit includes: an auxiliary exhaust line connected to the main exhaust line and configured to exhaust the supercritical fluid from the drying chamber when the main valve is closed; a negative pressure tank installed in the auxiliary exhaust line; a first valve, installed in the auxiliary exhaust line, that is configured to be opened when the main valve is closed; and a second valve, installed in the auxiliary exhaust line, that is configured to be opened in conjunction with the first valve.

公开(公告)号：US20220326617A1

公开(公告)日：2022-10-13

申请号：US17488456

申请日：2021-09-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sangjine Park ,  Jihoon Jeong ,  Younghoo Kim ,  Kuntack Lee

IPC: G03F7/38 ,  H01L21/02 ,  H01L21/687

Abstract: A substrate processing method includes supplying a first developer at a first temperature onto a substrate in a development device, thereby performing a development process, supplying a process fluid at a second temperature lower than the first temperature onto the substrate, thereby replacing a residue of the first developer remaining after the development process with a second developer, transferring the substrate from the development device to a supercritical drying device, and supplying, by the supercritical drying device, at least one of a supercritical fluid and a subcritical fluid onto the substrate, thereby drying the second developer.