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    Copolymerized Polyamide Resin, Method for Preparing the Same and Molded Article Comprising the Same
    2.
    发明申请
    Copolymerized Polyamide Resin, Method for Preparing the Same and Molded Article Comprising the Same 有权
    共聚聚酰胺树脂，其制备方法及其成型品

    公开(公告)号：US20160090448A1

    公开(公告)日：2016-03-31

    申请号：US14583429

    申请日：2014-12-26

    申请人： Samsung SDI Co., Ltd.

    发明人： So Young KWON ,  Jin Kyu KIM ,  Young Sub JIN ,  Joon Sung KIM ,  Ki Yon LEE ,  Suk Min JUN

    IPC分类号： C08G69/26 ,  C08G69/30

    CPC分类号： C08G69/265 ,  C08G69/30

    摘要： A copolymerized polyamide resin includes a polymer of a monomer mixture comprising a dicarboxylic acid component comprising adipic acid and a dicarboxylic acid represented by Formula 1, wherein each R1 is independently a C1 to C5 alkyl group and a is an integer from 0 to 4, and a diamine component comprising m-xylene diamine and a diamine represented by Formula 2, wherein A is a single bond or a C1 to C10 hydrocarbon group, R2 and R3 are each independently a C1 to C5 alkyl group, and b and c are each independently an integer from 0 to 4, wherein the copolymerized polyamide resin has a difference between a melting temperature (Tm) and a crystallization temperature (Tc) of about 50° C. or more. The copolymerized polyamide resin may have excellent heat resistance and reduced or no gel generation and yellowing phenomenon in a molding process.

    摘要翻译： 共聚聚酰胺树脂包括单体混合物的聚合物，其包含包含己二酸和由式1表示的二羧酸的二羧酸组分的单体混合物，其中每个R 1独立地为C 1至C 5烷基，a为0至4的整数，并且 包含间二甲苯二胺和由式2表示的二胺的二胺组分，其中A是单键或C1至C10烃基，R2和R3各自独立地为C1至C5烷基，b和c各自独立地为 0〜4的整数，其中共聚聚酰胺树脂的熔融温度（Tm）和结晶温度（Tc）之差在约50℃以上。 共聚聚酰胺树脂可以在成型工艺中具有优异的耐热性和减少的或没有凝胶产生和泛黄现象。

    Polyamide Resin, Method for Preparing the Same, and Molded Article Including the Same
    3.
    发明申请
    Polyamide Resin, Method for Preparing the Same, and Molded Article Including the Same 审中-公开
    聚酰胺树脂，其制备方法以及包含其的成型品

    公开(公告)号：US20160096924A1

    公开(公告)日：2016-04-07

    申请号：US14598506

    申请日：2015-01-16

    申请人： SAMSUNG SDI CO., LTD.

    发明人： Jin Kyu KIM ,  So Young KWON ,  Young Sub JIN ,  Joon Sung KIM ,  Su Yeong SON ,  Ki Yon LEE ,  Sang Kyun IM ,  Suk Min JUN

    IPC分类号： C08G69/30

    CPC分类号： C08G69/30 ,  C08G69/26

    摘要： A polyamide resin is a polymer of an adipic acid-containing dicarboxylic acid component and an m-xylenediamine-containing diamine component, wherein the polymer includes about 100 ppm or less of phosphorus and about 100 ppm or less of sodium (Na), and has a gel content of about 0.5% or less as measured on a specimen prepared by melting about 10 g of the polymer at about 260° C., maintaining the molten polymer for about 30 minutes, and then cooling the molten polymer to room temperature. The polyamide resin can exhibit excellent heat resistance and can reduce or prevent gel generation upon polymerization or molding.

    摘要翻译： 聚酰胺树脂是含己二酸的二羧酸成分和含有间二甲苯胺的二胺成分的聚合物，其中聚合物包含约100ppm以下的磷和约100ppm以下的钠（Na），并且具有 在通过在约260℃熔化约10g聚合物制备的样品上测量的凝胶含量为约0.5％或更低，保持熔融聚合物约30分钟，然后将熔融聚合物冷却至室温。 聚酰胺树脂可以表现出优异的耐热性，并且可以减少或防止聚合或模塑时的凝胶生成。