公开(公告)号：US20180163055A1

公开(公告)日：2018-06-14

申请号：US15656341

申请日：2017-07-21

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Sooyeon SIM ,  Jin-Hee BAE ,  TaekSoo KWAK ,  Yonggoog KIM ,  Jingyo KIM ,  Kunbae NOH ,  Huichan YUN ,  Jiho LEE ,  Byeong Gyu HWANG

IPC: C09D1/00 ,  C09D7/00 ,  C09D7/12 ,  C01B33/12 ,  H01L21/02

CPC classification number: C09D1/00 ,  C01B33/12 ,  C09D7/20 ,  C09D7/63 ,  H01L21/02164 ,  H01L21/02282 ,  H01L21/02318

Abstract: A composition for forming silica layer includes a silicon-containing polymer and a solvent, wherein a weight average molecular weight of the silicon-containing polymer ranges from about 2,000 to about 100,000 and a branching ratio (a) of the silicon-containing polymer calculated by Equation 1 ranges from about 0.25 to about 0.50. η=k·Ma  [Equation 1] In Equation 1, η is an intrinsic viscosity of a silicon-containing polymer, M is an absolute molecular weight of a silicon-containing polymer, a is a branching ratio, and k is an intrinsic constant.

公开(公告)号：US20200369915A1

公开(公告)日：2020-11-26

申请号：US16645343

申请日：2018-02-13

Applicant: Samsung SDI Co., Ltd.

Inventor： Kunbae NOH ,  Taeksoo KWAK ,  Junyoung JANG ,  Yoonyoung KOO ,  Yonggoog KIM ,  Jingyo KIM ,  Jin-Hee BAE ,  Jun SAKONG ,  Jinwoo SEO ,  Sooyeon SIM ,  Huichan YUN ,  Jiho LEE ,  Kwen-Woo HAN ,  Byeong Gyu HWANG

IPC: C09D183/16 ,  H01L21/306 ,  H01L21/02

Abstract: Provided is a composition for forming a silica layer, the composition containing a silicon-containing polymer and a solvent, wherein a silica layer formed of the composition for forming the silica layer satisfies Relation 1. The definition of Relation 1 is as described in the specification. The definition of Relation 1 is the same as described in the specification.