Deflection means including a deflection electrode mounted on a
travelling carriage in an ink jet system printer
    3.
    发明授权
    Deflection means including a deflection electrode mounted on a travelling carriage in an ink jet system printer 失效
    偏转装置包括安装在喷墨系统打印机中的行进托架上的偏转电极

    公开(公告)号:US4050076A

    公开(公告)日:1977-09-20

    申请号:US715007

    申请日:1976-08-17

    CPC分类号: B41J2/09

    摘要: A plate shaped slim electrode is mounted on a carriage which supports an ink issuing unit and a charging tunnel, and is driven to travel in the lateral direction. A cylinder shaped rotary deflection electrode is rotatably mounted on the body of an ink jet system printer in a direction parallel to the travelling direction of the carriage. In a preferred form, a slit opening is formed in the center of the plate shaped slim electrode. The plate shaped slim electrode is maintained at the ground potential, whereas the rotary deflection electrode is connected to a high voltage source to establish a high voltage electric field between the plate shaped slim electrode and the rotary deflection electrode.

    摘要翻译: 平板状的细长电极安装在支架上,该支架支承一个发墨单元和一个充电隧道,并被驱动沿横向行进。 圆筒状的旋转偏转电极沿着与滑架行进方向平行的方向可旋转地安装在喷墨打印机的主体上。 在优选形式中,在板状细长电极的中心形成狭缝开口。 板状细长电极保持接地电位,而旋转偏转电极连接到高电压源,以在板状细长电极和旋转偏转电极之间建立高电压电场。

    Ink dust removal for ink jet system printer
    5.
    发明授权
    Ink dust removal for ink jet system printer 失效
    喷墨系统打印机墨水除尘

    公开(公告)号:US3981020A

    公开(公告)日:1976-09-14

    申请号:US509700

    申请日:1974-09-26

    IPC分类号: B41J2/17 G01D15/18

    摘要: In an ink jet system printer wherein ink droplets are emitted from a nozzle toward a recording paper, objectionable ink dust is formed and diffused in various directions after the ink droplets impinge upon the recording paper. When the diffused ink dust attaches to a unit such as deflection means, the system may operate erroneously. An electrode is arranged in a position suited for minimizing the deleterious effects of diffused ink dust from the ink jet system printer by the use of an electrostatic attraction force or an electrostatic repulsion force.

    摘要翻译: 在其中墨滴从喷嘴朝向记录纸发射的喷墨系统打印机中,在墨滴撞击到记录纸上之后,形成不利的墨粉尘并在各个方向上扩散。 当扩散的墨粉粘附到诸如偏转装置的单元时,系统可能错误地操作。 电极被布置在适于通过使用静电吸引力或静电排斥力来最小化来自喷墨打印机的扩散墨粉的有害影响的位置。

    Grooved deflection electrodes in an ink jet system printer
    6.
    发明授权
    Grooved deflection electrodes in an ink jet system printer 失效
    在喷墨系统打印机中的凹槽偏转电极

    公开(公告)号:US4175266A

    公开(公告)日:1979-11-20

    申请号:US684363

    申请日:1976-05-07

    CPC分类号: B41J2/09 G01D15/18 Y10S101/37

    摘要: A pair of deflection electrodes at least one of which is grooved are provided to confront with each other in an ink jet system printer in order to deflect charged ink droplets emitted from a nozzle as they pass through a high voltage electric field established therebetween. Objectionable ink mist, which is unavoidably formed and diffused in various directions after the ink droplets impinge upon a recording paper or a beam gutter, attached to the grooved deflection electrode gathers and forms an ink drop, which is collected in an indent formed in the grooved deflection electrode. This precludes erroneous breaking down of the system and ensures stability of the high voltage electric field established between the pair of deflection electrodes.

    摘要翻译: 在喷墨系统打印机中设置一对偏转电极,其中至少一个是带槽的,以便在通过其间建立的高电压电场时使从喷嘴发出的带电墨滴偏转。 在墨滴撞击在带槽的偏转电极上的记录纸或光栅槽之后,不可避免地形成和扩散在各个方向上的不良墨雾聚集在一起形成墨滴,该墨滴被收集在形成于凹槽中的凹槽中 偏转电极。 这排除了系统的错误分解,并且确保了在一对偏转电极之间建立的高电压电场的稳定性。

    MANUFACTURING METHOD OF GLUTEN FREE NOODLE
    7.
    发明申请
    MANUFACTURING METHOD OF GLUTEN FREE NOODLE 审中-公开
    无糖面条的制造方法

    公开(公告)号:US20130337125A1

    公开(公告)日:2013-12-19

    申请号:US13523804

    申请日:2012-06-14

    申请人: Toshio Kobayashi

    发明人: Toshio Kobayashi

    IPC分类号: A23L1/162 B65B55/14 B65B55/19

    摘要: In a raw material preparing step, a rice powder as a primary raw material powder is added with a water to prepare a mixed raw material. In a kneading step, the mixed raw material is kneaded to form a kneaded substance. In a pressing/extending step, the kneaded substance is pressed and extended to form noodle dough sheet. In a slitting step, the noodle dough sheet is slit into predetermined noodle strand shape to obtain a continuous noodle strand However, these steps maintain a non-alpha state of the rice powder component In a packaging step, a unit-length noodle strand is accommodated in a pouch-like heat-resistant packaging container and hermetically sealed to obtain a packaged unit-length noodle strand, while maintaining a non-alpha state of the rice powder component in the noodle strand.

    摘要翻译: 在原料制备工序中,将作为主要原料粉末的米粉加入水中以制备混合原料。 在捏合步骤中,将混合的原料捏合以形成捏合物。 在压延/延伸步骤中,将捏合的物质压制并延伸以形成面条面片。 在切割步骤中,将面条片切成预定的面条形状以获得连续的面条。然而,这些步骤保持米粉成分的非α状态在包装步骤中,容纳单位面条 在袋状耐热包装容器中进行气密密封以获得包装的单位长度的面条,同时保持面粉条中的米粉成分的非α状态。

    REFRIGERATOR AND VACUUM HEAT INSULATING MATERIAL FOR USE IN REFRIGERATOR
    8.
    发明申请
    REFRIGERATOR AND VACUUM HEAT INSULATING MATERIAL FOR USE IN REFRIGERATOR 有权
    制冷机使用的制冷器和真空绝热材料

    公开(公告)号:US20130313267A1

    公开(公告)日:2013-11-28

    申请号:US13983507

    申请日:2012-08-31

    IPC分类号: F25D11/00

    摘要: The present invention provides a refrigerator with improved refrigerator box strength and high heat insulating performance, which is configured such that external deformation due to entry of air into a vacuum heat insulating material, the entry of air being caused by aging degradation, is prevented. The present invention includes: a heat-insulated box including an inner casing and an outer casing, in which space between the inner casing and the outer casing is filled with a foamed heat insulating material; and a vacuum heat insulating material disposed in at least a side wall of the heat-insulated box together with the foamed heat insulating material, the vacuum heat insulating material including an outer skin material, the outer skin material including at least a core material and being decompression-sealed. The vacuum heat insulating material includes a gas adsorbent. Since the vacuum heat insulating material including the gas adsorbent is included in the side wall, which tends to be greatly distorted among the heat insulating walls of the refrigerator, the rigidity of the side wall is improved and aging degradation of the vacuum heat insulating material is suppressed. As a result, the rigidity of the heat-insulated box can be maintained for a long term, and external deformation of the outer casing of the body can be prevented.

    摘要翻译: 本发明提供了一种具有改善的冰箱箱强度和高绝热性能的冰箱,其被构造成使得由于空气进入真空绝热材料而导致的外部变形,由老化劣化引起的空气进入。 本发明包括:包括内壳和外壳的绝热箱,其中内壳和外壳之间的空间填充有泡沫绝热材料; 以及设置在所述隔热箱的至少侧壁中的所述真空绝热材料与所述发泡绝热材料一起,所述真空绝热材料包括外皮材料,所述外皮材料至少包括芯材,并且是 减压密封。 真空绝热材料包括气体吸附剂。 由于包括气体吸附剂的真空隔热材料包括在侧壁中,在冰箱的绝热壁之间容易发生大的变形,所以侧壁的刚性提高,真空隔热材料的老化劣化是 被压制 结果,可以长期保持隔热箱的刚性,并且可以防止身体的外壳的外部变形。

    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
    9.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
    半导体器件及其制造方法

    公开(公告)号:US20120153507A1

    公开(公告)日:2012-06-21

    申请号:US13331121

    申请日:2011-12-20

    IPC分类号: H01L23/48 H01L21/56

    摘要: A method include disposing a semiconductor chip having an electrode pad formed on a circuit forming surface on one surface of a support so that the electrode pad contacts with the one surface of the support, forming a first insulating layer on the one surface of the support so that the first insulating layer covers at least a side surface of the semiconductor chip, removing the support and forming an interconnection terminal on the electrode pad, forming a second insulating layer on the circuit forming surface of the semiconductor chip and the first insulating layer so that the second insulating layer covers the interconnection terminal, exposing an end portion of the interconnection terminal from a top surface of the second insulating layer, and forming a wiring pattern that is electrically connected to the end portion of the interconnection terminal, on the top surface of the second insulating layer.

    摘要翻译: 一种方法包括在支撑体的一个表面上设置具有形成在电路形成表面上的电极焊盘的半导体芯片,使得电极焊盘与支撑体的一个表面接触,在支撑体的一个表面上形成第一绝缘层, 第一绝缘层至少覆盖半导体芯片的侧表面,去除支撑并在电极焊盘上形成互连端子,在半导体芯片的电路形成表面和第一绝缘层上形成第二绝缘层,使得 所述第二绝缘层覆盖所述互连端子,将所述互连端子的端部从所述第二绝缘层的顶表面露出,并且形成与所述互连端子的端部电连接的布线图案, 第二绝缘层。

    Method of manufacturing chip integrated substrate
    10.
    发明授权
    Method of manufacturing chip integrated substrate 有权
    芯片集成基板的制造方法

    公开(公告)号:US07807510B2

    公开(公告)日:2010-10-05

    申请号:US12123744

    申请日:2008-05-20

    申请人: Toshio Kobayashi

    发明人: Toshio Kobayashi

    IPC分类号: H01L23/31 H01L21/70

    摘要: There are provided the steps of connecting a chip component 13 to a first substrate 10 through a wire 14, providing an electrode 21 on a second substrate 20, attaching, to the first substrate 10, a molding tool 30 having a protruded portion 31 formed corresponding to an array of a bump connecting pad 12 of the first substrate 10 and a cavity 32 formed corresponding to a region in which the chip component 13 is mounted, thereby forming a first sealing resin 34 for sealing the chip component 13 and the wire 14, bonding the electrode 21 to the bump connecting pad 12 through a solder, thereby bonding the first substrate 10 to the second substrate 20, and filling a second filling resin 40 in a clearance portion between the first substrate 10 and the second substrate 20.

    摘要翻译: 提供了通过线14将芯片部件13连接到第一基板10的步骤,在第二基板20上提供电极21,将电极21附接到第一基板10,模制工具30具有对应形成的突出部分31 涉及第一基板10的凸块连接焊盘12的阵列和与安装芯片部件13的区域对应地形成的空腔32,由此形成用于密封芯片部件13和导线14的第一密封树脂34, 通过焊料将电极21接合到凸块连接焊盘12,从而将第一基板10接合到第二基板20,并且将第二填充树脂40填充在第一基板10和第二基板20之间的间隙部分中。