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公开(公告)号：US20110292722A1
公开(公告)日：2011-12-01
申请号：US13207611
申请日：2011-08-11
IPC分类号： G11C11/00
CPC分类号： G01R31/31715 , G11C13/0004 , G11C13/0069 , G11C2013/0083 , G11C2213/71 , G11C2213/72 , Y10T29/49169
摘要： A highly reliable large capacity phase change memory module is realized. A semiconductor device according to the present invention includes a memory array having a structure in which a storage layer using a chalcogcnidc material and a memory cell constituted of a diode are stacked, and an initialization condition and a rewriting condition are changed in accordance with the layer where a selected memory cell is located. A current mirror circuit is selected in accordance with an operation, and at the same time, the initialization condition and the rewriting condition (here, reset condition) are changed in accordance with the operation by a control mechanism of the reset current in a voltage selection circuit and a current mirror circuit.
摘要翻译： 实现了高度可靠的大容量相变存储器模块。 根据本发明的半导体器件包括存储阵列，该存储器阵列具有堆叠使用了电阻元件的存储层和由二极管构成的存储单元的结构，并且根据层来改变初始化条件和重写条件 其中所选择的存储器单元被定位。 根据操作选择电流镜电路，并且同时根据电压选择中的复位电流的控制机构的操作来改变初始化条件和重写条件（这里为复位条件） 电路和电流镜电路。
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公开(公告)号：US08130575B2
公开(公告)日：2012-03-06
申请号：US13207611
申请日：2011-08-11
CPC分类号： G01R31/31715 , G11C13/0004 , G11C13/0069 , G11C2013/0083 , G11C2213/71 , G11C2213/72 , Y10T29/49169
摘要： A highly reliable large capacity phase change memory module is realized. A semiconductor device according to the present invention includes a memory array having a structure in which a storage layer using a chalcogenide material and a memory cell constituted of a diode are stacked, and an initialization condition and a rewriting condition are changed in accordance with the layer where a selected memory cell is located. A current mirror circuit is selected in accordance with an operation, and at the same time, the initialization condition and the rewriting condition (here, reset condition) are changed in accordance with the operation by a control mechanism of the reset current in a voltage selection circuit and a current mirror circuit.
摘要翻译： 实现了高度可靠的大容量相变存储器模块。 根据本发明的半导体器件包括具有堆叠使用硫属化物材料的存储层和由二极管构成的存储单元的结构的存储器阵列，并且根据层来改变初始化条件和重写条件 其中所选择的存储器单元被定位。 根据操作选择电流镜电路，并且同时根据电压选择中的复位电流的控制机构的操作来改变初始化条件和重写条件（这里为复位条件） 电路和电流镜电路。
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公开(公告)号：US20090262574A1
公开(公告)日：2009-10-22
申请号：US12427392
申请日：2009-04-21
CPC分类号： G01R31/31715 , G11C13/0004 , G11C13/0069 , G11C2013/0083 , G11C2213/71 , G11C2213/72 , Y10T29/49169
摘要： A highly reliable large capacity phase change memory module is realized. A semiconductor device according to the present invention includes a memory array having a structure in which a storage layer using a chalcogenide material and a memory cell constituted of a diode are stacked, and an initialization condition and a rewriting condition are changed in accordance with the layer where a selected memory cell is located. A current mirror circuit is selected in accordance with an operation, and at the same time, the initialization condition and the rewriting condition (here, reset condition) are changed in accordance with the operation by a control mechanism of the reset current in a voltage selection circuit and a current mirror circuit.
摘要翻译： 实现了高可靠性的大容量相变存储器模块。 根据本发明的半导体器件包括具有堆叠使用硫属化物材料的存储层和由二极管构成的存储单元的结构的存储器阵列，并且根据层来改变初始化条件和重写条件 其中所选择的存储器单元被定位。 根据操作选择电流镜电路，并且同时根据电压选择中的复位电流的控制机构的操作来改变初始化条件和重写条件（这里为复位条件） 电路和电流镜电路。
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公开(公告)号：US07894232B2
公开(公告)日：2011-02-22
申请号：US12427392
申请日：2009-04-21
CPC分类号： G01R31/31715 , G11C13/0004 , G11C13/0069 , G11C2013/0083 , G11C2213/71 , G11C2213/72 , Y10T29/49169
摘要： A highly reliable large capacity phase change memory module is realized. A semiconductor device according to the present invention includes a memory array having a structure in which a storage layer using a chalcogenide material and a memory cell constituted of a diode are stacked, and an initialization condition and a rewriting condition are changed in accordance with the layer where a selected memory cell is located. A current mirror circuit is selected in accordance with an operation, and at the same time, the initialization condition and the rewriting condition (here, reset condition) are changed in accordance with the operation by a control mechanism of the reset current in a voltage selection circuit and a current mirror circuit.
摘要翻译： 实现了高度可靠的大容量相变存储器模块。 根据本发明的半导体器件包括具有堆叠使用硫属化物材料的存储层和由二极管构成的存储单元的结构的存储器阵列，并且根据层来改变初始化条件和重写条件 其中所选择的存储器单元被定位。 根据操作选择电流镜电路，并且同时根据电压选择中的复位电流的控制机构的操作来改变初始化条件和重写条件（这里为复位条件） 电路和电流镜电路。
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公开(公告)号：US20120135548A1
公开(公告)日：2012-05-31
申请号：US13366329
申请日：2012-02-05
IPC分类号： H01L21/66
CPC分类号： G01R31/31715 , G11C13/0004 , G11C13/0069 , G11C2013/0083 , G11C2213/71 , G11C2213/72 , Y10T29/49169
摘要： A highly reliable large capacity phase change memory module is realized. A semiconductor device according to the present invention includes a memory array having a structure in which a storage layer using a chalcogenide material and a memory cell constituted of a diode are stacked, and an initialization condition and a rewriting condition are changed in accordance with the layer where a selected memory cell is located. A current mirror circuit is selected in accordance with an operation, and at the same time, the initialization condition and the rewriting condition (here, reset condition) are changed in accordance with the operation by a control mechanism of the reset current in a voltage selection circuit and a current mirror circuit.
摘要翻译： 实现了高度可靠的大容量相变存储器模块。 根据本发明的半导体器件包括具有堆叠使用硫属化物材料的存储层和由二极管构成的存储单元的结构的存储器阵列，并且根据层来改变初始化条件和重写条件 其中所选择的存储器单元被定位。 根据操作选择电流镜电路，并且同时根据电压选择中的复位电流的控制机构的操作来改变初始化条件和重写条件（这里为复位条件） 电路和电流镜电路。
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公开(公告)号：US08482997B2
公开(公告)日：2013-07-09
申请号：US13366329
申请日：2012-02-05
CPC分类号： G01R31/31715 , G11C13/0004 , G11C13/0069 , G11C2013/0083 , G11C2213/71 , G11C2213/72 , Y10T29/49169
摘要： A highly reliable large capacity phase change memory module is realized. A semiconductor device according to the present invention includes a memory array having a structure in which a storage layer using a chalcogenide material and a memory cell constituted of a diode are stacked, and an initialization condition and a rewriting condition are changed in accordance with the layer where a selected memory cell is located. A current mirror circuit is selected in accordance with an operation, and at the same time, the initialization condition and the rewriting condition (here, reset condition) are changed in accordance with the operation by a control mechanism of the reset current in a voltage selection circuit and a current mirror circuit.
摘要翻译： 实现了高度可靠的大容量相变存储器模块。 根据本发明的半导体器件包括具有堆叠使用硫属化物材料的存储层和由二极管构成的存储单元的结构的存储器阵列，并且根据层来改变初始化条件和重写条件 其中所选择的存储器单元被定位。 根据操作选择电流镜电路，并且同时根据电压选择中的复位电流的控制机构的操作来改变初始化条件和重写条件（这里为复位条件） 电路和电流镜电路。
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公开(公告)号：US08508968B2
公开(公告)日：2013-08-13
申请号：US13461848
申请日：2012-05-02
CPC分类号： H01L25/0657 , G11C5/02 , H01L25/18 , H01L2224/16 , H01L2225/06513 , H01L2225/06541 , H01L2924/00014 , H01L2924/13091 , H01L2924/15311 , H01L2924/00 , H01L2224/05599
摘要： The need for mediation operation is eliminated by adoption of a connection topology in which a circuit for executing one transmission (TR—00T), and a circuit for executing a plurality of receptions (TR—10R, TR—20R, TR—30R) are connected to one penetration-electrode group (for example, TSVGL—0). In order to implement the connection topology even in the case of piling up a plurality of LSIs one after another, in particular, a programmable memory element for designating respective penetration-electrode ports for use in transmit, or for us in receive, and address allocation of the respective penetration-electrode ports is mounted in stacked LSIs.
摘要翻译： 通过采用其中执行一次发送的电路（TR-00T）和用于执行多个接收（TR-10R，TR-20R，TR-30R）的电路的连接拓扑结构来消除对中介操作的需要 连接到一个穿透电极组（例如，TSVGL-0）。 为了实现连接拓扑，即使在堆叠多个LSI的情况下，尤其是用于指定用于发送的各个穿透电极端口或用于接收的可编程存储器元件，以及地址分配 各个贯通电极端口安装在堆叠的LSI中。
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公开(公告)号：US08184463B2
公开(公告)日：2012-05-22
申请号：US12636758
申请日：2009-12-13
CPC分类号： H01L25/0657 , G11C5/02 , H01L25/18 , H01L2224/16 , H01L2225/06513 , H01L2225/06541 , H01L2924/00014 , H01L2924/13091 , H01L2924/15311 , H01L2924/00 , H01L2224/05599
摘要： The need for mediation operation is eliminated by adoption of a connection topology in which a circuit for executing one transmission (TR—00T), and a circuit for executing a plurality of receptions (TR—10R, TR—20R, TR—30R) are connected to one penetration-electrode group (for example, TSVGL—0). In order to implement the connection topology even in the case of piling up a plurality of LSIs one after another, in particular, a programmable memory element for designating respective penetration-electrode ports for use in transmit, or for us in receive, and address allocation of the respective penetration-electrode ports is mounted in stacked LSIs.
摘要翻译： 通过采用其中执行一次发送的电路（TR-00T）和用于执行多个接收（TR-10R，TR-20R，TR-30R）的电路的连接拓扑结构来消除对中介操作的需要 连接到一个穿透电极组（例如，TSVGL-0）。 为了实现连接拓扑，即使在堆叠多个LSI的情况下，尤其是用于指定用于发送的各个穿透电极端口或用于接收的可编程存储器元件，以及地址分配 各个贯通电极端口安装在堆叠的LSI中。
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公开(公告)号：US20120280231A1
公开(公告)日：2012-11-08
申请号：US13521961
申请日：2010-03-15
申请人： Kiyoto Ito , Takanobu Tsunoda , Makoto Saen
发明人： Kiyoto Ito , Takanobu Tsunoda , Makoto Saen
CPC分类号： G01R31/318536 , G01R31/318513 , H01L25/0657 , H01L27/0207 , H01L27/092 , H01L2224/16145 , H01L2225/06513 , H01L2225/06544 , H01L2225/06596
摘要： It has been difficult to carry out a test and an analysis with respect to combinational logic circuits mounted across plural chips, and therefore, there is provided a flip-flop (31b) by use of which either of a scan chain within a semiconductor chip (LSI_B), and a scan chain across plural semiconductor chips (LSI_A and LSI_B) can be made up.
摘要翻译： 对于跨越多个芯片的组合逻辑电路进行测试和分析是困难的，因此，提供了一种触发器（31b），其使用半导体芯片内的扫描链 LSI_B），并且可以构成跨越多个半导体芯片（LSI_A和LSI_B）的扫描链。
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10.发明授权Semiconductor integrated circuit device comprising a plurality of semiconductor chips mounted to stack for transmitting a signal between the semiconductor chips 有权半导体集成电路器件包括安装到堆叠的多个半导体芯片，用于在半导体芯片之间传输信号公开(公告)号：US08148814B2
公开(公告)日：2012-04-03
申请号：US12699006
申请日：2010-02-02
申请人： Futoshi Furuta , Kenichi Osada , Makoto Saen
发明人： Futoshi Furuta , Kenichi Osada , Makoto Saen
IPC分类号： H01L23/34
CPC分类号： H01L25/18 , G11C5/04 , H01L25/0657 , H01L2224/05001 , H01L2224/05009 , H01L2224/0557 , H01L2224/05571 , H01L2224/16145 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2924/00014 , H01L2924/01019 , H01L2924/13091 , H01L2924/00 , H01L2224/05599 , H01L2224/05099
摘要： In a through-via-hole path of semiconductor chips stacked in N stages, repeater circuits are provided in the respective semiconductor chips. For example, a signal transmitted from an output buffer circuit of the semiconductor chip is transmitted to an input buffer circuit of the semiconductor chip via the repeater circuits of the respective semiconductor chips. The respective repeater circuits can isolate impedances on input sides and output sides, and therefore, a deterioration of a waveform quality accompanied by a parasitic capacitance parasitic on the through-via-hole path of the respective semiconductor chips can be reduced and a high speed signal can be transmitted.
摘要翻译： 在以N级堆叠的半导体芯片的通孔通路中，在各半导体芯片中设置有中继电路。 例如，从半导体芯片的输出缓冲电路发送的信号经由各半导体芯片的中继电路发送到半导体芯片的输入缓冲电路。 各个中继器电路可以隔离输入侧和输出侧的阻抗，因此可以减少伴随着各个半导体芯片的通孔通路寄生的寄生电容的波形质量的劣化，并且可以降低高速信号 可以传输。
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