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    IC card having a reinforcing member for reinforcing a sealing member
    1.
    发明授权
    IC card having a reinforcing member for reinforcing a sealing member 失效
    IC卡具有用于加强密封构件的加强构件

    公开(公告)号：US6166914A

    公开(公告)日：2000-12-26

    申请号：US308382

    申请日：1999-05-18

    申请人： Satoru Sugiyama ,  Toyoji Kanazawa ,  Tetsuo Satoh ,  Mikio Yamaguchi ,  Masashi Takahashi

    发明人： Satoru Sugiyama ,  Toyoji Kanazawa ,  Tetsuo Satoh ,  Mikio Yamaguchi ,  Masashi Takahashi

    IPC分类号： B42D15/10 ,  G06K19/077 ,  H01L23/498 ,  H05K1/14 ,  H01L23/28

    CPC分类号： G06K19/07747 ,  G06K19/07728 ,  G06K19/07745 ,  H01L23/49855 ,  H01L24/48 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

    摘要： In an IC card in which an IC module constituted by a terminal plate 1 having a connection terminal pattern(3), arranged on a surface of an insulating substrate (2), for external power supply, signal connection, and grounding, an IC chip (4) mounted on the rear surface of the terminal plate 1 and electrically coupled to the connection terminal pattern (3), a sealing member (5) for the IC chip, and a reinforcing member (6) for reinforcing the sealing member (5) is mounted on a card base, the reinforcing member (6) consists of a conduction material, and integrally constituted by a ring portion (7) for covering the outer periphery of the sealing member (5) and a flange portion (8), having almost the same shape as that of the outer periphery of the terminal plate (1), for covering the rear surface of the insulating substrate (2). Therefore, an IC card which is strong to damage caused by disconnection of a bonding wire due to peeling between the insulating substrate and the sealing member caused by external force can be provided at low cost.

    摘要翻译： PCT No.PCT / JP98 / 04668 Sec。 371日期1999年5月18日 102（e）日期1999年5月18日PCT提交1998年10月15日PCT公布。 WO99 /​​ 21132 PCT出版物 日期1999年4月29日在IC卡中，IC模块由具有连接端子图案（3）的端子板1构成，布置在绝缘基板（2）的表面上，用于外部电源，信号连接和 接地，安装在端子板1的后表面并电耦合到连接端子图案（3）的IC芯片（4），用于IC芯片的密封构件（5）和用于增强的加强构件 密封件（5）安装在卡座上，加强件（6）由导电材料构成，并由用于覆盖密封件（5）的外周的环形部分（7）和凸缘 部分（8）具有与端子板（1）的外周几乎相同的形状，用于覆盖绝缘基板（2）的后表面。 因此，可以以低成本提供由于由外力引起的绝缘基板和密封构件之间的剥离导致的由接合线断开引起的损坏的IC卡。

    Process of producing IC cards
    3.
    发明授权
    Process of producing IC cards 失效
    生产IC卡的过程

    公开(公告)号：US6036797A

    公开(公告)日：2000-03-14

    申请号：US112446

    申请日：1993-08-26

    申请人： Toyoji Kanazawa ,  Shingo Ichikawa ,  Hiroyuki Kaneko ,  Hisataro Watada ,  Toshibumi Wakayama

    发明人： Toyoji Kanazawa ,  Shingo Ichikawa ,  Hiroyuki Kaneko ,  Hisataro Watada ,  Toshibumi Wakayama

    IPC分类号： G06K19/077 ,  B32B31/18 ,  B32B31/26

    CPC分类号： G06K19/07745 ,  H01L2924/0002 ,  Y10T156/1082

    摘要： A process of producing an IC card, the IC card having a card substrate and an IC module embedded therein, the card substrate having a single core sheet and first and second cover films laminated over the core sheet on the opposite sides, the process including the steps of forming an adhesive layer on the inside of each of the first and second cover films except a non-adhesive area in which the IC module is to be fitted; bonding the cover films to the opposite sides of the core sheet through the adhesive layers to form the card substrate having the non-adhesive area; cutting the non-adhesive areas of the card substrate along their outer peripheries to form a cavity for receiving the IC module; fitting the IC module into the cavity; andfixedly securing the IC module to the card substrate.

    摘要翻译： 一种IC卡的制造方法，具有卡片基板和嵌入其中的IC模块的IC卡，具有单芯片的卡片基板和在相对的两侧层压在芯片上的第一和第二覆盖膜，该处理包括 在所述第一和第二覆盖膜的每一个的内侧上形成粘合剂层的步骤，所述粘合剂层除了要安装所述IC模块的非粘合区域之外; 通过粘合剂层将覆盖膜粘合到芯片的相对侧，以形成具有非粘合区域的卡片基板; 沿其外周切割卡片基板的非粘合区域以形成用于接收IC模块的空腔; 将IC模块安装到空腔中; 并将IC模块固定地固定在卡片基板上。