摘要:
A method of holding a dried honeycomb structure 8, which is a honeycomb structure after a drying process and before a firing process, when a ceramic honeycomb structure in which bulkheads forming a number of cells are disposed in the form of a honeycomb is manufactured with a manufacturing method including a extruding process, the drying process, and the firing process. A chuck 1 having a plurality of claws 10 is used and the plurality of claws 10 are allowed to come into contact with an outer periphery 89 of the dried honeycomb structure 8 so that the direction of the pressure F applied to the dried honeycomb structure 8 by the claws is substantially parallel with the bulkheads 81.
摘要:
The present invention discloses a laminated sheet for packaging electronic components comprising a front surface layer, a center core layer and a rear surface layer, wherein the front surface layer and the rear surface layer each contains a rubber-modified styrenic copolymer (A) having a graft ratio of grafted rubber of 30 to 50%, a grafted rubber particle diameter of 0.1 to 0.5 μm and a butadiene content of 5 to 25% by weight, and polyetheresteramide (B), and the center core layer contains a rubber-modified styrenic copolymer (C) having a graft ratio of grafted rubber of 70 to 90%, a grafted rubber particle diameter of 0.4 to 1.0 μm, and a butadiene content of 5 to 15% by weight, and 5 to 50% by weight of a recycled material of this laminated sheet.
摘要:
Disclosed is a surface conductive laminated sheet which comprises a base material layer containing an ABS resin as a main component, and a surface layer laminated on the surface of at least one side of the base material layer. In the laminated sheet, the ABS resin in the base material layer includes a composition made of 5-15 mass % of vinyl cyanide monomer, 45-65 mass % of diene-based rubber, and 50-20 mass % of aromatic vinyl monomer, and includes a graft rubber having a graft rate of 50-80%. The graft rubber has a mass average molecular weight (Mw) of a graft chain of 18,000-56,000, and/or has a volume average particle diameter of 0.3 to 2.0 μm. By using the laminated sheet, it is possible to obtain an electronic part packaging container, such as carrier tape etc., which has extremely few punch burrs regardless of the type of forming apparatus when punched by means of a slit method or embossing.
摘要:
The present invention discloses a laminated sheet for packaging electronic components comprising a front surface layer, a center core layer and a rear surface layer, wherein the front surface layer and the rear surface layer each contains a rubber-modified styrenic copolymer (A) having a graft ratio of grafted rubber of 30 to 50%, a grafted rubber particle diameter of 0.1 to 0.5 μm and a butadiene content of 5 to 25% by weight, and polyetheresteramide (B), and the center core layer contains a rubber-modified styrenic copolymer (C) having a graft ratio of grafted rubber of 70 to 90%, a grafted rubber particle diameter of 0.4 to 1.0 μm, and a butadiene content of 5 to 15% by weight, and 5 to 50% by weight of a recycled material of this laminated sheet.
摘要:
Disclosed is a surface conductive laminated sheet which comprises a base material layer containing an ABS resin as a main component, and a surface layer laminated on the surface of at least one side of the base material layer. In the laminated sheet, the ABS resin in the base material layer includes a composition made of 5-15 mass % of vinyl cyanide monomer, 45-65 mass % of diene-based rubber, and 50-20 mass % of aromatic vinyl monomer, and includes a graft rubber having a graft rate of 50-80%. The graft rubber has a mass average molecular weight (Mw) of a graft chain of 18,000-56,000, and/or has a volume average particle diameter of 0.3 to 2.0 μm. By using the laminated sheet, it is possible to obtain an electronic part packaging container, such as carrier tape etc., which has extremely few punch burrs regardless of the type of forming apparatus when punched by means of a slit method or embossing.