Method of holding a dried honeycomb structure
    1.
    发明授权
    Method of holding a dried honeycomb structure 有权
    保持干燥的蜂窝结构的方法

    公开(公告)号:US06892436B2

    公开(公告)日:2005-05-17

    申请号:US10186726

    申请日:2002-07-02

    摘要: A method of holding a dried honeycomb structure 8, which is a honeycomb structure after a drying process and before a firing process, when a ceramic honeycomb structure in which bulkheads forming a number of cells are disposed in the form of a honeycomb is manufactured with a manufacturing method including a extruding process, the drying process, and the firing process. A chuck 1 having a plurality of claws 10 is used and the plurality of claws 10 are allowed to come into contact with an outer periphery 89 of the dried honeycomb structure 8 so that the direction of the pressure F applied to the dried honeycomb structure 8 by the claws is substantially parallel with the bulkheads 81.

    摘要翻译: 当将形成多个电池的隔壁的陶瓷蜂窝结构体以蜂窝状的形式设置时,保持作为蜂窝结构的干燥蜂窝结构体8的干燥处理之后和焙烧工序的方法, 制造方法包括挤出工艺,干燥过程和焙烧过程。 使用具有多个爪10的卡盘1,并且允许多个爪10与干燥的蜂窝结构体8的外周89接触,使得施加到干燥的蜂窝结构体8上的压力F的方向由 爪基本上与隔板81平行。

    Surface conductive laminated sheet and electronic part packaging container
    3.
    发明授权
    Surface conductive laminated sheet and electronic part packaging container 有权
    表面导电层压板和电子部件包装容器

    公开(公告)号:US08999470B2

    公开(公告)日:2015-04-07

    申请号:US13636906

    申请日:2011-03-18

    摘要: Disclosed is a surface conductive laminated sheet which comprises a base material layer containing an ABS resin as a main component, and a surface layer laminated on the surface of at least one side of the base material layer. In the laminated sheet, the ABS resin in the base material layer includes a composition made of 5-15 mass % of vinyl cyanide monomer, 45-65 mass % of diene-based rubber, and 50-20 mass % of aromatic vinyl monomer, and includes a graft rubber having a graft rate of 50-80%. The graft rubber has a mass average molecular weight (Mw) of a graft chain of 18,000-56,000, and/or has a volume average particle diameter of 0.3 to 2.0 μm. By using the laminated sheet, it is possible to obtain an electronic part packaging container, such as carrier tape etc., which has extremely few punch burrs regardless of the type of forming apparatus when punched by means of a slit method or embossing.

    摘要翻译: 公开了一种表面导电叠层片,其包括以ABS树脂为主要成分的基材层和层叠在基材层的至少一面的表面上的表层。 在层压片中,基材层中的ABS树脂包括由5-15质量%的乙烯基氰单体,45-65质量%的二烯系橡胶和50〜20质量%的芳香族乙烯基单体构成的组合物, 并且包括接枝率为50-80%的接枝橡胶。 接枝橡胶的接枝链的质均分子量(Mw)为18,000-56,000,和/或具有0.3-2.0μm的体积平均粒径。 通过使用层压片,可以获得一种电子部件包装容器,例如载带等,其具有非常少的冲压毛刺,而与通过狭缝法或压花冲压的成型装置的类型无关。

    SURFACE CONDUCTIVE LAMINATED SHEET AND ELECTRONIC PART PACKAGING CONTAINER
    5.
    发明申请
    SURFACE CONDUCTIVE LAMINATED SHEET AND ELECTRONIC PART PACKAGING CONTAINER 有权
    表面导电层压板和电子部件包装容器

    公开(公告)号:US20130017350A1

    公开(公告)日:2013-01-17

    申请号:US13636906

    申请日:2011-03-18

    IPC分类号: B32B1/02 B32B25/08 B32B25/16

    摘要: Disclosed is a surface conductive laminated sheet which comprises a base material layer containing an ABS resin as a main component, and a surface layer laminated on the surface of at least one side of the base material layer. In the laminated sheet, the ABS resin in the base material layer includes a composition made of 5-15 mass % of vinyl cyanide monomer, 45-65 mass % of diene-based rubber, and 50-20 mass % of aromatic vinyl monomer, and includes a graft rubber having a graft rate of 50-80%. The graft rubber has a mass average molecular weight (Mw) of a graft chain of 18,000-56,000, and/or has a volume average particle diameter of 0.3 to 2.0 μm. By using the laminated sheet, it is possible to obtain an electronic part packaging container, such as carrier tape etc., which has extremely few punch burrs regardless of the type of forming apparatus when punched by means of a slit method or embossing.

    摘要翻译: 公开了一种表面导电叠层片,其包括以ABS树脂为主要成分的基材层和层叠在基材层的至少一面的表面上的表层。 在层压片中,基材层中的ABS树脂包括由5-15质量%的乙烯基氰单体,45-65质量%的二烯系橡胶和50〜20质量%的芳香族乙烯基单体构成的组合物, 并且包括接枝率为50-80%的接枝橡胶。 接枝橡胶的接枝链的质均分子量(Mw)为18,000-56,000,和/或具有0.3-2.0μm的体积平均粒径。 通过使用层压片,可以获得一种电子部件包装容器,例如载带等,其具有非常少的冲压毛刺,而与通过狭缝法或压花冲压的成型装置的类型无关。