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    Surface conductive laminated sheet and electronic part packaging container
    2.
    发明授权
    Surface conductive laminated sheet and electronic part packaging container 有权
    表面导电层压板和电子部件包装容器

    公开(公告)号：US08999470B2

    公开(公告)日：2015-04-07

    申请号：US13636906

    申请日：2011-03-18

    申请人： Junpei Fujiwara ,  Masatoshi Kawata ,  Yasushi Miyamura

    发明人： Junpei Fujiwara ,  Masatoshi Kawata ,  Yasushi Miyamura

    IPC分类号： B29D22/00 ,  B29D23/00 ,  B32B1/08 ,  B65D39/00 ,  B32B27/30 ,  B32B25/14 ,  B32B27/20 ,  C08L25/12 ,  C08L51/04

    CPC分类号： B32B27/30 ,  B32B25/14 ,  B32B27/20 ,  B32B27/302 ,  B32B2264/108 ,  B32B2270/00 ,  B32B2307/202 ,  B32B2439/00 ,  B65D2585/86 ,  C08L25/12 ,  C08L51/04 ,  Y10T428/1386 ,  Y10T428/254 ,  Y10T428/31917

    摘要： Disclosed is a surface conductive laminated sheet which comprises a base material layer containing an ABS resin as a main component, and a surface layer laminated on the surface of at least one side of the base material layer. In the laminated sheet, the ABS resin in the base material layer includes a composition made of 5-15 mass % of vinyl cyanide monomer, 45-65 mass % of diene-based rubber, and 50-20 mass % of aromatic vinyl monomer, and includes a graft rubber having a graft rate of 50-80%. The graft rubber has a mass average molecular weight (Mw) of a graft chain of 18,000-56,000, and/or has a volume average particle diameter of 0.3 to 2.0 μm. By using the laminated sheet, it is possible to obtain an electronic part packaging container, such as carrier tape etc., which has extremely few punch burrs regardless of the type of forming apparatus when punched by means of a slit method or embossing.

    摘要翻译： 公开了一种表面导电叠层片，其包括以ABS树脂为主要成分的基材层和层叠在基材层的至少一面的表面上的表层。 在层压片中，基材层中的ABS树脂包括由5-15质量％的乙烯基氰单体，45-65质量％的二烯系橡胶和50〜20质量％的芳香族乙烯基单体构成的组合物， 并且包括接枝率为50-80％的接枝橡胶。 接枝橡胶的接枝链的质均分子量（Mw）为18,000-56,000，和/或具有0.3-2.0μm的体积平均粒径。 通过使用层压片，可以获得一种电子部件包装容器，例如载带等，其具有非常少的冲压毛刺，而与通过狭缝法或压花冲压的成型装置的类型无关。

    SURFACE CONDUCTIVE LAMINATED SHEET AND ELECTRONIC PART PACKAGING CONTAINER
    4.
    发明申请
    SURFACE CONDUCTIVE LAMINATED SHEET AND ELECTRONIC PART PACKAGING CONTAINER 有权
    表面导电层压板和电子部件包装容器

    公开(公告)号：US20130017350A1

    公开(公告)日：2013-01-17

    申请号：US13636906

    申请日：2011-03-18

    申请人： Junpei Fujiwara ,  Masatoshi Kawata ,  Yasushi Miyamura

    发明人： Junpei Fujiwara ,  Masatoshi Kawata ,  Yasushi Miyamura

    IPC分类号： B32B1/02 ,  B32B25/08 ,  B32B25/16

    CPC分类号： B32B27/30 ,  B32B25/14 ,  B32B27/20 ,  B32B27/302 ,  B32B2264/108 ,  B32B2270/00 ,  B32B2307/202 ,  B32B2439/00 ,  B65D2585/86 ,  C08L25/12 ,  C08L51/04 ,  Y10T428/1386 ,  Y10T428/254 ,  Y10T428/31917

    摘要： Disclosed is a surface conductive laminated sheet which comprises a base material layer containing an ABS resin as a main component, and a surface layer laminated on the surface of at least one side of the base material layer. In the laminated sheet, the ABS resin in the base material layer includes a composition made of 5-15 mass % of vinyl cyanide monomer, 45-65 mass % of diene-based rubber, and 50-20 mass % of aromatic vinyl monomer, and includes a graft rubber having a graft rate of 50-80%. The graft rubber has a mass average molecular weight (Mw) of a graft chain of 18,000-56,000, and/or has a volume average particle diameter of 0.3 to 2.0 μm. By using the laminated sheet, it is possible to obtain an electronic part packaging container, such as carrier tape etc., which has extremely few punch burrs regardless of the type of forming apparatus when punched by means of a slit method or embossing.

    摘要翻译： 公开了一种表面导电叠层片，其包括以ABS树脂为主要成分的基材层和层叠在基材层的至少一面的表面上的表层。 在层压片中，基材层中的ABS树脂包括由5-15质量％的乙烯基氰单体，45-65质量％的二烯系橡胶和50〜20质量％的芳香族乙烯基单体构成的组合物， 并且包括接枝率为50-80％的接枝橡胶。 接枝橡胶的接枝链的质均分子量（Mw）为18,000-56,000，和/或具有0.3-2.0μm的体积平均粒径。 通过使用层压片，可以获得一种电子部件包装容器，例如载带等，其具有非常少的冲压毛刺，而与通过狭缝法或压花冲压的成型装置的类型无关。

    ELECTRONIC COMPONENT PACKAGING SHEET, AND FORMED ARTICLE THEREOF
    6.
    发明申请
    ELECTRONIC COMPONENT PACKAGING SHEET, AND FORMED ARTICLE THEREOF 审中-公开
    电子元件包装片及其制品

    公开(公告)号：US20130209748A1

    公开(公告)日：2013-08-15

    申请号：US13877742

    申请日：2011-10-06

    申请人： Junpei Fujiwara ,  Tomohiro Osawa ,  Masatoshi Kawata

    发明人： Junpei Fujiwara ,  Tomohiro Osawa ,  Masatoshi Kawata

    IPC分类号： C08L25/06

    CPC分类号： C08L25/06 ,  B65D73/02 ,  B65D2213/02 ,  C08L33/04 ,  C08L53/02 ,  C08L2203/16 ,  C08L2205/02 ,  C08L2205/16 ,  H01B1/20 ,  H05K13/0084 ,  Y10T428/24612 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/31533 ,  Y10T428/31913 ,  Y10T428/31917 ,  C08L81/00

    摘要： Disclosed is an electronic component packaging sheet including a surface conductive layer formed on the surface of at least one side of a substrate sheet. The substrate sheet includes 80,000 to 220,000 Mw of a styrene-conjugated diene block copolymer; 200,000 to 400,000 Mw of a polystyrene resin; and 150,000 to 210,000 Mw of an impact resistant polystyrene resin. The surface conductive layer includes an acrylic copolymer resin; and carbon nanotubes. The electronic component packaging sheet is a transparent conductive sheet having excellent thermoforming properties, good transparency after thermoforming, and sufficient electrostatic diffusion performance to maintain a low surface resistance value. The electronic component packaging sheet is particularly suited for the manufacture of embossed carrier tape.

    摘要翻译： 公开了一种电子部件包装片，其包括在基板的至少一侧的表面上形成的表面导电层。 基材片含有苯乙烯 - 共轭二烯嵌段共聚物的80,000〜220,000Mw; 聚苯乙烯树脂20万〜40万Mw; 和150,000至210,000MW的耐冲击聚苯乙烯树脂。 表面导电层包括丙烯酸共聚物树脂; 和碳纳米管。 电子部件包装片是具有优异的热成型性，热成型后的良好的透明性以及足够的静电扩散性能以维持低的表面电阻值的透明导电片。 电子部件包装片材特别适用于压花载带的制造。

    ELECTRONIC COMPONENT PACKAGING SHEET, AND FORMED ARTICLE THEREOF
    7.
    发明申请
    ELECTRONIC COMPONENT PACKAGING SHEET, AND FORMED ARTICLE THEREOF 审中-公开
    电子元件包装片及其制品

    公开(公告)号：US20130189496A1

    公开(公告)日：2013-07-25

    申请号：US13877750

    申请日：2011-10-06

    申请人： Junpei Fujiwara ,  Tomohiro Osawa ,  Masatoshi Kawata

    发明人： Junpei Fujiwara ,  Tomohiro Osawa ,  Masatoshi Kawata

    IPC分类号： H01B1/20

    CPC分类号： C08L25/06 ,  B65D73/02 ,  B65D2213/02 ,  C08L33/04 ,  C08L53/02 ,  C08L2203/16 ,  C08L2205/02 ,  C08L2205/16 ,  H01B1/20 ,  H05K13/0084 ,  Y10T428/24612 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/31533 ,  Y10T428/31913 ,  Y10T428/31917 ,  C08L81/00

    摘要： Disclosed is an electronic component packaging sheet including a surface conductive layer formed on the surface of at least one side of a substrate sheet. The substrate sheet includes (A) 80,000 to 220,000 Mw of a styrene-conjugated diene block copolymer; (B) 200,000 to 400,000 Mw of a polystyrene resin; and (C) 150,000 to 210,000 Mw of an impact resistant polystyrene resin. The surface conductive layer includes (D) an acrylic copolymer resin; and (E) a polythiophene type polymer, particularly a polythiophene type polymer/anionic polymer ion complex. The electronic component packaging sheet is a transparent conductive sheet having excellent thermoforming properties, good transparency after thermoforming, and sufficient electrostatic diffusion performance to maintain a low surface resistance value. The electronic component packaging sheet is particularly suited for the manufacture of embossed carrier tape.

    摘要翻译： 公开了一种电子部件包装片，其包括在基板的至少一侧的表面上形成的表面导电层。 基材片包含（A）苯乙烯 - 共轭二烯嵌段共聚物80,000至220,000MW; （B）聚苯乙烯树脂20万〜40万Mw; 和（C）150,000至210,000MW的耐冲击聚苯乙烯树脂。 表面导电层包括（D）丙烯酸共聚物树脂; 和（E）聚噻吩型聚合物，特别是聚噻吩型聚合物/阴离子聚合物离子络合物。 电子部件包装片是具有优异的热成型性，热成型后的良好的透明性以及足够的静电扩散性能以维持低的表面电阻值的透明导电片。 电子部件包装片材特别适用于压花载带的制造。

    Electronic component packaging sheet, and formed article thereof
    8.
    发明授权
    Electronic component packaging sheet, and formed article thereof 有权

    公开(公告)号：US10202506B2

    公开(公告)日：2019-02-12

    申请号：US13877750

    申请日：2011-10-06

    申请人： Junpei Fujiwara ,  Tomohiro Osawa ,  Masatoshi Kawata

    发明人： Junpei Fujiwara ,  Tomohiro Osawa ,  Masatoshi Kawata

    IPC分类号： H01B1/20 ,  C08L25/06 ,  B65D73/02 ,  H05K13/00 ,  C08L33/04 ,  C08L53/02

    摘要： Disclosed is an electronic component packaging sheet including a surface conductive layer formed on the surface of at least one side of a substrate sheet. The substrate sheet includes (A) 80,000 to 220,000 Mw of a styrene-conjugated diene block copolymer; (B) 200,000 to 400,000 Mw of a polystyrene resin; and (C) 150,000 to 210,000 Mw of an impact resistant polystyrene resin. The surface conductive layer includes (D) an acrylic copolymer resin; and (E) a polythiophene type polymer, particularly a polythiophene type polymer/anionic polymer ion complex. The electronic component packaging sheet is a transparent conductive sheet having excellent thermoforming properties, good transparency after thermoforming, and sufficient electrostatic diffusion performance to maintain a low surface resistance value. The electronic component packaging sheet is particularly suited for the manufacture of embossed carrier tape.

    STYRENE RESIN COMPOSITION, AND MOLDED ARTICLE THEREOF
    9.
    发明申请
    STYRENE RESIN COMPOSITION, AND MOLDED ARTICLE THEREOF 有权
    苯乙烯树脂组合物及其成型品

    公开(公告)号：US20130209742A1

    公开(公告)日：2013-08-15

    申请号：US13877707

    申请日：2011-10-06

    申请人： Junpei Fujiwara ,  Masatoshi Kawata

    发明人： Junpei Fujiwara ,  Masatoshi Kawata

    IPC分类号： C08L25/06 ,  C08L53/02

    CPC分类号： C08L25/06 ,  B65D73/02 ,  C08J5/18 ,  C08J2325/06 ,  C08J2353/02 ,  C08J2425/06 ,  C08J2451/04 ,  C08J2453/02 ,  C08L53/02 ,  Y10T428/1352 ,  Y10T428/1372 ,  Y10T428/1397 ,  Y10T428/24479 ,  C08L51/04

    摘要： Provided are a styrene resin composition for use in electronic component packaging such as embossed carrier tape, a sheet which has a large drawing ratio (pocket depth) and in which pockets exhibiting superior transparency and strength and can be thermoformed, and a carrier tape which is thermoformed from the sheet and which allows the verification of letters and the like formed on packaged electronic components from outside the pockets. The electronic component packaging sheet includes: (A) 29-65 mass parts of a styrene-conjugated diene block copolymer; (B) 51-15 mass parts of a polystyrene resin; and (C) 20-9 mass parts of an impact resistant polystyrene resin. Components (A)-(C) each have a weight average molecular weight within a specified range.

    摘要翻译： 提供一种用于电子部件包装的苯乙烯树脂组合物，例如压花载带，具有大拉伸比（袋深度）的片材，其中显示出优异的透明度和强度并且可以被热成型的袋子，以及载带 从片材热成型，并且允许从口袋外部验证在封装的电子部件上形成的字母等。 电子部件包装片包括：（A）29-65质量份的苯乙烯 - 共轭二烯嵌段共聚物; （B）51-15质量份聚苯乙烯树脂; 和（C）20-9质量份抗冲击聚苯乙烯树脂。 组分（A） - （C）各自具有在指定范围内的重均分子量。

    SHEET FOR PACKAGING ELECTRONIC PART
    10.
    发明申请
    SHEET FOR PACKAGING ELECTRONIC PART 审中-公开
    包装电子部件的表格

    公开(公告)号：US20110008561A1

    公开(公告)日：2011-01-13

    申请号：US12810719

    申请日：2008-12-25

    申请人： Hirokazu Kawauchi ,  Masatoshi Kawata ,  Takayuki Ando ,  Yasuhiro Arai

    发明人： Hirokazu Kawauchi ,  Masatoshi Kawata ,  Takayuki Ando ,  Yasuhiro Arai

    IPC分类号： B65D85/86 ,  B65D65/02 ,  B29C51/00 ,  B29D7/00

    CPC分类号： C08J5/18 ,  C08J2325/06 ,  C08L25/06 ,  C08L53/02 ,  C08L2205/02 ,  H05K13/0084 ,  Y10T428/1397 ,  Y10T428/24479 ,  C08L2666/02

    摘要： [Problems] Provided is a novel sheet for packaging electronic parts which is excellent in transparency and suitability for thickness reduction.[Means for solving Problems] The sheet for packaging electronic parts is one obtained by biaxially drawing a styrene resin composition comprising 7 to 99.5 mass % of a polystyrene resin (A), 0.5 to 3 mass % of a high-impact polystyrene resin (B) which has a rubber content of 4 to 10 mass %, and 0 to 92.5 mass % styrene-conjugated diene block copolymer (C) wherein the molecular weight of the styrene block part is at least 10,000 and less than 130,000. This sheet has a thickness of 0.1 to 0.7 mm and an orientation release stress value as measured in conformity with ASTM D-1504 of 0.2 to 0.8 MPa.

    摘要翻译： [问题]提供一种用于包装电子部件的新颖的片材，其透明性优异且适合于厚度减少。 解决问题的手段电子部件的包装用片材是通过双轴拉伸含有聚苯乙烯类树脂（A）7〜99.5质量％，耐冲击性聚苯乙烯树脂（B）0.5〜3质量％）的苯乙烯系树脂组合物 ）和橡胶含量为4〜10质量％的苯乙烯 - 共轭二烯嵌段共聚物（C）为0〜92.5质量％，苯乙烯嵌段部分的分子量为1万以上且小于13万。 该片材的厚度为0.1〜0.7mm，根据ASTM D-1504测定的取向剥离应力值为0.2〜0.8MPa。