SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD
    9.
    发明申请
    SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD 失效
    基板处理装置和基板处理方法

    公开(公告)号:US20090242517A1

    公开(公告)日:2009-10-01

    申请号:US12410049

    申请日:2009-03-24

    IPC分类号: B08B3/02 C03C15/00 C23F1/00

    CPC分类号: H01L21/67051 H01L21/67057

    摘要: A substrate treating apparatus for performing a predetermined treatment of substrates with a treating liquid. The apparatus includes a treating tank for storing the treating liquid; a lifter having holding elements for holding the substrates, and vertically movable between a standby position above the treating tank and a treating position inside the treating tank; lower nozzles arranged on opposite sides at a bottom of the treating tank for supplying the treating liquid; upper nozzles arranged above the lower nozzles for supplying the treating liquid toward the holding elements of the lifter; and a control device for controlling a flow ratio of the treating liquid between the upper nozzles and the lower nozzles according to the treatment.

    摘要翻译: 一种用处理液进行基板的预定处理的基板处理装置。 该装置包括用于储存处理液的处理槽; 具有用于保持基板的保持元件的升降器,并且能够在处理槽上方的备用位置与处理槽内的处理位置之间垂直移动; 在处理槽的底部设置在相对侧的下喷嘴,用于供给处理液; 上喷嘴布置在下喷嘴上方,用于将处理液朝向提升器的保持元件供应; 以及控制装置,用于根据处理来控制上喷嘴和下喷嘴之间的处理液的流量比。