摘要:
A radiation sensitive material comprising a copolymer including itaconic anhydride and methods of using such radiation sensitive materials in methods for forming a pattern.
摘要:
A copolymer expressed by the following structural formula ##STR1## was obtained by loading adamantyl methacrylate monomer and t-butyl acrylate monomer by 1:1, then conducting polymerization, adding AIBN as a polymerization initiator, and then conducting precipitation purification with methanol. Then to the copolymer, triphenylsulfonium hexafluoroantimonate was added to prepare a cyclohexanone solution. This solution was applied to a wafer, and exposed to a KrF excimer stepper and developed. The threshold energy Eth was 50 mJ/cm.sup.2. A 0.45 .mu.m-wide L & S was formed at 130 mJ/cm.sup.2. The radiation sensitive material has good transparency and etching resistance, high sensitivity, and little peeling.
摘要翻译:通过将甲基丙烯酸金刚烷酯单体和丙烯酸叔丁酯单体以1:1的比例加载,然后进行聚合,加入AIBN作为聚合引发剂,然后用甲醇进行沉淀纯化,得到由以下结构式表示的共聚物。 然后向共聚物中加入三苯基锍六氟锑酸盐以制备环己酮溶液。 将该溶液施加到晶片上,暴露于KrF准分子步进机并显影。 阈值能量Eth为50mJ / cm 2。 以130mJ / cm 2形成0.45μm宽的L&S。 辐射敏感材料具有良好的透明度和耐蚀刻性,灵敏度高,剥离少。
摘要:
A radiation sensitive composition comprising a copolymer having a structural unit of (me)acrylonitrile and a structural unit generating an alkali soluble group and a substance generating an acid by application of radiation.
摘要:
A copolymer expressed by the following structural formula was obtained by loading adamantyl methacrylate monomer and t-butyl acrylate monomer by 1:1, then conducting polymerization, adding AIBN as a polymerization initiator, and then conducting precipitation purification with methanol. Then to the copolymer, triphenylsulfonium hexafluoroantimonate was added to prepare a cyclohexanone solution. This solution was applied to a wafer, and exposed to a KrF excimer stepper and developed. The threshold energy Eth was 50 mJ/cm2. A 0.45 μm-wide L & S was formed at 130 mJ/cm2. The radiation sensitive material has good transparency and etching resistance, high sensitivity, and little peeling.
摘要翻译:通过将甲基丙烯酸金刚烷酯单体和丙烯酸叔丁酯单体以1:1的比例加载,然后进行聚合,加入AIBN作为聚合引发剂,然后用甲醇进行沉淀纯化,得到由以下结构式表示的共聚物。 然后向共聚物中加入三苯基锍六氟锑酸盐以制备环己酮溶液。 将该溶液施加到晶片上,暴露于KrF准分子步进机并显影。 阈值能量Eth为50mJ / cm 2。 在130mJ / cm 2下形成0.45μm的L&S。 辐射敏感材料具有良好的透明度和耐蚀刻性,灵敏度高,剥离少。
摘要:
A copolymer expressed by the following structural formula was obtained by loading adamantyl methacrylate monomer and t-butyl acrylate monomer by 1:1, then conducting polymerization, adding AIBN as a polymerization initiator, and then conducting precipitation purification with methanol. Then to the copolymer, triphenylsulfonium hexafluoroantimonate was added to prepare a cyclohexanone solution. This solution was applied to a wafer, and exposed to a KrF excimer stepper and developed. The threshold energy Eth was 50 mJ/cm2. A 0.45 μm-wide L & S was formed at 130 mJ/cm2. The radiation sensitive material has good transparency and etching resistance, high sensitivity, and little peeling.
摘要翻译:通过将甲基丙烯酸金刚烷酯单体和丙烯酸叔丁酯单体以1:1的比例加载,然后进行聚合,加入AIBN作为聚合引发剂,然后用甲醇进行沉淀纯化,得到由以下结构式表示的共聚物。 然后向共聚物中加入三苯基锍六氟锑酸盐以制备环己酮溶液。 将该溶液施加到晶片上,暴露于KrF准分子步进机并显影。 阈值能量Eth为50mJ / cm 2。 在130mJ / cm 2下形成0.45μm的L&S。 辐射敏感材料具有良好的透明度和耐蚀刻性,灵敏度高,剥离少。
摘要:
A copolymer expressed by the following structural formula was obtained by loading adamantyl methacrylate monomer and t-butyl acrylate monomer by 1:1, then conducting polymerization, adding AIBN as a polymerization initiator, and then conducting precipitation purification with methanol. Then to the copolymer, triphenylsulfonium hexafluoroantimonate was added to prepare a cyclohexanone solution. This solution was applied to a wafer, and exposed to a KrF excimer stepper and developed. The threshold energy Eth was 50 mJ/cm2. A 0.45 μm-wide L & S was formed at 130 mJ/cm2. The radiation sensitive material has good transparency and etching resistance, high sensitivity, and little peeling.
摘要:
A pattern formation material capable of keeping dimensional accuracy of a pattern at a desired level even after a polymer is left standing for a long time after exposure and before baking, and a method of forming such a pattern formation material, which comprises a copolymer containing units containing a polycyclic aromatic ring, a condensed ring having at least one aromatic ring, or an aromatic ring having, as a substitution group, an alicyclic group, a branched alkyl or a halogen, and units from a monomer containing a photosensitive group, and a compound generating an acid by irradiation to ultraviolet rays.
摘要:
Improved chemically amplified resist is provided that comprises 100 parts by weight of a copolymer produced from a first monomer unit having a recurrent acid labile pendant group that changes the polarity of the polymer and a second monomer unit having an alkali-soluble group and 1 to 20 parts by weight of a photo acid generator.
摘要:
An exposure technique which accomplishes high transparency and the prevention of influence of reflected light in the ultraviolet region of KrF excimer laser light, the technique being capable of decreasing reflected light by employing a base polymer having high transparency in the ultraviolet region and by employing a bleaching agent in combination with a photo acid generator, the bleaching agent being capable of preventing the formation of eaves in an upper portion of a resist pattern.
摘要:
Alkali-developable, chemically amplified resist composition which comprises an alkali-insoluble, film-forming compound having a structural unit containing a protected alkali-soluble group in which unit a protective moiety of said protected alkali-soluble group is cleaved upon action of an acid generated from a photoacid generator used in combination with said compound, thereby releasing a protective moiety from the alkali-soluble group and converting said compound to an alkali-soluble one, and a photoacid generator capable of being decomposed upon exposure to a patterning radiation to thereby produce an acid capable of causing cleavage of said protective moiety. The resist composition is particularly suitable for excimer laser lithography using an alkaline developer, and the formed resist patterns can exhibit a high sensitivity and excellent dry etch resistance without swelling.