摘要:
A method for creating regular triangular grid representations of a solid surface from a representation comprised of a plurality of polygons. Such a regular grid is necessary in order to accurately deform a solid during simulation of a process step. The method of the preferred embodiment is comprised generally of the steps of: removing any holes defined by the polygon face; placing a new edge between a first and second vertex of the polygon face; discarding the new edge if the new edge lies outside the polygon face or if the new edge intersects an existing edge of the polygon face; adding the new edge to the polygon face if the new edge does not lie outside the polygon face; identifying a triangle being created by the new edge and existing edges of the polygon; forming a new polygon face from the edges creating a triangle; and repeating the above steps until all polygon faces are triangulated. Once the triangulation of the polygons is completed, adjustments to the triangles is made in order to have only triangles of uniform size.
摘要:
A method for accurately calculating the movement of a vertex in a three-dimensional (3-D) topography simulator. The method is particularly suited for calculating vertex movement for cases in which etch/deposition rate depends on the angle between the surface normal and the vertical direction. A workpiece is represented as a collection of material solids. Each of the material solids has a boundary model representation. The method of the present invention is comprised primarily of the steps of: advancing edges and surface planes adjacent to the vertex, creating a set of 2-D solutions by clipping with pairs of adjacent surface planes; creating a set of combined 2-D solutions by clipping invalid sections of combined 2-D solutions; construct an arbitrary vertical plane that intersects the surface at the vertex point; constructing vertex trajectories for the vertex to be moved; and clipping constructed vertex trajectories at intersections of created surface and the constructed vertical plane.
摘要:
A method for efficient calculation of the movement of a vertex in a three-dimensional topography simulator. The method is particularly well suited for calculating vertex movement for cases in which an etch/deposition rate depends on the angle between the surface normal and the vertical direction. A workpiece is represented as a collection of material solids. Each of the material solids has a boundary model representation, which include vertices, edges and faces. The method of the present invention generally includes the steps of: identifying a first plane, a second plane and a third plane that approximate all the planes that are adjacent to a vertex point to be moved; determining a first observation vector; creating a set of advanced virtual planes; identifying a second observation vector; determining the furthest intersection point of one of the planes in the set of advanced planes and the second observation vector; and moving the vertex to the point identified in the prior step.
摘要:
An information processing apparatus comprises: a data determination unit configured to determine, using first received data as a reference, whether to add another received data to processing in a single job; a size determination unit configured, when the data determination unit determines to add the other received data in a bookbinding mode in which a plurality of bound products are generated by a single job, to regard, as single tentative image data, a plurality of image data which are generated from different received data and laid out on a single sheet of paper, and to determine whether the single tentative image data fits in the sheet of paper; and a job generation unit configured to generate a job for at least one received data corresponding to image data contained in the single tentative image data determined by the size determination unit to fit in the sheet of paper.
摘要:
According to one embodiment, a playback apparatus includes a generator, a corrector, and an audio signal output module. The generator is configured to generate correction data used for correcting a frequency characteristic of sound output from a headphone based on first data and second data, the first data indicating the frequency characteristic of sound output from the headphone, and the second data indicating a target frequency characteristic. The corrector is configured to correct audio data based on the correction data. The audio signal output module is configured to output an audio signal based on the corrected audio data to the headphone.
摘要:
A printing control apparatus controls an order of processing executed by a printing apparatus for print jobs included in a first print job group and print jobs included in a second print job group. A detection unit detects a first and second print job included in the first print job group, wherein the second print job has common paper information with the first print job. A control unit arranges processing orders of the detected first and second print jobs to be successive to each other, and arranges a processing order, within the second print job group, of a third print job, which is included in the second print job group and is grouped by a predetermined category together with the first print job, to be equivalent to the processing order of the first print job within the first print job group.
摘要:
An information processing apparatus comprises: a data determination unit configured to determine, using first received data as a reference, whether to add another received data to processing in a single job; a size determination unit configured, when the data determination unit determines to add the other received data in a bookbinding mode in which a plurality of bound products are generated by a single job, to regard, as single tentative image data, a plurality of image data which are generated from different received data and laid out on a single sheet of paper, and to determine whether the single tentative image data fits in the sheet of paper; and a job generation unit configured to generate a job for at least one received data corresponding to image data contained in the single tentative image data determined by the size determination unit to fit in the sheet of paper.
摘要:
An audio signal compensation device includes: a signal processor configured to perform filtering on an input audio signal; a filter coefficients storage module configured to store a plurality of filter coefficients; a user interface configured to provide options for a determination of filter coefficients to a user and to obtain a selection result from the user; and a filter coefficients determining module configured to determine a set of filter coefficients among the plurality of filter coefficients based on the selection result. The options for the determination of filter coefficients are produced by selecting a first filter coefficient and a second filter coefficient from the plurality of filter coefficients, the first filter coefficient corresponding to a first characteristic quantity of external auditory canal characteristics, the second filter coefficient corresponding to a second characteristic quantity of the external auditory canal characteristics which is predicted based on the first characteristic quantity.
摘要:
According to one embodiment, a sound processor includes a creating module, a filter, and a combining module. The creating module creates a plurality of first acoustic models based on a frequency characteristic that represents an acoustic property of an object to be measured. The first acoustic models are modeled with respect to resonance properties that vary depending on frequency bands. The filter extracts frequency components in the frequency bands from the respective first acoustic models. The combining module combines the frequency components extracted from the first acoustic models to create a second acoustic model.
摘要:
A semiconductor device, includes: a semiconductor substrate of 100 micrometers or less in thickness; an electrode pattern formed above the semiconductor substrate; and an insulation film of 50 micrometers or greater in thickness residing on parts of the upper surface side of the semiconductor substrate other than at least on the electrode pattern. And a method of manufacturing a semiconductor device, includes: forming elements on a semiconductor substrate; forming electrodes in a predetermined part on the elements; affixing an insulator sheet of 50 micrometers or greater in thickness to the upper surface side of the semiconductor substrate, the insulator sheet being processed to remove some parts so as to be aligned with the electrodes or regions where the elements are provided, processing a back surface side of the semiconductor substrate affixed within the insulator sheet to form the semiconductor substrate of 100 micrometers or lower in thickness, and dicing the semiconductor substrate into semiconductor chips.