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18 条记录 (耗时 0.02 秒)

    Sintered grooved wick with particle web
    1.
    发明授权
    Sintered grooved wick with particle web 失效
    烧结槽芯与颗粒网

    公开(公告)号：US07013958B2

    公开(公告)日：2006-03-21

    申请号：US11128454

    申请日：2005-05-13

    申请人： Scott D. Garner ,  James E. Lindemuth ,  Jerome E. Toth ,  John H. Rosenfeld ,  Kenneth G. Minnerly

    发明人： Scott D. Garner ,  James E. Lindemuth ,  Jerome E. Toth ,  John H. Rosenfeld ,  Kenneth G. Minnerly

    IPC分类号： F28D15/00

    CPC分类号： F28D15/046 ,  F28D15/0233 ,  Y10T29/49353

    摘要： A grooved sintered wick for a heat pipe is provided having a plurality of individual particles which together yield an average particle diameter. The grooved sintered wick further includes at least two adjacent lands that are in fluid communication with one another through a particle layer disposed between the lands where the particle layer comprises at least one dimension that is no more than about six average particle diameters. A heat pipe is also provided comprising a grooved wick that includes a plurality of individual particles having an average diameter. The grooved wick includes at least two adjacent lands that are in fluid communication with one another through a particle layer disposed between the lands that comprises less than about six average particle diameters. A method for making a heat pipe wick in accordance with the foregoing structures is also provided.

    摘要翻译： 提供了一种用于热管的开槽烧结芯，其具有多个单独的颗粒，它们共同产生平均粒径。 带槽的烧结芯还包括至少两个相邻的焊盘，它们通过设置在焊盘之间的颗粒层彼此流体连通，其中颗粒层包括至少一个不超过约六个平均粒径的尺寸。 还提供了一种热管，其包括具有平均直径的多个单独颗粒的带槽芯。 带槽的芯包括至少两个相邻的焊盘，它们通过设置在焊盘之间的颗粒层彼此流体连通，所述颗粒层包括小于约六个平均粒径。 还提供了一种根据上述结构制作热管芯的方法。

    Heat dissipating computer case having oriented fibers and heat pipe
    2.
    发明授权
    Heat dissipating computer case having oriented fibers and heat pipe 失效
    具有定向纤维和热管的散热计算机外壳

    公开(公告)号：US5818693A

    公开(公告)日：1998-10-06

    申请号：US780858

    申请日：1997-01-09

    申请人： Scott D. Garner ,  Jerome E. Toth

    发明人： Scott D. Garner ,  Jerome E. Toth

    IPC分类号： G06F1/16 ,  G06F1/20 ,  H05K7/20

    CPC分类号： G06F1/203

    摘要： The apparatus is a cooling structure for laptop computers, in which the heat is transferred to a heat pipe in the cover of the case behind the display screen. The heat pipe behind the screen is interconnected with the external wall of the cover by a holding fixture which, preferably, is integrated into the cover wall during manufacture. The cover is specially constructed with high thermal conductivity carbon fibers which are oriented to preferentially conduct heat from the heat pipe to the cover and to spread the heat over the entire external surface of the cover for dissipation into the environment.

    摘要翻译： 该装置是用于膝上型计算机的冷却结构，其中热量传递到显示屏幕后面的壳体的热管中。 屏幕后面的热管通过保持夹具与盖的外壁互连，保持夹具优选地在制造期间被整合到盖壁中。 该盖特别构造有高导热碳纤维，其被定向成优先地将热量从热管传导到盖并且将热量散布在盖的整个外表面上以便耗散到环境中。

    Heat pipes inserted into first and second parallel holes in a block for transferring heat between hinged devices
    4.
    发明授权
    Heat pipes inserted into first and second parallel holes in a block for transferring heat between hinged devices 失效
    插入块中的第一和第二平行孔中的热管在铰链装置之间传递热量

    公开(公告)号：US5822187A

    公开(公告)日：1998-10-13

    申请号：US735191

    申请日：1996-10-25

    申请人： Scott D. Garner ,  George A. Meyer, IV ,  Jerome E. Toth ,  Richard W. Longsderff

    发明人： Scott D. Garner ,  George A. Meyer, IV ,  Jerome E. Toth ,  Richard W. Longsderff

    IPC分类号： F28D15/02 ,  G06F1/16 ,  G06F1/20 ,  H05K7/20

    CPC分类号： G06F1/203 ,  F28D15/02

    摘要： The apparatus is a device for transferring heat across the hinged joint between the two sections of the case of a laptop computer. Two simple heat pipe cylinders are inserted into parallel cylindrical holes in a heat conductive block. One cylinder is bonded within its hole, and the other cylinder is permitted to rotate within its hole. The axis of the rotatable cylinder is located in line with the axis of the mechanical hinges which permit the panels to pivot relative to each other. A heat producing device in one panel can be then attached to one heat pipe, and a heat sink on the other panel can be attached to the other heat pipe. The heat transfer between the heat source and the heat sink is essentially that of a heat pipe except for the very short heat conductive path through the solid block and the one rotating joint.

    摘要翻译： 该装置是用于将热量传递到膝上型计算机的壳体的两个部分之间的铰链接头的装置。 两个简单的热管筒被插入到导热块的平行圆柱形孔中。 一个气缸在其孔内结合，另一个气缸允许在其孔内旋转。 可旋转圆柱体的轴线与允许面板相对于彼此枢转的机械铰链的轴线成一直线。 然后将一个面板中的发热装置连接到一个热管，另一个面板上的散热器可以附接到另一个热管。 热源和散热器之间的热传递基本上是热管的传热，除了通过固体块和一个旋转接头的非常短的导热路径。

    Thermal management system and method for electronics system
    6.
    发明授权
    Thermal management system and method for electronics system 失效
    电子系统热管理系统及方法

    公开(公告)号：US07071408B2

    公开(公告)日：2006-07-04

    申请号：US11218747

    申请日：2005-09-02

    申请人： Scott D. Garner

    发明人： Scott D. Garner

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20681 ,  H05K7/20809 ,  H05K7/20818

    摘要： A thermal energy management system is provided having a heat spreading device that is operatively engaged with at least one semiconductor chip and a thermal bus operatively engaged with the heat spreading device so as to transport thermal energy from the heat spreading device to a heat sink. The heat spreading device includes a heat pipe and the thermal bus includes a loop thermosyphon. A second thermal bus may be operatively engaged with the first-thermal bus so as to transport thermal energy from the first thermal bus to a heat sink. The second thermal bus may also include a loop thermosyphon. A method of managing thermal energy in an electronic system is also provided that includes spreading thermal energy generated by one or more devices over a surface that is relatively larger than the devices, thermally coupling an evaporator portion of a loop thermosyphon to the surface, and thermally coupling a condensing portion of the loop thermosyphon to a thermal energy sink, e.g., a second loop thermosyphon, convection fin, or cold plate.

    摘要翻译： 提供了一种热能管理系统，其具有与至少一个半导体芯片可操作地接合的散热装置和与散热装置可操作地接合的热母线，以将热能从散热装置输送到散热器。 散热装置包括热管，热量总线包括环形热虹吸管。 第二热母线可以与第一热母线可操作地接合，以将热能从第一热母线传输到散热器。 第二热量总线还可以包括环路虹吸管。 还提供了一种在电子系统中管理热能的方法，其包括将一个或多个装置产生的热能扩散到比装置相对较大的表面上，将环形热虹吸管的蒸发器部分热耦合到表面，以及热 将环形热虹吸管的冷凝部分耦合到热能吸收器，例如第二回路热虹吸管，对流翅片或冷板。

    Thermal management system and method for electronics system
    7.
    发明授权
    Thermal management system and method for electronics system 有权
    电子系统热管理系统及方法

    公开(公告)号：US06657121B2

    公开(公告)日：2003-12-02

    申请号：US10180166

    申请日：2002-06-26

    申请人： Scott D. Garner

    发明人： Scott D. Garner

    IPC分类号： H05K720

    CPC分类号： H05K7/20681 ,  H05K7/20809 ,  H05K7/20818

    摘要： A thermal energy management system is provided having a heat spreading device that is operatively engaged with at least one semiconductor chip and a thermal bus operatively engaged with the heat spreading device so as to transport thermal energy from the heat spreading device to a heat sink. The heat spreading device includes a heat pipe and the thermal bus includes a loop thermosyphon. A second thermal bus may be operatively engaged with the first thermal bus so as to transport thermal energy from the first thermal bus to a heat sink. The second thermal bus may also include a loop thermosyphon. A method of managing thermal energy in an electronic system is also provided that includes spreading thermal energy generated by one or more devices over a surface that is relatively larger than the devices, thermally coupling an evaporator portion of a loop thermosyphon to the surface, and thermally coupling a condensing portion of the loop thermosyphon to a thermal energy sink, e.g., a second loop thermosyphon, convection fin, or cold plate.

    摘要翻译： 提供了一种热能管理系统，其具有与至少一个半导体芯片可操作地接合的散热装置和与散热装置可操作地接合的热母线，以将热能从散热装置输送到散热器。 散热装置包括热管，热量总线包括环形热虹吸管。 第二热母线可以与第一热母线可操作地接合，以将热能从第一热母线传输到散热器。 第二热量总线还可以包括环路虹吸管。 还提供了一种在电子系统中管理热能的方法，其包括将一个或多个装置产生的热能扩散在相对大于装置的表面上，将环形热虹吸管的蒸发器部分热耦合到表面，以及热 将环形热虹吸管的冷凝部分耦合到热能吸收器，例如第二回路热虹吸管，对流翅片或冷板。

    Semiconductor package with internal heat spreader
    8.
    发明授权
    Semiconductor package with internal heat spreader 有权
    半导体封装带内部散热器

    公开(公告)号：US06437437B1

    公开(公告)日：2002-08-20

    申请号：US09753893

    申请日：2001-01-03

    申请人： Jon Zuo ,  Scott D. Garner

    发明人： Jon Zuo ,  Scott D. Garner

    IPC分类号： H01L2310

    CPC分类号： H01L23/427 ,  F28D15/0233 ,  F28D15/046 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/16152 ,  H01L2224/0401

    摘要： A semiconductor package is provided that includes a substrate having a top surface, a cover, and at least one semiconductor device attached to the top surface of the substrate. The cover is secured to the substrate so as to create a space between the interior surface and the substrate such that the semiconductor device resides within the space. The cover has an interior surface comprising a plurality of micro-channels. A wick is positioned in confronting relation to the plurality of micro-channels and the semiconductor device, with a two-phase vaporizable liquid disposed within the space.

    摘要翻译： 提供一种半导体封装，其包括具有顶表面的基板，盖和附接到基板的顶表面的至少一个半导体器件。 盖被固定到基板上，以在内表面和基板之间形成空间，使得半导体器件驻留在该空间内。 盖具有包括多个微通道的内表面。 灯芯与多个微通道和半导体器件面对面地定位，其中两相可汽化液体设置在该空间内。

    Heat transferring clamp
    9.
    发明授权
    Heat transferring clamp 有权
    传热夹

    公开(公告)号：US09466551B1

    公开(公告)日：2016-10-11

    申请号：US13385235

    申请日：2012-02-09

    申请人： Daniel T. Reist ,  Scott D. Garner ,  Jens E. Weyant ,  E. Michael Ames

    发明人： Daniel T. Reist ,  Scott D. Garner ,  Jens E. Weyant ,  E. Michael Ames

    IPC分类号： F28F11/06 ,  F28D15/00 ,  H01L23/473 ,  F28D15/02

    CPC分类号： H01L23/473 ,  F28D15/0241 ,  F28D15/0275 ,  F28F2275/08 ,  H05K7/1404 ,  H05K7/20672

    摘要： The apparatus is a heat transferring clamp with a heat pipe connecting the clamp's stationary base part to each moveable clamping part. A connecting heat pipe section between the heat pipe sections in the base part and each clamping part is flexible enough to permit both the required clamping and unclamping movements of the clamping part. The heat pipes thereby provide a superior heat transfer path between a clamped circuit board or other device and an available heat sink.

    摘要翻译： 该装置是具有将夹具的固定基部连接到每个可动夹紧部的热管的传热夹。 在基座部分和每个夹紧部分的热管部分之间的连接热管部分是足够柔性的，以允许夹紧部件的所需夹紧和松开运动。 因此，热管在夹紧的电路板或其他装置与可用的散热器之间提供了优异的传热路径。