公开(公告)号：US07306028B2

公开(公告)日：2007-12-11

申请号：US11159485

申请日：2005-06-23

申请人： Jon Zuo ,  Ernest H. Dubble ,  Donald M. Ernst

发明人： Jon Zuo ,  Ernest H. Dubble ,  Donald M. Ernst

IPC分类号： F28D15/04

CPC分类号： F28D15/0266 ,  F28D9/0025 ,  F28D9/0062 ,  F28F3/025

摘要： A modular based heat sink which can be easily optimized for a given heat source relies upon both phase change based heat transfer and condenser modules that combine the efficiency of folded fin cooling and the efficiency of the two phase heat transfer.

摘要翻译： 可以容易地为给定的热源优化的基于模块的散热器依赖于基于相变的热传递和将折叠翅片冷却的效率与两相热传递的效率相结合的冷凝器模块。

公开(公告)号：US20060289147A1

公开(公告)日：2006-12-28

申请号：US11159485

申请日：2005-06-23

申请人： Jon Zuo ,  Ernest Dubble ,  Donald Ernst

发明人： Jon Zuo ,  Ernest Dubble ,  Donald Ernst

IPC分类号： H05K7/20

CPC分类号： F28D15/0266 ,  F28D9/0025 ,  F28D9/0062 ,  F28F3/025

摘要： A modular based heat sink which can be easily optimized for a given heat source relies upon both phase change based heat transfer and condenser modules that combine the efficiency of folded fin cooling and the efficiency of the two phase heat transfer.

摘要翻译： 可以容易地为给定的热源优化的基于模块的散热器依赖于基于相变的热传递和将折叠翅片冷却的效率与两相热传递的效率相结合的冷凝器模块。

公开(公告)号：US06631077B2

公开(公告)日：2003-10-07

申请号：US10073537

申请日：2002-02-11

申请人： Jon Zuo

发明人： Jon Zuo

IPC分类号： H05K720

CPC分类号： H01L23/433 ,  F28F13/10 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat spreader includes a plate having a first and second ends and a plurality of channels between the ends. A reservoir is located at the first end. A fluid oscillator oscillates a fluid between the first and second ends with a reciprocating flow. The oscillator is integrally contained within the plate.

摘要翻译： 散热器包括具有第一端和第二端以及端部之间的多个通道的板。 水库位于第一端。 流体振荡器以往复流动在第一和第二端之间振荡流体。 振荡器一体地容纳在板内。

公开(公告)号：US06990816B1

公开(公告)日：2006-01-31

申请号：US11022391

申请日：2004-12-22

申请人： Jon Zuo ,  David Sarraf

发明人： Jon Zuo ,  David Sarraf

IPC分类号： F25B21/02

CPC分类号： B64G1/50 ,  F25B21/02 ,  F25B25/00 ,  F25B39/02 ,  F25B2339/021 ,  F28D15/0266 ,  F28D15/046

摘要： The apparatus is a hybrid cooler which includes one loop within which a heated evaporator forms vapor that moves to a condenser because of the vapor pressure which also drives the liquid condensate from the condenser to a liquid reservoir. A second loop is powered by a mechanical pump that supplies liquid from the reservoir to the evaporator and the second loop also returns excess liquid not vaporized to the reservoir. An optional reservoir cooler can be used to assure that the reservoir temperature and vapor pressure are always lower that the temperatures and pressures of the evaporator and condenser.

摘要翻译： 该装置是混合式冷却器，其包括一个回路，在该回路中，加热的蒸发器形成蒸气，由于蒸汽压力也会将冷凝物从冷凝器驱动到液体储存器。 第二回路由机械泵提供动力，泵将液体从储存器提供给蒸发器，第二回路还返回多余的液体，而不会蒸发到储存器中。 可以使用可选的储存器冷却器来确保储存器温度和蒸气压力总是低于蒸发器和冷凝器的温度和压力。

公开(公告)号：US06525420B2

公开(公告)日：2003-02-25

申请号：US09774475

申请日：2001-01-30

申请人： Jon Zuo ,  Donald M. Ernst

发明人： Jon Zuo ,  Donald M. Ernst

IPC分类号： H01L2312

CPC分类号： H01L23/427 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01322 ,  H01L2924/16152 ,  H01L2224/0401

摘要： The invention provides a semiconductor package having a substrate, a top surface and at least one semiconductor device attached to the top surface of the substrate. A cover is secured to the substrate creating a space between the cover and the substrate, with the semiconductor device residing within the space. The cover includes an inner chamber that is defined by an upper wall and a lower wall of the cover. The cavity contains a two-phase vaporizable liquid and a wick. Advantageously, the wick on the lower wall includes at least one recess that forms a thinned wall adjacent to a high heat generation portion of the semiconductor device. In one embodiment, the wick on the lower wall includes at least one channel that communicates with at least one of the recesses.

公开(公告)号：US20050269063A1

公开(公告)日：2005-12-08

申请号：US10882980

申请日：2004-07-01

申请人： Jon Zuo ,  Donald Ernst

发明人： Jon Zuo ,  Donald Ernst

IPC分类号： F28D15/04 ,  F28D20/02 ,  H01L23/427 ,  F28D17/00

CPC分类号： F28D20/023 ,  F28D15/046 ,  H01L23/427 ,  H01L23/4275 ,  H01L2924/0002 ,  Y02E60/145 ,  H01L2924/00

摘要： A wick for use in a heat pipe is provided incorporating particles of micro-encapsulated phase change material bonded together to form the wick. Use of a wick structure comprising micro-encapsulated PCM particles has the advantage of providing an additional heat absorber. This greatly enhances the ability of the heat pipe to absorb excess heat and may help to prevent damage to the heat pipe or heat generating component, such as an electronic device, especially at times of peak thermal loads.

公开(公告)号：US20050093139A1

公开(公告)日：2005-05-05

申请号：US10999261

申请日：2004-11-30

申请人： Jon Zuo ,  Donald Ernst

发明人： Jon Zuo ,  Donald Ernst

IPC分类号： H01L23/427 ,  H01L23/14

CPC分类号： H01L23/427 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01322 ,  H01L2924/16152 ,  H01L2224/0401

摘要： The invention provides a semiconductor package having a substrate, a top surface and at least one semiconductor device attached to the top surface of the substrate. A cover is secured to the substrate creating a space between the cover and the substrate, with the semiconductor device residing within the space. The cover includes an inner chamber that is defined by an upper wall and a lower wall of the cover. The cavity contains a two-phase vaporizable liquid and a wick. Advantageously, the wick on the lower wall includes at least one recess that forms a thinned wall adjacent to a high heat generation portion of the semiconductor device. In one embodiment, the wick on the lower wall includes at least one channel that communicates with at least one of the recesses.

公开(公告)号：US07005738B2

公开(公告)日：2006-02-28

申请号：US10999261

申请日：2004-11-30

申请人： Jon Zuo ,  Donald M. Ernst

发明人： Jon Zuo ,  Donald M. Ernst

IPC分类号： H01L23/34 ,  H01L23/06 ,  H01L23/12

CPC分类号： H01L23/427 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01322 ,  H01L2924/16152 ,  H01L2224/0401

摘要： The invention provides a semiconductor package having a substrate, a top surface and at least one semiconductor device attached to the top surface of the substrate. A cover is secured to the substrate creating a space between the cover and the substrate, with the semiconductor device residing within the space. The cover includes an inner chamber that is defined by an upper wall and a lower wall of the cover. The cavity contains a two-phase vaporizable liquid and a wick. Advantageously, the wick on the lower wall includes at least one recess that forms a thinned wall adjacent to a high heat generation portion of the semiconductor device. In one embodiment, the wick on the lower wall includes at least one channel that communicates with at least one of the recesses.

公开(公告)号：US06889755B2

公开(公告)日：2005-05-10

申请号：US10370349

申请日：2003-02-18

申请人： Jon Zuo ,  Donald M. Ernst

发明人： Jon Zuo ,  Donald M. Ernst

IPC分类号： F28D15/04 ,  F28D20/02 ,  H01L23/427 ,  F28D15/00

CPC分类号： F28D20/023 ,  F28D15/046 ,  H01L23/427 ,  H01L23/4275 ,  H01L2924/0002 ,  Y02E60/145 ,  H01L2924/00

摘要： A wick for use in a heat pipe is provided incorporating particles of micro-encapsulated phase change material bonded together to form the wick. Use of a wick structure comprising micro-encapsulated PCM particles has the advantage of providing an additional heat absorber. This greatly enhances the ability of the heat pipe to absorb excess heat and may help to prevent damage to the heat pipe or heat generating component, such as an electronic device, especially at times of peak thermal loads.

摘要翻译： 提供了用于热管中的芯，其结合有微胶囊相变材料的颗粒以形成芯。 使用包含微胶囊化PCM颗粒的芯结构具有提供另外的吸热体的优点。 这大大增强了热管吸收多余热量的能力，并且可以有助于防止对热管或发热部件（例如电子设备）的损坏，特别是在峰值热负载时。

公开(公告)号：US06579747B1

公开(公告)日：2003-06-17

申请号：US10219731

申请日：2002-08-15

申请人： Jon Zuo

发明人： Jon Zuo

IPC分类号： H01L2150

CPC分类号： H01L23/427 ,  H01L23/3735 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/16152

摘要： Method of making semiconductor package including at least one semiconductor chip disposed within a housing, the housing including a lid which overlies the at least one semiconductor chip and a heat-dissipating device coupled to the housing, the heat-dissipating device including at least one area formed of a material with a low coefficient of thermal expansion.

摘要翻译： 制造半导体封装的方法包括设置在壳体内的至少一个半导体芯片，所述壳体包括覆盖所述至少一个半导体芯片的盖子和耦合到所述壳体的散热装置，所述散热装置包括至少一个区域 由具有低热膨胀系数的材料形成。