公开(公告)号：US06326321B1

公开(公告)日：2001-12-04

申请号：US09604849

申请日：2000-06-27

申请人： Scott Jeffrey DeBoer ,  John T. Moore ,  Mark Fischer ,  Randhir P. S. Thakur

发明人： Scott Jeffrey DeBoer ,  John T. Moore ,  Mark Fischer ,  Randhir P. S. Thakur

IPC分类号： H01L2131

CPC分类号： H01L21/28123 ,  H01L21/0276 ,  H01L21/31144 ,  H01L21/3185

摘要： In one aspect, the invention includes a semiconductor fabrication process, comprising: a) providing a substrate; b) forming a layer of silicon nitride over the substrate, the layer having a thickness; and c) enriching a portion of the thickness of the silicon nitride layer with silicon, the portion comprising less than or equal to about 95% of the thickness of the layer of silicon nitride. In another aspect, the invention includes a semiconductor fabrication process, comprising: a) providing a substrate; b) forming a layer of silicon nitride over the substrate, the layer having a thickness; and c) increasing a refractive index of a first portion of the thickness of the silicon nitride layer relative to a refractive index of a second portion of the silicon nitride layer, the first portion comprising less than or equal to about 95% of the thickness of the silicon nitride layer. In yet another aspect, the invention includes semiconductor wafer assembly, comprising: a) a semiconductor wafer substrate; and b) a layer of silicon nitride over the substrate, the layer comprising a thickness and two portions elevationally displaced relative to one another, a first of the two portions having less resistance than a second of the two portions, the first portion comprising less than or equal to about 95% of the thickness of the silicon nitride layer.

摘要翻译： 一方面，本发明包括半导体制造工艺，其包括：a）提供衬底; b）在衬底上形成氮化硅层，该层具有厚度; 以及c）用硅富集氮化硅层的一部分厚度，该部分包含小于或等于氮化硅层厚度的约95％。 在另一方面，本发明包括半导体制造工艺，其包括：a）提供衬底; b）在衬底上形成氮化硅层，该层具有厚度; 以及c）相对于所述氮化硅层的第二部分的折射率增加所述氮化硅层的厚度的第一部分的折射率，所述第一部分包括小于或等于所述氮化硅层的厚度的约95％ 氮化硅层。 在另一方面，本发明包括半导体晶片组件，包括：a）半导体晶片衬底; 以及b）在所述衬底上的一层氮化硅，所述层包括相对于彼此高度位移的厚度和两个部分，所述两个部分中的第一部分具有比所述两个部分中的第二部分更小的电阻，所述第一部分包括小于 或等于氮化硅层厚度的约95％。

公开(公告)号：US06677661B1

公开(公告)日：2004-01-13

申请号：US09429220

申请日：1999-10-28

申请人： Scott Jeffrey DeBoer ,  John T. Moore ,  Mark Fischer ,  Randhir P. S. Thakur

发明人： Scott Jeffrey DeBoer ,  John T. Moore ,  Mark Fischer ,  Randhir P. S. Thakur

IPC分类号： H01L2358

CPC分类号： H01L21/28123 ,  H01L21/0276 ,  H01L21/31144 ,  H01L21/3185

摘要： In one aspect, the invention includes a semiconductor fabrication process, comprising: a) providing a substrate; b) forming a layer of silicon nitride over the substrate, the layer having a thickness; and c) enriching a portion of the thickness of the silicon nitride layer with silicon, the portion comprising less than or equal to about 95% of the thickness of the layer of silicon nitride. In another aspect, the invention includes a semiconductor fabrication process, comprising: a) providing a substrate; b) forming a layer of silicon nitride over the substrate, the layer having a thickness; and c) increasing a refractive index of a first portion of the thickness of the silicon nitride layer relative to a refractive index of a second portion of the silicon nitride layer, the first portion comprising less than or equal to about 95% of the thickness of the silicon nitride layer. In yet another aspect, the invention includes semiconductor wafer assembly, comprising: a) a semiconductor wafer substrate; and b) a layer of silicon nitride over the substrate, the layer comprising a thickness and two portions elevationally displaced relative to one another, a first of the two portions having less resistance than a second of the two portions, the first portion comprising less than or equal to about 95% of the thickness of the silicon nitride layer.

摘要翻译： 一方面，本发明包括半导体制造工艺，其包括：a）提供衬底; b）在衬底上形成氮化硅层，该层具有厚度; 以及c）用硅富集氮化硅层的一部分厚度，该部分包含小于或等于氮化硅层厚度的约95％。 在另一方面，本发明包括半导体制造工艺，其包括：a）提供衬底; b）在衬底上形成氮化硅层，该层具有厚度; 以及c）相对于所述氮化硅层的第二部分的折射率增加所述氮化硅层的厚度的第一部分的折射率，所述第一部分包括小于或等于所述氮化硅层的厚度的约95％ 氮化硅层。 在另一方面，本发明包括半导体晶片组件，包括：a）半导体晶片衬底; 以及b）在所述衬底上的一层氮化硅，所述层包括相对于彼此高度位移的厚度和两个部分，所述两个部分中的第一部分具有比所述两个部分中的第二部分更小的电阻，所述第一部分包括小于 或等于氮化硅层厚度的约95％。

公开(公告)号：US06670288B1

公开(公告)日：2003-12-30

申请号：US09604850

申请日：2000-06-27

申请人： Scott Jeffrey DeBoer ,  John T. Moore ,  Mark Fischer ,  Randhir P. S. Thakur

发明人： Scott Jeffrey DeBoer ,  John T. Moore ,  Mark Fischer ,  Randhir P. S. Thakur

IPC分类号： H01L2131

CPC分类号： H01L21/28123 ,  H01L21/0276 ,  H01L21/31144 ,  H01L21/3185

摘要： In one aspect, the invention includes a semiconductor fabrication process, comprising: a) providing a substrate; b) forming a layer of silicon nitride over the substrate, the layer having a thickness; and c) enriching a portion of the thickness of the silicon nitride layer with silicon, the portion comprising less than or equal to about 95% of the thickness of the layer of silicon nitride. In another aspect, the invention includes a semiconductor fabrication process, comprising: a) providing a substrate; b) forming a layer of silicon nitride over the substrate, the layer having a thickness; and c) increasing a refractive index of a first portion of the thickness of the silicon nitride layer relative to a refractive index of a second portion of the silicon nitride layer, the first portion comprising less than or equal to about 95% of the thickness of the silicon nitride layer. In yet another aspect, the invention includes semiconductor wafer assembly, comprising: a) a semiconductor wafer substrate; and b) a layer of silicon nitride over the substrate, the layer comprising a thickness and two portions elevationally displaced relative to one another, a first of the two portions having less resistance than a second of the two portions, the first portion comprising less than or equal to about 95% of the thickness of the silicon nitride layer.

摘要翻译： 一方面，本发明包括半导体制造工艺，其包括：a）提供衬底; b）在衬底上形成氮化硅层，该层具有厚度; 以及c）用硅富集氮化硅层的一部分厚度，该部分包含小于或等于氮化硅层厚度的约95％。 在另一方面，本发明包括半导体制造工艺，其包括：a）提供衬底; b）在衬底上形成氮化硅层，该层具有厚度; 以及c）相对于所述氮化硅层的第二部分的折射率增加所述氮化硅层的厚度的第一部分的折射率，所述第一部分包括小于或等于所述氮化硅层的厚度的约95％ 氮化硅层。 在另一方面，本发明包括半导体晶片组件，包括：a）半导体晶片衬底; 以及b）在所述衬底上的一层氮化硅，所述层包括相对于彼此高度位移的厚度和两个部分，所述两个部分中的第一部分具有比所述两个部分中的第二部分更小的电阻，所述第一部分包括小于 或等于氮化硅层厚度的约95％。

公开(公告)号：US06316372B1

公开(公告)日：2001-11-13

申请号：US09057153

申请日：1998-04-07

申请人： Scott Jeffrey DeBoer ,  John T. Moore ,  Randhir P. S. Thakur ,  Mark Fischer

发明人： Scott Jeffrey DeBoer ,  John T. Moore ,  Randhir P. S. Thakur ,  Mark Fischer

IPC分类号： H01L2131

CPC分类号： H01L21/28123 ,  H01L21/0276 ,  H01L21/31144 ,  H01L21/3185

摘要： In one aspect, the invention includes a semiconductor fabrication process, comprising: a) providing a substrate; b) forming a layer of silicon nitride over the substrate, the layer having a thickness; and c) enriching a portion of the thickness of the silicon nitride layer with silicon, the portion comprising less than or equal to about 95% of the thickness of the layer of silicon nitride. In another aspect, the invention includes a semiconductor fabrication process, comprising: a) providing a substrate; b) forming a layer of silicon nitride over the substrate, the layer having a thickness; and c) increasing a refractive index of a first portion of the thickness of the silicon nitride layer relative to a refractive index of a second portion of the silicon nitride layer, the first portion comprising less than or equal to about 95% of the thickness of the silicon nitride layer. In yet another aspect, the invention includes semiconductor wafer assembly, comprising: a) a semiconductor wafer substrate; and b) a layer of silicon nitride over the substrate, the layer comprising a thickness and two portions elevationally displaced relative to one another, a first of the two portions having less resistance than a second of the two portions, the first portion comprising less than or equal to about 95% of the thickness of the silicon nitride layer.

摘要翻译： 一方面，本发明包括半导体制造工艺，其包括：a）提供衬底; b）在衬底上形成氮化硅层，该层具有厚度; 以及c）用硅富集氮化硅层的一部分厚度，该部分包含小于或等于氮化硅层厚度的约95％。 在另一方面，本发明包括半导体制造工艺，其包括：a）提供衬底; b）在衬底上形成氮化硅层，该层具有厚度; 以及c）相对于所述氮化硅层的第二部分的折射率增加所述氮化硅层的厚度的第一部分的折射率，所述第一部分包括小于或等于所述氮化硅层的厚度的约95％ 氮化硅层。 在另一方面，本发明包括半导体晶片组件，包括：a）半导体晶片衬底; 以及b）在所述衬底上的一层氮化硅，所述层包括相对于彼此高度位移的厚度和两个部分，所述两个部分中的第一部分具有比所述两个部分中的第二部分更小的电阻，所述第一部分包括小于 或等于氮化硅层厚度的约95％。

公开(公告)号：US07141850B2

公开(公告)日：2006-11-28

申请号：US10769573

申请日：2004-01-30

申请人： Mark A. Helm ,  Mark Fischer ,  John T. Moore ,  Scott Jeffrey DeBoer

发明人： Mark A. Helm ,  Mark Fischer ,  John T. Moore ,  Scott Jeffrey DeBoer

IPC分类号： H01L29/792

CPC分类号： H01L29/7881 ,  H01L21/28273 ,  H01L29/511

摘要： In one aspect, the invention includes a method of forming a gated semiconductor assembly, comprising: a) forming a silicon nitride layer over and against a floating gate; and b) forming a control gate over the silicon nitride layer. In another aspect, the invention includes a method of forming a gated semiconductor assembly, comprising: a) forming a floating gate layer over a substrate; b) forming a silicon nitride layer over the floating gate layer, the silicon nitride layer comprising a first portion and a second portion elevationally displaced from the first portion, the first portion having a greater stoichiometric amount of silicon than the second portion; and c) forming a control gate over the silicon nitride layer. In yet another aspect, the invention includes a gated semiconductor assembly comprising: a) a substrate; b) a floating gate over the substrate; c) a control gate over the floating gate; and d) an electron barrier layer between the floating gate and the control gate, the electron barrier layer comprising a silicon nitride layer, the silicon nitride layer comprising a first portion and a second portion elevationally displaced from the first portion, the first portion having a greater stoichiometric amount of silicon than the second portion.

摘要翻译： 一方面，本发明包括一种形成门控半导体组件的方法，包括：a）在浮动栅极上形成氮化硅层; 以及b）在所述氮化硅层上形成控制栅极。 另一方面，本发明包括形成门控半导体组件的方法，包括：a）在衬底上形成浮栅; b）在所述浮栅上形成氮化硅层，所述氮化硅层包括从所述第一部分向前倾斜的第一部分和第二部分，所述第一部分具有比所述第二部分更大的化学计量的硅量; 以及c）在所述氮化硅层上形成控制栅极。 在另一方面，本发明包括门控半导体组件，其包括：a）衬底; b）衬底上的浮栅; c）浮动门上的控制门; 以及d）在所述浮动栅极和所述控制栅极之间的电子势垒层，所述电子势垒层包括氮化硅层，所述氮化硅层包括第一部分和从所述第一部分向上偏移的第二部分，所述第一部分具有 比第二部分更大的化学计量的硅。

公开(公告)号：US07057263B2

公开(公告)日：2006-06-06

申请号：US10734419

申请日：2003-12-11

申请人： John T. Moore ,  Scott Jeffrey DeBoer ,  Mark Fischer ,  J. Brett Rolfson ,  Annette L. Martin ,  Ardavan Niroomand

发明人： John T. Moore ,  Scott Jeffrey DeBoer ,  Mark Fischer ,  J. Brett Rolfson ,  Annette L. Martin ,  Ardavan Niroomand

IPC分类号： H01L23/58

CPC分类号： H01L21/0217 ,  G03F7/091 ,  H01L21/022 ,  H01L21/02271 ,  H01L21/02304 ,  H01L21/02362 ,  H01L21/0274 ,  H01L21/0332 ,  H01L21/31144 ,  H01L21/312 ,  H01L21/3185

摘要： In one aspect, the invention includes a semiconductor processing method, comprising: a) providing a silicon nitride material having a surface; b) forming a barrier layer over the surface of the material, the barrier layer comprising silicon and nitrogen; and c) forming a photoresist over and against the barrier layer. In another aspect, the invention includes a semiconductor processing method, comprising: a) providing a silicon nitride material having a surface; b) forming a barrier layer over the surface of the material, the barrier layer comprising silicon and nitrogen; c) forming a photoresist over and against the barrier layer; d) exposing the photoresist to a patterned beam of light to render at least one portion of the photoresist more soluble in a solvent than an other portion, the barrier layer being an antireflective surface that absorbs light passing through the photoresist; and e) exposing the photoresist to the solvent to remove the at least one portion while leaving the other portion over the barrier layer. In yet another aspect, the invention includes a semiconductor wafer assembly, comprising: a) a silicon nitride material, the material having a surface; b) a barrier layer over the surface of the material, the barrier layer comprising silicon and nitrogen; and c) a photoresist over and against the barrier layer.

公开(公告)号：US06323139B1

公开(公告)日：2001-11-27

申请号：US09457093

申请日：1999-12-07

申请人： John T. Moore ,  Scott Jeffrey DeBoer ,  Mark Fischer ,  J. Brett Rolfson ,  Annette L. Martin ,  Ardavan Niroomand

发明人： John T. Moore ,  Scott Jeffrey DeBoer ,  Mark Fischer ,  J. Brett Rolfson ,  Annette L. Martin ,  Ardavan Niroomand

IPC分类号： H01L2131

CPC分类号： H01L21/0217 ,  G03F7/091 ,  H01L21/022 ,  H01L21/02271 ,  H01L21/02304 ,  H01L21/02362 ,  H01L21/0274 ,  H01L21/0332 ,  H01L21/31144 ,  H01L21/312 ,  H01L21/3185

摘要： In one aspect, the invention includes a semiconductor processing method, comprising: a) providing a silicon nitride material having a surface; b) forming a barrier layer over the surface of the material, the barrier layer comprising silicon and nitrogen; and c) forming a photoresist over and against the barrier layer. In another aspect, the invention includes a semiconductor processing method, comprising: a) providing a silicon nitride material having a surface; b) forming a barrier layer over the surface of the material, the barrier layer comprising silicon and nitrogen; c) forming a photoresist over and against the barrier layer; d) exposing the photoresist to a patterned beam of light to render at least one portion of the photoresist more soluble in a solvent than an other portion, the barrier layer being an antireflective surface that absorbs light passing through the photoresist; and e) exposing the photoresist to the solvent to remove the at least one portion while leaving the other portion over the barrier layer. In yet another aspect, the invention includes a semiconductor wafer assembly, comprising: a) a silicon nitride material, the material having a surface; b) a barrier layer over the surface of the material, the barrier layer comprising silicon and nitrogen; and c) a photoresist over and against the barrier layer.

摘要翻译： 一方面，本发明包括半导体处理方法，包括：a）提供具有表面的氮化硅材料; b）在所述材料的表面上形成阻挡层，所述阻挡层包含硅和氮; 以及c）在所述阻挡层上形成光致抗蚀剂。 另一方面，本发明包括半导体处理方法，包括：a）提供具有表面的氮化硅材料; b）在所述材料的表面上形成阻挡层，所述阻挡层包含硅和氮; c）在阻挡层上形成光致抗蚀剂; d）将所述光致抗蚀剂暴露于图案化的光束以使所述光致抗蚀剂的至少一部分在溶剂中比其它部分更易溶，所述阻挡层是吸收通过所述光致抗蚀剂的光的抗反射表面; 以及e）将所述光致抗蚀剂暴露于所述溶剂以除去所述至少一个部分，同时将所述另一部分留在所述阻挡层上。 在另一方面，本发明包括半导体晶片组件，包括：a）氮化硅材料，该材料具有表面; b）在所述材料的表面上的阻挡层，所述阻挡层包含硅和氮; 以及c）在所述阻挡层上并抵靠所述阻挡层的光致抗蚀剂。

公开(公告)号：US06635530B2

公开(公告)日：2003-10-21

申请号：US09057148

申请日：1998-04-07

申请人： Mark A. Helm ,  Mark Fischer ,  John T. Moore ,  Scott Jeffrey DeBoer

发明人： Mark A. Helm ,  Mark Fischer ,  John T. Moore ,  Scott Jeffrey DeBoer

IPC分类号： H01L21336

CPC分类号： H01L29/7881 ,  H01L21/28273 ,  H01L29/511

摘要： The invention includes a method of forming a gated semiconductor assembly. A first transistor gate layer is formed over a substrate. A silicon nitride layer is formed over the first transistor gate layer. The silicon nitride layer comprises a first portion and a second portion elevationally displaced above the first portion. The first portion has less electrical resistance than the second portion and a different stoichiometric composition than the second portion. The first portion is physically against the second portion. A second transistor gate layer is formed over the silicon nitride layer.

摘要翻译： 本发明包括一种形成门控半导体组件的方法。 在衬底上形成第一晶体管栅极层。 在第一晶体管栅极层上形成氮化硅层。 氮化硅层包括第一部分和在第一部分上方向上移位的第二部分。 第一部分具有比第二部分更少的电阻和不同于第二部分的化学计量组成。 第一部分物理地抵靠第二部分。 在氮化硅层上形成第二晶体管栅极层。

公开(公告)号：US06417559B1

公开(公告)日：2002-07-09

申请号：US09724749

申请日：2000-11-27

申请人： John T. Moore ,  Scott Jeffrey DeBoer ,  Mark Fischer ,  J. Brett Rolfson ,  Annette L. Martin ,  Ardavan Niroomand

发明人： John T. Moore ,  Scott Jeffrey DeBoer ,  Mark Fischer ,  J. Brett Rolfson ,  Annette L. Martin ,  Ardavan Niroomand

IPC分类号： H01L2358

CPC分类号： H01L21/0217 ,  G03F7/091 ,  H01L21/022 ,  H01L21/02271 ,  H01L21/02304 ,  H01L21/02362 ,  H01L21/0274 ,  H01L21/0332 ,  H01L21/31144 ,  H01L21/312 ,  H01L21/3185

摘要： In one aspect, the invention includes a semiconductor processing method, comprising: a) providing a silicon nitride material having a surface; b) forming a barrier layer over the surface of the material, the barrier layer comprising silicon and nitrogen; and c) forming a photoresist over and against the barrier layer. In another aspect, the invention includes a semiconductor processing method, comprising: a) providing a silicon nitride material having a surface; b) forming a barrier layer over the surface of the material, the barrier layer comprising silicon and nitrogen; c) forming a photoresist over and against the barrier layer; d) exposing the photoresist to a patterned beam of light to render at least one portion of the photoresist more soluble in a solvent than an other portion, the barrier layer being an antireflective surface that absorbs light passing through the photoresist; and e) exposing the photoresist to the solvent to remove the at least one portion while leaving the other portion over the barrier layer. In yet another aspect, the invention includes a semiconductor wafer assembly, comprising: a) a silicon nitride material, the material having a surface; b) a barrier layer over the surface of the material, the barrier layer comprising silicon and nitrogen; and c) a photoresist over and against the barrier layer.

公开(公告)号：US06756634B2

公开(公告)日：2004-06-29

申请号：US09438310

申请日：1999-11-10

申请人： Mark A. Helm ,  Mark Fischer ,  John T. Moore ,  Scott Jeffrey DeBoer

发明人： Mark A. Helm ,  Mark Fischer ,  John T. Moore ,  Scott Jeffrey DeBoer

IPC分类号： H01L2992

CPC分类号： H01L29/7881 ,  H01L21/28273 ,  H01L29/511

摘要： In one aspect, the invention includes a method of forming a gated semiconductor assembly, comprising: a) forming a silicon nitride layer over and against a floating gate; and b) forming a control gate over the silicon nitride layer. In another aspect, the invention includes a method of forming a gated semiconductor assembly, comprising: a) forming a floating gate layer over a substrate; b) forming a silicon nitride layer over the floating gate layer, the silicon nitride layer comprising a first portion and a second portion elevationally displaced from the first portion, the first portion having a greater stoichiometric amount of silicon than the second portion; and c) forming a control gate over the silicon nitride layer. In yet another aspect, the invention includes a gated semiconductor assembly comprising: a) a substrate; b) a floating gate over the substrate; c) a control gate over the floating gate; and d) an electron barrier layer between the floating gate and the control gate, the electron barrier layer comprising a silicon nitride layer, the silicon nitride layer comprising a first portion and a second portion elevationally displaced from the first portion, the first portion having a greater stoichiometric amount of silicon than the second portion.

摘要翻译： 一方面，本发明包括一种形成门控半导体组件的方法，包括：a）在浮动栅极上形成氮化硅层; 以及b）在所述氮化硅层上形成控制栅极。 另一方面，本发明包括形成门控半导体组件的方法，包括：a）在衬底上形成浮栅; b）在所述浮栅上形成氮化硅层，所述氮化硅层包括从所述第一部分向前倾斜的第一部分和第二部分，所述第一部分具有比所述第二部分更大的化学计量的硅量; 以及c）在所述氮化硅层上形成控制栅极。 在另一方面，本发明包括门控半导体组件，其包括：a）衬底; b）衬底上的浮栅; c）浮动门上的控制门; 以及d）在所述浮动栅极和所述控制栅极之间的电子势垒层，所述电子势垒层包括氮化硅层，所述氮化硅层包括第一部分和从所述第一部分向上偏移的第二部分，所述第一部分具有 比第二部分更大的化学计量的硅。