Methods of manufacturing magnetic heads using a trigger reader electronic lapping guide
    1.
    发明授权
    Methods of manufacturing magnetic heads using a trigger reader electronic lapping guide 有权
    使用触发读取器电子研磨导轨制造磁头的方法

    公开(公告)号:US09190083B2

    公开(公告)日:2015-11-17

    申请号:US14053071

    申请日:2013-10-14

    Abstract: A method of manufacturing a magnetic read-write head, including the steps of presenting a row bar to a processing location, the row bar including an air bearing surface, at least one read-write head, at least one electronic lapping guide, and at least one trigger device, wherein each electronic lapping guide is positioned at a different distance from the air bearing surface than each trigger device, and wherein the read-write head and at least one of the trigger devices include a multi-layer stack of materials; lapping the air bearing surface while measuring the electrical resistance of at least one electronic lapping guide and at least one trigger device until the resistance measurement of the trigger device provides an open circuit reading, and measuring an offset resistance value of the at least one electronic lapping guide concurrently with the measurement of the open circuit reading by the trigger device.

    Abstract translation: 一种制造磁读写头的方法,包括以下步骤:向处理位置呈现行条,行条包括空气轴承表面,至少一个读写头,至少一个电子研磨导轨,以及在 至少一个触发装置,其中每个电子研磨引导件定位在与空气支承表面不同的距离处,与每个触发装置相对,并且其中所述读写头和所述触发装置中的至少一个包括多层堆叠材料; 在测量至少一个电子研磨导向器和至少一个触发装置的电阻的同时研磨空气轴承表面,直到触发装置的电阻测量提供开路读数,并且测量至少一个电子研磨的偏移电阻值 同时引导触发装置测量开路读数。

    METHODS OF MANUFACTURING MAGNETIC HEADS USING A TRIGGER READER ELECTRONIC LAPPING GUIDE
    2.
    发明申请
    METHODS OF MANUFACTURING MAGNETIC HEADS USING A TRIGGER READER ELECTRONIC LAPPING GUIDE 有权
    使用触发读取器电子穿线指南制造磁头的方法

    公开(公告)号:US20150103443A1

    公开(公告)日:2015-04-16

    申请号:US14053071

    申请日:2013-10-14

    Abstract: A method of manufacturing a magnetic read-write head, including the steps of presenting a row bar to a processing location, the row bar including an air bearing surface, at least one read-write head, at least one electronic lapping guide, and at least one trigger device, wherein each electronic lapping guide is positioned at a different distance from the air bearing surface than each trigger device, and wherein the read-write head and at least one of the trigger devices include a multi-layer stack of materials; lapping the air bearing surface while measuring the electrical resistance of at least one electronic lapping guide and at least one trigger device until the resistance measurement of the trigger device provides an open circuit reading, and measuring an offset resistance value of the at least one electronic lapping guide concurrently with the measurement of the open circuit reading by the trigger device.

    Abstract translation: 一种制造磁读写头的方法,包括以下步骤:向处理位置呈现行条,行条包括空气轴承表面,至少一个读写头,至少一个电子研磨导轨,以及在 至少一个触发装置,其中每个电子研磨引导件定位在与空气支承表面不同的距离处,与每个触发装置相对,并且其中所述读写头和所述触发装置中的至少一个包括多层堆叠材料; 在测量至少一个电子研磨导向器和至少一个触发装置的电阻的同时研磨空气轴承表面,直到触发装置的电阻测量提供开路读数,并且测量至少一个电子研磨的偏移电阻值 同时引导触发装置测量开路读数。

    Electrical isolation of read sensors during fabrication

    公开(公告)号:US10224066B1

    公开(公告)日:2019-03-05

    申请号:US15824317

    申请日:2017-11-28

    Abstract: A method includes depositing a plurality of layers over a substrate. The layers include read sensor layers and an electrically conductive layer substantially coplanar with the read sensor layers and substantially surrounding the read sensor layers. The electrically conductive layer is in contact with at least one of the read sensor layers. The electrically conductive layer provides an electrical path between the at least one of the read sensor layers and ground. The method further includes forming an isolation structure around the read sensor layers by removing a portion of the electrically conductive layer substantially surrounding the read sensor layers. The isolation structure is substantially coplanar with the read sensor layers and substantially surrounds the read sensor layers. The isolation structure breaks the electrical path between the at least one of the read sensor layers and the ground.

Patent Agency Ranking