SUBSTRATE TREATING APPARATUS
    1.
    发明申请

    公开(公告)号:US20210022213A1

    公开(公告)日:2021-01-21

    申请号:US16932286

    申请日:2020-07-17

    Abstract: An apparatus for treating a substrate includes a process chamber having a treatment space defined therein, a support unit for supporting the substrate in the treatment space, a liquid supply unit for supplying treating liquid to the substrate supported on the support unit, and a heating unit disposed in the support unit for heating the substrate supported on the support unit, wherein the heating unit includes a plurality of lamps to heat the substrate, and a window disposed above the lamps to transmit light emitted from the lamps, wherein the window includes a base in a form of a plate, and light adjustment means formed on the base to spread or converge light emitted from the lamps.

    APPARATUS AND METHOD FOR PROCESSING SUBSTRATE

    公开(公告)号:US20210066099A1

    公开(公告)日:2021-03-04

    申请号:US17011048

    申请日:2020-09-03

    Abstract: A method for processing a substrate includes a liquid treatment step of performing liquid treatment on the substrate by dispensing a treatment liquid onto the rotating substrate and a cleaning step of stopping the dispensing of the treatment liquid and dispensing a cleaning solution onto the substrate. In the cleaning step, a first liquid is dispensed from a first nozzle above the rotating substrate to a point spaced apart from the center of the substrate in a first direction, and a second liquid is dispensed from a second nozzle above the rotating substrate to a point spaced apart from the center of the substrate in a second direction. When viewed from above, the first liquid flows toward the second nozzle after dispensed onto the substrate, and the second liquid flows toward the first nozzle after dispensed onto the substrate.

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