公开(公告)号：US20240364059A1

公开(公告)日：2024-10-31

申请号：US18771289

申请日：2024-07-12

Applicant: Sentinel Connector Systems, Inc.

Inventor： Brett D Robinson

IPC: H01R24/64 ,  H01R13/646 ,  H01R13/6474 ,  H01R13/6581 ,  H01R13/66 ,  H01R13/7195 ,  H01R43/20 ,  H01R107/00 ,  H05K1/02 ,  H05K1/09 ,  H05K1/11 ,  H05K1/16

CPC classification number: H01R24/64 ,  H01R13/646 ,  H01R13/6474 ,  H01R13/6625 ,  H01R13/7195 ,  H01R43/205 ,  H05K1/0218 ,  H05K1/0228 ,  H05K1/09 ,  H05K1/115 ,  H05K1/162 ,  H01R13/6581 ,  H01R13/6658 ,  H01R2107/00 ,  Y10T29/49165 ,  Y10T29/49218

Abstract: A circuit board for a high speed communication jack including a rigid circuit board in the housing having a substrate, a plurality of vias extending through the substrate with each via being configured to accommodate a pin on the housing, a plurality of traces on a middle layer in the substrate, with each trace extending from a corresponding one of the plurality of vias, a first shielding layer on a first side of the middle layer in the substrate, a second shielding layer on a second side of the middle layer in the substrate, and a third shielding layer adjacent to the second shielding layer.

公开(公告)号：US09899776B2

公开(公告)日：2018-02-20

申请号：US15484294

申请日：2017-04-11

Applicant: Sentinel Connector Systems, Inc.

Inventor： Brett D Robinson ,  Justin Wagner

IPC: H01R13/6599 ,  H01R13/6585 ,  H01R43/16 ,  H01R24/64 ,  H01R107/00

CPC classification number: H01R13/6599 ,  H01R13/6466 ,  H01R13/6585 ,  H01R24/64 ,  H01R43/16 ,  H01R2107/00 ,  H05K1/0218 ,  H05K1/0228 ,  H05K1/0245 ,  H05K1/025 ,  H05K1/028

Abstract: A high speed communication jack including a housing including a port for accepting a plug, the port including a plurality of pins each connected to a corresponding signal line in the plug, a shielding case surrounding the housing, a circuit board in the housing having a substrate, a plurality of first vias extending through the substrate with each first via being configured to accommodate a pin on the housing, a plurality of second vias extending through the substrate with each second via being configured to accommodate a pin on the housing, a first set of traces on a top layer of the substrate that connects at least one first via with at least one corresponding second via; and a second set of traces on a side of the substrate opposite the top layer that connects at least one first via with at least one second via.

公开(公告)号：US12051878B2

公开(公告)日：2024-07-30

申请号：US17396311

申请日：2021-08-06

Applicant: Sentinel Connector Systems, Inc.

Inventor： Brett D Robinson

IPC: H01R24/64 ,  H01R13/646 ,  H01R13/6474 ,  H01R13/66 ,  H01R13/7195 ,  H01R43/20 ,  H05K1/02 ,  H05K1/09 ,  H05K1/11 ,  H05K1/16 ,  H01R13/6581 ,  H01R107/00

CPC classification number: H01R24/64 ,  H01R13/646 ,  H01R13/6474 ,  H01R13/6625 ,  H01R13/7195 ,  H01R43/205 ,  H05K1/0218 ,  H05K1/0228 ,  H05K1/09 ,  H05K1/115 ,  H05K1/162 ,  H01R13/6581 ,  H01R13/6658 ,  H01R2107/00 ,  Y10T29/49165 ,  Y10T29/49218

Abstract: A circuit board for a high speed communication jack including a rigid circuit board in the housing having a substrate, a plurality of vias extending through the substrate with each via being configured to accommodate a pin on the housing, a plurality of traces on a middle layer in the substrate, with each trace extending from a corresponding one of the plurality of vias, a first shielding layer on a first side of the middle layer in the substrate, a second shielding layer on a second side of the middle layer in the substrate, and a third shielding layer adjacent to the second shielding layer.