Method of fine patterning a metal layer
    1.
    发明申请
    Method of fine patterning a metal layer 审中-公开
    精细图案化金属层的方法

    公开(公告)号:US20060172522A1

    公开(公告)日:2006-08-03

    申请号:US11298481

    申请日:2005-12-12

    IPC分类号: H01L21/44

    摘要: A method of fine patterning a metal layer which includes depositing a metal layer on a substrate; depositing, on the metal layer, a mask layer having a different degree of electrolytic dissociation than that of the metal layer; making a patterned substrate body; and dipping the substrate body into an electrolyte to thereby corrode the metal layer by an electric potential generated between the metal layer and the mask layer to obtain a desired pattern. The metal layer is a metal having a high degree of electrolytic dissociation for use as an anode, and the mask layer is a metal having a low degree of electrolytic dissociation for use as a cathode. Accordingly, the present invention can conduct fine patterning of a metal layer to a desired size.

    摘要翻译: 一种精细图案化金属层的方法,包括在基底上沉积金属层; 在金属层上沉积具有与金属层不同的电解离解程度的掩模层; 制作图形衬底体; 并且将基板体浸入电解质中,从而通过在金属层和掩模层之间产生的电位来腐蚀金属层,以获得所需的图案。 金属层是具有高电解离解度的金属,用作阳极,掩模层是用作阴极的电解离解程度低的金属。 因此,本发明可以将金属层的精细图案化到期望的尺寸。

    Band filter using film bulk acoustic resonator and method of fabricating the same
    2.
    发明申请
    Band filter using film bulk acoustic resonator and method of fabricating the same 有权
    使用膜体声波谐振器的带滤波器及其制造方法

    公开(公告)号:US20060164187A1

    公开(公告)日:2006-07-27

    申请号:US11337574

    申请日:2006-01-24

    IPC分类号: H03H9/56

    摘要: A band filter using a film bulk acoustic resonator and a method of fabricating the same. The method includes the steps of forming a membrane layer on a substrate, forming a plurality of resonators on an upper surface of the membrane layer, depositing a mask layer on a lower surface of the membrane layer and patterning the mask layer to form a plurality of main windows and sub windows, and forming cavities along the main windows in the substrate and forming sub walls in the cavities in such a way that the sub walls are separated apart from the membrane layer by using the notch effect caused during a dry etching. It is possible to precisely form cavities with desired sizes even if the cavities have different sizes, to reduce the notched areas in the cavities, to reduce the total size of the filter by decreasing a distance between the cavities and to reduce the total length of wires.

    摘要翻译: 一种使用膜体声波谐振器的带滤波器及其制造方法。 该方法包括以下步骤:在衬底上形成膜层,在膜层的上表面上形成多个谐振器,在膜层的下表面上沉积掩模层,并使掩模层形成多个 主窗口和副窗口,并且沿着基板中的主窗口形成空腔,并且以这样的方式在空腔中形成子壁,使得通过使用在干蚀刻期间引起的切口效应,子壁与膜层分离。 可以精确地形成具有期望尺寸的空腔,即使空腔具有不同的尺寸,以减少空腔中的凹口区域,以通过减小空腔之间的距离来减小过滤器的总尺寸并减少导线的总长度 。

    Coupled resonator filter and fabrication method thereof
    3.
    发明授权
    Coupled resonator filter and fabrication method thereof 有权
    耦合谐振滤波器及其制造方法

    公开(公告)号:US07548139B2

    公开(公告)日:2009-06-16

    申请号:US11455190

    申请日:2006-06-19

    IPC分类号: H03H9/17 H03H9/00

    摘要: A coupled resonator filter and a method of fabricating the coupled resonator filter are provided. The method includes: sequentially stacking a first electrode, a first piezoelectric layer, a second electrode, an insulating layer, a third electrode, a second piezoelectric layer, and a fourth electrode on a surface of a substrate; sequentially patterning the first electrode, the first piezoelectric layer, the second electrode, the insulating layer, the third electrode, the second piezoelectric layer, and the fourth electrode to expose areas of the first, second, and third electrodes; forming a plurality of connection electrodes respectively connected to the exposed areas of the first, second, and third electrodes and an area of the fourth electrode; and etching an area of the substrate underneath the first electrode to form an air gap.

    摘要翻译: 提供耦合谐振滤波器和制造耦合谐振滤波器的方法。 该方法包括:在基板的表面上依次堆叠第一电极,第一压电层,第二电极,绝缘层,第三电极,第二压电层和第四电极; 顺序地构图第一电极,第一压电层,第二电极,绝缘层,第三电极,第二压电层和第四电极,以暴露第一,第二和第三电极的区域; 形成分别连接到第一,第二和第三电极的暴露区域和第四电极的区域的多个连接电极; 并且蚀刻在第一电极下方的衬底的区域以形成气隙。

    Method of manufacturing a monolithic duplexer
    4.
    发明授权
    Method of manufacturing a monolithic duplexer 有权
    制造单片双工器的方法

    公开(公告)号:US08720023B2

    公开(公告)日:2014-05-13

    申请号:US12647188

    申请日:2009-12-24

    IPC分类号: H03H9/15 H03H3/007

    摘要: A method for fabricating subminiature, high-performance monolithic duplexer is disclosed. The method comprises depositing and patterning a lower electrode on an upper surface of an insulation layer on a substrate, so as to expose a first part of the insulation layer; depositing a piezoelectric layer on an upper surface of the exposed insulation layer and the lower electrode; depositing a metal on the upper part of the piezoelectric layer and patterning the metal to form a resonance part and a trimming inductor, wherein the lower electrode electrically couples the resonance part and the trimming inductor; fabricating air gap type FBARs (film bulk acoustic resonances) by forming a cavity by etching the substrate under the resonance part; and bonding a packaging substrate on the substrate, the packaging substrate having a phase shifting part which substantially prevents inflow of signal between the air gap type FBARs.

    摘要翻译: 公开了一种用于制造超小型高性能单片双工器的方法。 该方法包括在基板上的绝缘层的上表面上沉积和图案化下电极,以暴露绝缘层的第一部分; 在暴露的绝缘层和下电极的上表面上沉积压电层; 在所述压电层的上部沉积金属并图案化所述金属以形成谐振部分和微调电感器,其中所述下部电极电耦合所述谐振部分和所述微调电感器; 通过在谐振部分下蚀刻衬底来形成空腔来制造气隙型FBAR(膜体声共振); 以及将封装基板接合在所述基板上,所述封装基板具有基本上防止所述气隙型FBAR之间的信号流入的相移部。

    System on chip structure comprising air cavity for isolating elements, duplexer, and duplexer fabrication method thereof
    5.
    发明授权
    System on chip structure comprising air cavity for isolating elements, duplexer, and duplexer fabrication method thereof 有权
    包括用于隔离元件的气腔,双工器和双工器制造方法的片上系统结构

    公开(公告)号:US07498900B2

    公开(公告)日:2009-03-03

    申请号:US11517371

    申请日:2006-09-08

    IPC分类号: H03H9/00

    摘要: A duplexer which prevents effects between transmitter and receiver filters. The duplexer include a substrate, a transmitter filter fabricated in a predetermined first area on a surface of the substrate, a receiver filter fabricated in a predetermined second area on the surface of the substrate and an air cavity fabricated in an area between the predetermined first and second areas by etching the substrate to isolate the transmitter and receiver filters from each other. The air cavity is fabricated in the substrate perpendicular to directions along which the transmitter and receiver filters are disposed. Accordingly, physical effects among elements can be effectively intercepted.

    摘要翻译: 防止发射机和接收机滤波器之间影响的双工器。 双工器包括基板,在基板的表面上的预定的第一区域中制造的发送器滤波器,在基板的表面上的预定的第二区域中制造的接收滤波器,以及在预定的第一和第 第二区域通过蚀刻基板以将发射器和接收器滤波器彼此隔离。 空气腔垂直于发射器和接收器滤波器布置的方向在衬底上制造。 因此,可以有效地截获元素之间的物理效应。

    Coupled resonator filter and fabrication method thereof
    6.
    发明申请
    Coupled resonator filter and fabrication method thereof 有权
    耦合谐振滤波器及其制造方法

    公开(公告)号:US20070139139A1

    公开(公告)日:2007-06-21

    申请号:US11455190

    申请日:2006-06-19

    IPC分类号: H03H9/54

    摘要: A coupled resonator filter and a method of fabricating the coupled resonator filter are provided. The method includes: sequentially stacking a first electrode, a first piezoelectric layer, a second electrode, an insulating layer, a third electrode, a second piezoelectric layer, and a fourth electrode on a surface of a substrate; sequentially patterning the first electrode, the first piezoelectric layer, the second electrode, the insulating layer, the third electrode, the second piezoelectric layer, and the fourth electrode to expose areas of the first, second, and third electrodes; forming a plurality of connection electrodes respectively connected to the exposed areas of the first, second, and third electrodes and an area of the fourth electrode; and etching an area of the substrate underneath the first electrode to form an air gap.

    摘要翻译: 提供耦合谐振滤波器和制造耦合谐振滤波器的方法。 该方法包括:在基板的表面上依次堆叠第一电极,第一压电层,第二电极,绝缘层,第三电极,第二压电层和第四电极; 顺序地构图第一电极,第一压电层,第二电极,绝缘层,第三电极,第二压电层和第四电极,以暴露第一,第二和第三电极的区域; 形成分别连接到第一,第二和第三电极的暴露区域和第四电极的区域的多个连接电极; 并且蚀刻在第一电极下方的衬底的区域以形成气隙。

    System on chip structure comprising air cavity for isolating elements, duplexer, and duplexer fabrication method thereof
    7.
    发明申请
    System on chip structure comprising air cavity for isolating elements, duplexer, and duplexer fabrication method thereof 有权
    包括用于隔离元件的气腔,双工器和双工器制造方法的片上系统结构

    公开(公告)号:US20070126527A1

    公开(公告)日:2007-06-07

    申请号:US11517371

    申请日:2006-09-08

    IPC分类号: H03H9/70

    摘要: A duplexer which prevents effects between transmitter and receiver filters. The duplexer include a substrate, a transmitter filter fabricated in a predetermined first area on a surface of the substrate, a receiver filter fabricated in a predetermined second area on the surface of the substrate and an air cavity fabricated in an area between the predetermined first and second areas by etching the substrate to isolate the transmitter and receiver filters from each other. The air cavity is fabricated in the substrate perpendicular to directions along which the transmitter and receiver filters are disposed. Accordingly, physical effects among elements can be effectively intercepted.

    摘要翻译: 防止发射机和接收机滤波器之间影响的双工器。 双工器包括基板,在基板的表面上的预定的第一区域中制造的发送器滤波器,在基板的表面上的预定的第二区域中制造的接收滤波器,以及在预定的第一和第 第二区域通过蚀刻基板以将发射器和接收器滤波器彼此隔离。 空气腔垂直于发射器和接收器滤波器布置的方向在衬底上制造。 因此,可以有效地截获元素之间的物理效应。

    Inductor integrated chip
    8.
    发明授权
    Inductor integrated chip 有权
    电感集成芯片

    公开(公告)号:US07615842B2

    公开(公告)日:2009-11-10

    申请号:US11473079

    申请日:2006-06-23

    IPC分类号: H01L29/00

    CPC分类号: H03H9/0542 H03H9/105

    摘要: An inductor integrated chip and fabrication method thereof is provided. The inductor integrated chip includes a wafer; an inductor bonded on a surface of the wafer; a circuit element formed on the surface of the wafer and coupled to a first end of the inductor; a packaging wafer connected to the surface of the wafer and packaging the inductor and the circuit element; and a connecting electrode formed on the packaging wafer and connected to a second end of the inductor. The method includes forming an inductor and a circuit element on a surface of a wafer, wherein the circuit element is coupled to a first end of the inductor; forming a connecting electrode on a packaging wafer; and packaging the inductor and the circuit element by joining the wafer and the packaging wafer so as to connect the connecting electrode with a second end of the inductor.

    摘要翻译: 提供一种电感器集成芯片及其制造方法。 电感器集成芯片包括晶片; 结合在晶片表面上的电感器; 电路元件,其形成在所述晶片的表面上并且耦合到所述电感器的第一端; 连接到晶片表面并封装电感器和电路元件的封装晶片; 以及形成在封装晶片上并连接到电感器的第二端的连接电极。 该方法包括在晶片的表面上形成电感器和电路元件,其中电路元件耦合到电感器的第一端; 在封装晶片上形成连接电极; 并且通过接合晶片和封装晶片来封装电感器和电路元件,以将连接电极与电感器的第二端连接。

    Monolithic duplexer
    9.
    发明申请
    Monolithic duplexer 有权
    单片双工器

    公开(公告)号:US20060109065A1

    公开(公告)日:2006-05-25

    申请号:US11262889

    申请日:2005-11-01

    IPC分类号: H03H9/70

    摘要: A subminiature, high-performance monolithic duplexer is disclosed. The monolithic duplexer includes a substrate, a transmitting-end filter formed in a first area on an upper surface of the substrate, a receiving-end filter formed in a second area on the upper surface of the substrate, a packaging substrate, bonded on an area on the upper surface of the substrate, for packaging the transmitting-end filter and the receiving-end filter in a sealed state, and a phase shifter, formed on one surface of the packaging substrate and connected to the transmitting-end filter and the receiving-end filter, respectively, for intercepting a signal inflow between the transmitting-end filter and the receiving-end filter.

    摘要翻译: 公开了一种超小型高性能单片双工器。 单片双工器包括基板,形成在基板的上表面上的第一区域中的透射端滤光器,形成在基板的上表面上的第二区域中的接收端滤光器,粘合在基板上的封装基板 在封装状态下将发送端滤波器和接收端滤波器封装在基板的上表面上的区域,以及形成在封装基板的一个表面上并与发送端滤波器连接的移相器 接收端滤波器分别用于截取发送端滤波器与接收端滤波器之间的信号流入。

    Monolithic duplexer
    10.
    发明授权
    Monolithic duplexer 有权
    单片双工器

    公开(公告)号:US07663450B2

    公开(公告)日:2010-02-16

    申请号:US11262889

    申请日:2005-11-01

    IPC分类号: H03H9/70

    摘要: A subminiature, high-performance monolithic duplexer is disclosed. The monolithic duplexer includes a substrate, a transmitting-end filter formed in a first area on an upper surface of the substrate, a receiving-end filter formed in a second area on the upper surface of the substrate, a packaging substrate, bonded on an area on the upper surface of the substrate, for packaging the transmitting-end filter and the receiving-end filter in a sealed state, and a phase shifter, formed on one surface of the packaging substrate and connected to the transmitting-end filter and the receiving-end filter, respectively, for intercepting a signal inflow between the transmitting-end filter and the receiving-end filter.

    摘要翻译: 公开了一种超小型高性能单片双工器。 单片双工器包括基板,形成在基板的上表面上的第一区域中的透射端滤光器,形成在基板的上表面上的第二区域中的接收端滤光器,粘合在基板上的封装基板 在封装状态下将发送端滤波器和接收端滤波器封装在基板的上表面上的区域,以及形成在封装基板的一个表面上并与发送端滤波器连接的移相器 接收端滤波器分别用于截取发送端滤波器与接收端滤波器之间的信号流入。