公开(公告)号：US20080110809A1

公开(公告)日：2008-05-15

申请号：US11983635

申请日：2007-11-09

申请人： Seong-goo Kang ,  Jun-ho Lee ,  Ki-sang Kang ,  Hyun-seop Shim ,  Do-young Kam ,  Jae-il Lee ,  Ju-il Kang

发明人： Seong-goo Kang ,  Jun-ho Lee ,  Ki-sang Kang ,  Hyun-seop Shim ,  Do-young Kam ,  Jae-il Lee ,  Ju-il Kang

IPC分类号： G01R31/28 ,  B07C5/344 ,  G01R31/319 ,  B65G65/02

CPC分类号： H01L21/67282 ,  G01R31/2867 ,  G01R31/2893 ,  H01L21/67271 ,  Y10S414/135

摘要： A multifunctional handler system for electrical testing of semiconductor devices is provided. The multifunctional handler system comprises: (1) a semiconductor device processing section comprising a loading unit including a buffer, a sorting unit including a separate marking machine, and a unloading unit; (2) a semiconductor device testing section, separate from the semiconductor device processing section, comprises a test chamber, the test chamber is separated into two or more test spaces, and the test spaces of the test chamber include a second chamber positioned at a lower position, a first chamber positioned above the second chamber, and pipelines for connecting the first and second chambers to each other; and (3) a host computer which is independently connected to the semiconductor device processing section and the semiconductor device testing section and controls tray information, test results, marking information, and test program information.

摘要翻译： 提供了一种用于半导体器件的电测试的多功能处理器系统。 多功能处理器系统包括：（1）半导体器件处理部分，包括包括缓冲器的加载单元，包括单独的标记机的分拣单元和卸载单元; （2）与半导体器件处理部分分离的半导体器件测试部分包括测试室，测试室被分离成两个或更多个测试空间，并且测试室的测试空间包括位于下部的第二室 位置，位于第二室上方的第一室以及用于将第一和第二室彼此连接的管道; 和（3）独立地连接到半导体器件处理部分和半导体器件测试部分并且控制托盘信息，测试结果，标记信息和测试程序信息的主计算机。

公开(公告)号：US20070236235A1

公开(公告)日：2007-10-11

申请号：US11727938

申请日：2007-03-29

申请人： Seong-goo Kang ,  Jun-ho Lee ,  Ki-sang Kang ,  Hyun-seop Shim ,  Do-young Kam ,  Jae-il Lee ,  Ju-il Kang

发明人： Seong-goo Kang ,  Jun-ho Lee ,  Ki-sang Kang ,  Hyun-seop Shim ,  Do-young Kam ,  Jae-il Lee ,  Ju-il Kang

IPC分类号： G01R31/02

CPC分类号： G01R31/2865 ,  G01R31/2862

摘要： A semiconductor device test handler for maintaining stable temperature in a test environment may include a loading unit that loads a plurality of semiconductor devices mounted on a test tray; a soak chamber configured to receive the test tray from the loading unit and to age the semiconductor devices at an aging temperature; and a test chamber configured to receive and test the aged semiconductor devices. The test chamber may include: a test board; a first chamber; a second chamber; one or more pipelines connected to the first and second chambers that allow a temperature-control medium to flow between the first and second chambers; a de-soak chamber that further ages the tested semiconductor devices so that the tested semiconductor devices substantially return to ambient temperature; and a sorting and unloading unit that sorts the tested semiconductor devices according to results of the test and that unloads the sorted semiconductor devices.

摘要翻译： 用于在测试环境中保持稳定温度的半导体器件测试处理器可以包括加载单元，其加载安装在测试托盘上的多个半导体器件; 浸泡室，其构造成从加载单元接收测试托盘并在老化温度下老化半导体器件; 以及被配置为接收和测试老化的半导体器件的测试室。 测试室可以包括：测试板; 第一个房间 第二个房间 连接到第一和第二室的一个或多个管道，允许温度控制介质在第一和第二室之间流动; 脱泡室，其进一步老化测试的半导体器件，使得测试的半导体器件基本上回到环境温度; 以及分类和卸载单元，其根据测试结果对测试的半导体器件进行排序，并且对排序的半导体器件进行卸载。

公开(公告)号：US07838790B2

公开(公告)日：2010-11-23

申请号：US11983635

申请日：2007-11-09

申请人： Seong-goo Kang ,  Jun-ho Lee ,  Ki-sang Kang ,  Hyun-seop Shim ,  Do-young Kam ,  Jae-il Lee ,  Ju-il Kang

发明人： Seong-goo Kang ,  Jun-ho Lee ,  Ki-sang Kang ,  Hyun-seop Shim ,  Do-young Kam ,  Jae-il Lee ,  Ju-il Kang

IPC分类号： B07C5/34

CPC分类号： H01L21/67282 ,  G01R31/2867 ,  G01R31/2893 ,  H01L21/67271 ,  Y10S414/135

摘要： A multifunctional handler system for electrical testing of semiconductor devices is provided. The multifunctional handler system comprises: (1) a semiconductor device processing section comprising a loading unit including a buffer, a sorting unit including a separate marking machine, and a unloading unit; (2) a semiconductor device testing section, separate from the semiconductor device processing section, comprises a test chamber, the test chamber is separated into two or more test spaces, and the test spaces of the test chamber include a second chamber positioned at a lower position, a first chamber positioned above the second chamber, and pipelines for connecting the first and second chambers to each other; and (3) a host computer which is independently connected to the semiconductor device processing section and the semiconductor device testing section and controls tray information, test results, marking information, and test program information.

摘要翻译： 提供了一种用于半导体器件的电测试的多功能处理器系统。 多功能处理器系统包括：（1）半导体器件处理部分，包括包括缓冲器的加载单元，包括单独的标记机的分拣单元和卸载单元; （2）与半导体器件处理部分分离的半导体器件测试部分包括测试室，测试室被分离成两个或更多个测试空间，并且测试室的测试空间包括位于下部的第二室 位置，位于第二室上方的第一室以及用于将第一和第二室彼此连接的管道; 和（3）独立地连接到半导体器件处理部分和半导体器件测试部分并且控制托盘信息，测试结果，标记信息和测试程序信息的主计算机。

公开(公告)号：US07554349B2

公开(公告)日：2009-06-30

申请号：US11727938

申请日：2007-03-29

申请人： Seong-goo Kang ,  Jun-ho Lee ,  Ki-sang Kang ,  Hyun-seop Shim ,  Do-young Kam ,  Jae-il Lee ,  Ju-il Kang

发明人： Seong-goo Kang ,  Jun-ho Lee ,  Ki-sang Kang ,  Hyun-seop Shim ,  Do-young Kam ,  Jae-il Lee ,  Ju-il Kang

IPC分类号： G01R31/02

CPC分类号： G01R31/2865 ,  G01R31/2862

摘要： A semiconductor device test handler for maintaining stable temperature in a test environment may include a loading unit that loads a plurality of semiconductor devices mounted on a test tray; a soak chamber configured to receive the test tray from the loading unit and to age the semiconductor devices at an aging temperature; and a test chamber configured to receive and test the aged semiconductor devices. The test chamber may include: a test board; a first chamber; a second chamber; one or more pipelines connected to the first and second chambers that allow a temperature-control medium to flow between the first and second chambers; a de-soak chamber that further ages the tested semiconductor devices so that the tested semiconductor devices substantially return to ambient temperature; and a sorting and unloading unit that sorts the tested semiconductor devices according to results of the test and that unloads the sorted semiconductor devices.

摘要翻译： 用于在测试环境中保持稳定温度的半导体器件测试处理器可以包括加载单元，其加载安装在测试托盘上的多个半导体器件; 浸泡室，其构造成从加载单元接收测试托盘并在老化温度下老化半导体器件; 以及被配置为接收和测试老化的半导体器件的测试室。 测试室可以包括：测试板; 第一个房间 第二个房间 连接到第一和第二室的一个或多个管道，允许温度控制介质在第一和第二室之间流动; 脱泡室，其进一步老化测试的半导体器件，使得测试的半导体器件基本上回到环境温度; 以及分类和卸载单元，其根据测试结果对测试的半导体器件进行排序，并且对排序的半导体器件进行卸载。

公开(公告)号：US06239396B1

公开(公告)日：2001-05-29

申请号：US09275733

申请日：1999-03-24

申请人： Ju-il Kang

发明人： Ju-il Kang

IPC分类号： B07C5344

CPC分类号： G01R31/2867 ,  B07C5/344 ,  G01R31/01 ,  G01R31/2806 ,  Y10S209/933

摘要： An apparatus in accordance with the present invention includes separate transporting units respectively for good and rejected semiconductor devices. As a result, respective handlings of the rejected and good devices, such as loading of the good devices into a burn-in board or an unloading tray and loading of the rejected devices into a rejecting tray, can be performed separately without interfering each other.

摘要翻译： 根据本发明的装置包括分别用于良好和被拒绝的半导体器件的分离的传输单元。 结果，可以分别执行被拒绝和良好的设备的各个处理，例如将好的设备装入老化板或卸载托盘以及将拒收的设备装入拒收托盘中，而不会彼此干扰。

公开(公告)号：US06974069B2

公开(公告)日：2005-12-13

申请号：US10465632

申请日：2003-06-20

申请人： Ju-il Kang ,  Hee-Sang Yang

发明人： Ju-il Kang ,  Hee-Sang Yang

IPC分类号： H05K3/34 ,  B23K1/00 ,  B23K1/20 ,  B23K3/06 ,  B23K3/08 ,  H01L21/48 ,  H01L21/60 ,  H01L23/12 ,  H01L23/498

CPC分类号： B23K3/0623 ,  B23K1/0016 ,  B23K1/203 ,  B23K1/206 ,  B23K3/08 ,  B23K3/082 ,  B23K2101/42 ,  H01L23/49816 ,  H01L24/11 ,  H01L2924/181 ,  H05K3/3478 ,  H01L2924/00

摘要： The disclosure is a plural process to perform a solder ball attaching process that corresponds to the final of a ball grid array package manufacturing process. For example, flux and solder balls are exactly attached on solder ball pads of base frames on which base tapes having a number of land pattern groups are adhered. In the above state, the base frames are inserted into an adjacent reflow device to make the solder balls be attached on the solder ball pads. After the flux of the solder ball pad, on which the solder ball is attached, is removed, the base frames are stored in containers. To perform the base frame storing process in a very small space, the transfer course of the base frames is in the form of loop.

摘要翻译： 本公开是执行与球栅阵列封装制造工艺的最终相对应的焊球附着工艺的复数工艺。 例如，焊剂和焊球精确地附着在其上粘附有多个焊盘图案组的基带的基架的焊球焊盘上。 在上述状态下，将基架插入到相邻的回流装置中，以使焊球附着在焊球上。 在去除焊锡球附着的焊球垫的焊剂之后，将基架储存在容器中。 为了在非常小的空间中执行基本帧存储处理，基本帧的传送过程是循环的形式。