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公开(公告)号:US20170108173A1
公开(公告)日:2017-04-20
申请号:US15348192
申请日:2016-11-10
Applicant: Seoul Viosys Co., Ltd.
Inventor: Ye Seul KIM , Kyoung Wan Kim , Snag Won Woo , Ji Hye Kim
IPC: F21K9/232 , H01L33/06 , H01L33/46 , H01L33/38 , F21S4/24 , H01L33/42 , H01L33/00 , H01L25/075 , H05K1/18 , H01L33/32 , H01L33/62
CPC classification number: F21K9/232 , F21Y2107/70 , G06F1/1662 , H01L25/0753 , H01L33/0033 , H01L33/0095 , H01L33/06 , H01L33/22 , H01L33/32 , H01L33/38 , H01L33/382 , H01L33/42 , H01L33/46 , H01L33/62 , H01L2224/73204 , H01L2933/0016 , H01L2933/0025 , H05K1/189 , H05K2201/10106
Abstract: A light emitting diode chip includes: a first conductive type semiconductor layer disposed on a substrate; a mesa disposed on the first conductive type semiconductor layer and including an active layer and a second conductive type semiconductor layer; an insulation layer covering the first conductive type semiconductor layer and the mesa, the insulation layer including at least one first opening exposing the first conductive type semiconductor layer and a second opening disposed on the mesa; a first pad electrode disposed on the insulation layer and electrically connected to the first conductive type semiconductor layer through the first opening; and a second pad electrode disposed on the insulation layer and electrically connected to the second conductive type semiconductor layer through the second opening. The first opening of the insulation layer includes a first region covered by the first pad electrode and a second region exposed outside the first pad electrode.