公开(公告)号：US20170108173A1

公开(公告)日：2017-04-20

申请号：US15348192

申请日：2016-11-10

Applicant: Seoul Viosys Co., Ltd.

Inventor： Ye Seul KIM ,  Kyoung Wan Kim ,  Snag Won Woo ,  Ji Hye Kim

IPC: F21K9/232 ,  H01L33/06 ,  H01L33/46 ,  H01L33/38 ,  F21S4/24 ,  H01L33/42 ,  H01L33/00 ,  H01L25/075 ,  H05K1/18 ,  H01L33/32 ,  H01L33/62

CPC classification number: F21K9/232 ,  F21Y2107/70 ,  G06F1/1662 ,  H01L25/0753 ,  H01L33/0033 ,  H01L33/0095 ,  H01L33/06 ,  H01L33/22 ,  H01L33/32 ,  H01L33/38 ,  H01L33/382 ,  H01L33/42 ,  H01L33/46 ,  H01L33/62 ,  H01L2224/73204 ,  H01L2933/0016 ,  H01L2933/0025 ,  H05K1/189 ,  H05K2201/10106

Abstract: A light emitting diode chip includes: a first conductive type semiconductor layer disposed on a substrate; a mesa disposed on the first conductive type semiconductor layer and including an active layer and a second conductive type semiconductor layer; an insulation layer covering the first conductive type semiconductor layer and the mesa, the insulation layer including at least one first opening exposing the first conductive type semiconductor layer and a second opening disposed on the mesa; a first pad electrode disposed on the insulation layer and electrically connected to the first conductive type semiconductor layer through the first opening; and a second pad electrode disposed on the insulation layer and electrically connected to the second conductive type semiconductor layer through the second opening. The first opening of the insulation layer includes a first region covered by the first pad electrode and a second region exposed outside the first pad electrode.