公开(公告)号：US09627281B2

公开(公告)日：2017-04-18

申请号：US12860256

申请日：2010-08-20

申请人： Seth Prejean ,  Dales Kent ,  Ronnie Brandon ,  Gamal Refai-Ahmed ,  Michael Z. Su ,  Michael Bienek ,  Joseph Siegel ,  Bryan Black

发明人： Seth Prejean ,  Dales Kent ,  Ronnie Brandon ,  Gamal Refai-Ahmed ,  Michael Z. Su ,  Michael Bienek ,  Joseph Siegel ,  Bryan Black

IPC分类号： H01L23/58 ,  H01L21/66 ,  H01L21/56 ,  H01L21/683 ,  H01L25/065 ,  H01L23/42

CPC分类号： H01L22/20 ,  H01L21/563 ,  H01L21/6835 ,  H01L21/6836 ,  H01L22/14 ,  H01L23/42 ,  H01L25/0657 ,  H01L2221/68327 ,  H01L2221/68386 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81002 ,  H01L2224/81815 ,  H01L2224/831 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06565 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/00

摘要： A method of manufacturing is provided that includes applying a thermal interface tape to a side of a semiconductor wafer that includes at least one semiconductor chip. The thermal interface material tape is positioned on the at least one semiconductor chip. The at least one semiconductor chip is singulated from the semiconductor wafer with at least a portion of the thermal interface tape still attached to the semiconductor chip.

公开(公告)号：US20120043539A1

公开(公告)日：2012-02-23

申请号：US12860256

申请日：2010-08-20

申请人： Seth Prejean ,  Dales Kent ,  Ronnie Brandon ,  Gamal Refai-Ahmed ,  Michael Z. Su ,  Michael Bienek ,  Joseph Siegel ,  Bryan Black

发明人： Seth Prejean ,  Dales Kent ,  Ronnie Brandon ,  Gamal Refai-Ahmed ,  Michael Z. Su ,  Michael Bienek ,  Joseph Siegel ,  Bryan Black

IPC分类号： H01L23/34 ,  H01L21/66

CPC分类号： H01L22/20 ,  H01L21/563 ,  H01L21/6835 ,  H01L21/6836 ,  H01L22/14 ,  H01L23/42 ,  H01L25/0657 ,  H01L2221/68327 ,  H01L2221/68386 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81002 ,  H01L2224/81815 ,  H01L2224/831 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06565 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/00

摘要： A method of manufacturing is provided that includes applying a thermal interface tape to a side of a semiconductor wafer that includes at least one semiconductor chip. The thermal interface material tape is positioned on the at least one semiconductor chip. The at least one semiconductor chip is singulated from the semiconductor wafer with at least a portion of the thermal interface tape still attached to the semiconductor chip.

摘要翻译： 提供了一种制造方法，其包括将热界面带施加到包括至少一个半导体芯片的半导体晶片的侧面。 热界面材料带位于至少一个半导体芯片上。 至少一个半导体芯片从半导体晶片分离，其中至少一部分热界面带仍然附着到半导体芯片上。

公开(公告)号：US20070205756A1

公开(公告)日：2007-09-06

申请号：US11747207

申请日：2007-05-10

申请人： John Corbin ,  Jose Garza ,  Dales Kent ,  Kenneth Larsen ,  Howard Mahaney ,  Hoa Phan ,  John Salazar

发明人： John Corbin ,  Jose Garza ,  Dales Kent ,  Kenneth Larsen ,  Howard Mahaney ,  Hoa Phan ,  John Salazar

IPC分类号： G01R31/28

CPC分类号： G01R31/2891

摘要： Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.

公开(公告)号：US20070205757A1

公开(公告)日：2007-09-06

申请号：US11747213

申请日：2007-05-10

申请人： John Corbin ,  Jose Garza ,  Dales Kent ,  Kenneth Larsen ,  Howard Mahaney ,  Hoa Phan ,  John Salazar

发明人： John Corbin ,  Jose Garza ,  Dales Kent ,  Kenneth Larsen ,  Howard Mahaney ,  Hoa Phan ,  John Salazar

IPC分类号： G01R31/00

CPC分类号： G01R31/2891

摘要： Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.

摘要翻译： 公开了用于测试LGA设备的改进的方法，系统和设备。 一个示例性实施例包括测试嵌套组件冷却线的垂直布线，以便最小化测试嵌套足迹并增加单个测试卡上的可用测试位置。 另一示例性实施例包括将外部负载和力矩隔离并调整到散热器/冷板中，其中这些负载和力矩涉及控制质心以恢复散热片/芯片接口的更理想的热性能。 另一个示例性实施例包括便于LGA插座的简单且低成本替换的嵌套架构。 最后，另一示例性实施例包括通过使用干式空气排气对测试巢组件部件进行有效的冷凝控制。

公开(公告)号：US20060152237A1

公开(公告)日：2006-07-13

申请号：US11033935

申请日：2005-01-12

申请人： John Corbin ,  Jose Garza ,  Dales Kent ,  Kenneth Larsen ,  Howard Mahaney ,  Hoa Phan ,  John Salazar

发明人： John Corbin ,  Jose Garza ,  Dales Kent ,  Kenneth Larsen ,  Howard Mahaney ,  Hoa Phan ,  John Salazar

IPC分类号： G01R31/02

CPC分类号： G01R31/2891

摘要： Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.

公开(公告)号：US20050030053A1

公开(公告)日：2005-02-10

申请号：US10923296

申请日：2004-08-20

申请人： Daniel Beaman ,  John Corbin ,  Dales Kent ,  Howard Mahaney ,  Hoa Phan ,  Frederic Wright

发明人： Daniel Beaman ,  John Corbin ,  Dales Kent ,  Howard Mahaney ,  Hoa Phan ,  Frederic Wright

IPC分类号： G01R31/28 ,  F25D23/12

CPC分类号： G01R31/2874 ,  G01R31/2881

摘要： An innovative chip testing system and method includes controlling temperature and condensation during testing. Coarse temperature is controlled by providing a desired fluid flow rate and fluid temperature to a cold plate. Fine temperature control is provided by a feedback loop which controls the power dissipation of cartridge heaters installed within the cold plate. Condensation control is provided by insulating various components of the system, manipulation of dry compressed air in enclosures to reduce surface dew point temperatures, usage of cartridge heaters in a card backside stiffener plate, and by providing a heatsink assembly which prevents condensation on the insulation.

摘要翻译： 创新的芯片测试系统和方法包括在测试期间控制温度和冷凝。 通过向冷板提供所需的流体流速和流体温度来控制粗温度。 通过反馈回路提供精细的温度控制，该回路控制安装在冷板内的筒式加热器的功率消耗。 通过绝缘系统的各种部件，操纵外壳中的干燥压缩空气以降低表面露点温度，在卡背面加强板中使用筒式加热器以及通过提供防止绝缘物上的冷凝的散热器组件来提供冷凝控制。

公开(公告)号：US20070210819A1

公开(公告)日：2007-09-13

申请号：US11747202

申请日：2007-05-10

申请人： John Corbin ,  Jose Garza ,  Dales Kent ,  Kenneth Larsen ,  Howard Mahaney ,  Hoa Phan ,  John Salazar

发明人： John Corbin ,  Jose Garza ,  Dales Kent ,  Kenneth Larsen ,  Howard Mahaney ,  Hoa Phan ,  John Salazar

IPC分类号： G01R31/28

CPC分类号： G01R31/2891

摘要： Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.

公开(公告)号：US20070205796A1

公开(公告)日：2007-09-06

申请号：US11747197

申请日：2007-05-10

申请人： John Corbin ,  Jose Garza ,  Dales Kent ,  Kenneth Larsen ,  Howard Mahaney ,  Hoa Phan ,  John Salazar

发明人： John Corbin ,  Jose Garza ,  Dales Kent ,  Kenneth Larsen ,  Howard Mahaney ,  Hoa Phan ,  John Salazar

IPC分类号： G01R31/26

CPC分类号： G01R31/2891

摘要： Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.

公开(公告)号：US20070205797A1

公开(公告)日：2007-09-06

申请号：US11747200

申请日：2007-05-10

申请人： John Corbin ,  Jose Garza ,  Dales Kent ,  Kenneth Larsen ,  Howard Mahaney ,  Hoa Phan ,  John Salazar

发明人： John Corbin ,  Jose Garza ,  Dales Kent ,  Kenneth Larsen ,  Howard Mahaney ,  Hoa Phan ,  John Salazar

IPC分类号： G01R31/26

CPC分类号： G01R31/2891

摘要： Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.

公开(公告)号：US20070205773A1

公开(公告)日：2007-09-06

申请号：US11747204

申请日：2007-05-10

申请人： John Corbin ,  Jose Garza ,  Dales Kent ,  Kenneth Larsen ,  Howard Mahaney ,  Hoa Phan ,  John Salazar

发明人： John Corbin ,  Jose Garza ,  Dales Kent ,  Kenneth Larsen ,  Howard Mahaney ,  Hoa Phan ,  John Salazar

IPC分类号： G01R31/00

CPC分类号： G01R31/2891

摘要： Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.