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公开(公告)号：US06659779B1
公开(公告)日：2003-12-09
申请号：US10237317
申请日：2002-09-09
申请人： Shaun L. Harris , Eric C. Peterson , David Fisk
发明人： Shaun L. Harris , Eric C. Peterson , David Fisk
IPC分类号： H05K100
摘要： An electronic device comprises a first chassis, a second chassis, and at least one flexible circuit extending therebetween. The first chassis is oriented along a first axis and comprises at least one first microprocessor. The second chassis is oriented along a second axis and comprises at least one power generating component. The flexible circuit comprises a first end and a second end, wherein the first end is connectable to the first chassis and the second end is connectable to the second chassis. The first chassis is movable relative to the second chassis between a position wherein the first axis is substantially perpendicular to the second axis and a position wherein the first axis is substantially parallel to the second axis.
摘要翻译： 电子设备包括第一机架，第二机架以及在它们之间延伸的至少一个柔性电路。 第一底盘沿着第一轴线定向并且包括至少一个第一微处理器。 第二机架沿着第二轴线定向并且包括至少一个发电部件。 柔性电路包括第一端和第二端，其中第一端可连接到第一机架，第二端可连接到第二机架。 第一底盘可相对于第二底盘移动，在第一轴线基本上垂直于第二轴线的位置和第一轴线基本上平行于第二轴线的位置之间。
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公开(公告)号：US06773267B2
公开(公告)日：2004-08-10
申请号：US10629988
申请日：2003-07-29
申请人： Shaun L. Harris , Eric C. Peterson , David Fisk
发明人： Shaun L. Harris , Eric C. Peterson , David Fisk
IPC分类号： H05K100
摘要： An electronic device includes a first chassis, a second chassis, and at least one flexible circuit extending therebetween. The first chassis is oriented along a first axis and comprises at least one first microprocessor. The second chassis is oriented along a second axis and comprises at least one power generating component. The flexible circuit comprises a first end and a second end, wherein the first end is connectable to the first chassis and the second end is connectable to the second chassis. The first chassis is movable relative to the second chassis between a position wherein the first axis is substantially perpendicular to the second axis and a position wherein the first axis is substantially parallel to the second axis.
摘要翻译： 电子设备包括第一机架，第二机架以及在它们之间延伸的至少一个柔性电路。 第一底盘沿着第一轴线定向并且包括至少一个第一微处理器。 第二机架沿着第二轴线定向并且包括至少一个发电部件。 柔性电路包括第一端和第二端，其中第一端可连接到第一机架，第二端可连接到第二机架。 第一底盘可相对于第二底盘移动，在第一轴线基本上垂直于第二轴线的位置和第一轴线基本上平行于第二轴线的位置之间。
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公开(公告)号：US08804313B2
公开(公告)日：2014-08-12
申请号：US13530466
申请日：2012-06-22
申请人： Eric C. Peterson , Shaun L. Harris
发明人： Eric C. Peterson , Shaun L. Harris
CPC分类号： H02B1/015 , H05K1/0263 , H05K1/141 , H05K7/1457 , Y10T307/50 , Y10T307/582 , Y10T307/62
摘要： Computational enclosures may be designed to distribute power from power supplies to load units (e.g., processors, storage devices, or network routers). The architecture may affect the efficiency, cost, modularity, accessibility, and space utilization of the components within the enclosure. Presented herein are power distribution architectures involving a distribution board oriented along a first (e.g., vertical) axis within the enclosure, comprising a power interconnect configured to distribute power among a set of load boards oriented along a second (e.g., lateral) axis and respectively connecting with a set of load units oriented along a third (e.g., sagittal) axis, and a set of power supplies also oriented along the third axis. This orientation may compactly and proximately position the loads near the power supplies in the distribution system, and result in a comparatively low local current that enables the use of printed circuit boards for the distribution board and load boards.
摘要翻译： 计算机箱可以设计成将电力从电源分配到负载单元（例如，处理器，存储设备或网络路由器）。 该架构可能会影响机箱内组件的效率，成本，模块化，可访问性和空间利用率。 这里提出的是配电架构，其涉及沿着壳体内的第一（例如，垂直）轴定向的配电板，包括配置成在沿第二（例如，横向）轴定向的一组负载板之间分配功率的功率互连 与沿着第三（例如矢状）轴定向的一组负载单元连接，以及一组沿着第三轴定向的电源。 该方向可以紧凑地并且靠近配电系统中的电源附近的负载，并且导致相对较低的局部电流，使得能够使用印刷电路板用于配电板和负载板。
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4.发明申请MANAGING COMPUTATIONAL WORKLOADS OF COMPUTING APPARATUSES POWERED BY RENEWABLE RESOURCES 有权管理由可再生资源供电的计算设备的计算工作量公开(公告)号：US20120065788A1
公开(公告)日：2012-03-15
申请号：US12881187
申请日：2010-09-14
CPC分类号： G06N7/005 , G01W1/10 , G06F1/3206 , G06F1/329 , Y02D10/24
摘要： A method described herein includes an act of receiving data that is indicative of predicted weather conditions for a particular geographic region, wherein the particular geographic region has an energy generation system therein, and wherein the energy generation system utilizes at least one renewable energy resource to generate electrical power. The method also includes the act of scheduling a computational workload for at least one computer in a data center based at least in part upon the data that is indicative of the predicted weather conditions for the particular geographic region.
摘要翻译： 本文描述的方法包括接收指示特定地理区域的预测天气条件的数据的动作，其中特定地理区域具有其中的能量生成系统，并且其中能量产生系统利用至少一个可再生能源来产生 电力。 该方法还包括至少部分地基于指示特定地理区域的预测天气条件的数据来调度数据中心中的至少一个计算机的计算工作负荷的动作。
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公开(公告)号：US07499281B2
公开(公告)日：2009-03-03
申请号：US11968520
申请日：2008-01-02
CPC分类号： H05K1/141 , H01L23/433 , H01L23/467 , H01L2924/0002 , H05K1/0203 , H05K1/0263 , H05K1/144 , H05K2201/10189 , H05K2201/1056 , H01L2924/00
摘要： Embodiments include apparatus, methods, and systems having a multi-chip module with a power system. An exemplary electronic module includes a printed circuit board (PCB) having a memory and plural processors. A power system couples to and is disposed vertically above the PCB. A thermal dissipation device is disposed between the power system and the PCB for dissipating heat, via a direct heat exchange, from both the power system and the plural processors.
摘要翻译： 实施例包括具有电力系统的多芯片模块的装置，方法和系统。 示例性电子模块包括具有存储器和多个处理器的印刷电路板（PCB）。 电力系统耦合到并垂直放置在PCB上方。 散热装置设置在电力系统和PCB之间，用于通过来自电力系统和多个处理器的直接热交换来散热。
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公开(公告)号：US07336490B2
公开(公告)日：2008-02-26
申请号：US10996721
申请日：2004-11-24
CPC分类号： H05K1/141 , H01L23/433 , H01L23/467 , H01L2924/0002 , H05K1/0203 , H05K1/0263 , H05K1/144 , H05K2201/10189 , H05K2201/1056 , H01L2924/00
摘要： Embodiments include apparatus, methods, and systems having a multi-chip module with a power system. An exemplary electronic module includes a printed circuit board (PCB) having a memory and plural processors. A power system couples to and is disposed vertically above the PCB. A thermal dissipation device is disposed between the power system and the PCB for dissipating heat, via a direct heat exchange, from both the power system and the plural processors.
摘要翻译： 实施例包括具有电力系统的多芯片模块的装置，方法和系统。 示例性电子模块包括具有存储器和多个处理器的印刷电路板（PCB）。 电力系统耦合到并垂直放置在PCB上方。 散热装置设置在电力系统和PCB之间，用于通过来自电力系统和多个处理器的直接热交换来散热。
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公开(公告)号：US07254027B2
公开(公告)日：2007-08-07
申请号：US11021504
申请日：2004-12-21
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , G06F2200/201 , H05K1/0203 , H05K1/0263 , H05K1/141 , H05K1/144 , H05K3/0061 , H05K2201/045 , H05K2201/064 , H05K2201/09054 , H05K2201/10189 , H05K2201/1056 , H05K2201/10689 , H05K2203/1572
摘要： Embodiments include apparatus, methods, and systems of a processor module for a system board. In one embodiment, an electronic module, having first and second portions, is removably connectable to the system board. The first portion connects to the system board and includes a thermal dissipation device and a printed circuit board (PCB) with a processor connected to a first side of the PCB. The thermal dissipation device dissipates heat, via a heat exchange, from the processor. The second portion is disposed in a space created between the first portion and the system board. The second portion has a power system board for providing power to the processor. The power system board extends adjacent and parallel to a second side of the PCB.
摘要翻译： 实施例包括用于系统板的处理器模块的装置，方法和系统。 在一个实施例中，具有第一和第二部分的电子模块可拆卸地连接到系统板。 第一部分连接到系统板，并且包括散热装置和印刷电路板（PCB），处理器连接到PCB的第一侧。 散热装置通过热交换从处理器散热。 第二部分设置在第一部分和系统板之间产生的空间中。 第二部分具有用于向处理器提供电力的电力系统板。 电源系统板相邻并平行于PCB的第二侧延伸。
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公开(公告)号：US07068515B2
公开(公告)日：2006-06-27
申请号：US10996478
申请日：2004-11-24
IPC分类号： H05K7/20
CPC分类号： H05K7/1092 , Y10T307/505
摘要： Embodiments include apparatus, methods, and systems having a multi-chip module with stacked redundant power. An exemplary apparatus has a module having plural processors. A first power system is coupled, in a vertically stacked configuration, to the module for providing power to the module. A second power system provides power to the module and is coupled, in a vertically stacked configuration, to the first power system. Each power system serves as a duplicate for preventing failure of the module upon failure of one of the power systems. A thermal dissipation device is disposed between both the first and second power systems and the first power system and module such that the thermal dissipation device dissipates heat, via heat exchange, away from the processors, the first power system, and the second power system.
摘要翻译： 实施例包括具有堆叠冗余电力的多芯片模块的装置，方法和系统。 示例性装置具有具有多个处理器的模块。 第一电力系统以垂直堆叠的配置耦合到模块以向模块提供电力。 第二电力系统向模块提供电力并且以垂直堆叠的配置耦合到第一电力系统。 每个电力系统作为一个副本，用于防止一个电力系统故障时模块的故障。 散热装置设置在第一和第二电力系统和第一电力系统和模块之间，使得散热装置通过热交换而散热，远离处理器，第一电力系统和第二电力系统。
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公开(公告)号：US09092209B2
公开(公告)日：2015-07-28
申请号：US13162603
申请日：2011-06-17
申请人： Suyash Sinha , Sreenivas Addagatla , Christian L. Belady , Charles Joseph Williams , Shaun L. Harris , Eric C. Peterson
发明人： Suyash Sinha , Sreenivas Addagatla , Christian L. Belady , Charles Joseph Williams , Shaun L. Harris , Eric C. Peterson
CPC分类号： G06F1/30 , G06F1/26 , G06F1/3206 , G06F21/81 , H04L63/102 , H04W4/60 , H05K7/1497 , Y02D70/00 , Y02D70/142 , Y02D70/144 , Y02D70/146 , Y02D70/164
摘要： A framework that enables a local computing cloud infrastructure for rural (and third world) populations with the ability to connect into the global cloud. The framework include is a low cost architecture of long distance, wireless based, renewable energy powered, and small datacenter (DC) (referred to as a pico-DC) nodes that can fully operate off-grid, both power-wise and Internet connection-wise at a very low cost. Additionally, the framework includes power management and storage techniques that effectively enable low power and efficient power use. Thus, systems are self-sufficient, low maintenance and weather proof with no need for power or data connections.
摘要翻译： 一个框架，使农村（和第三世界）人口的本地计算云基础设施能够连接到全球云。 该框架包括长距离，无线，可再生能源供电的低成本架构，以及能够完全运行离网的电力和互联网连接的小型数据中心（DC）（简称Pico-DC）节点 以非常低的成本。 此外，该框架还包括电源管理和存储技术，可有效实现低功耗和高效率的电力使用。 因此，系统是自给自足的，低维护性和防风雨性，不需要电源或数据连接。
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公开(公告)号：US20130342968A1
公开(公告)日：2013-12-26
申请号：US13530466
申请日：2012-06-22
申请人： Eric C. Peterson , Shaun L. Harris
发明人： Eric C. Peterson , Shaun L. Harris
CPC分类号： H02B1/015 , H05K1/0263 , H05K1/141 , H05K7/1457 , Y10T307/50 , Y10T307/582 , Y10T307/62
摘要： Computational enclosures may be designed to distribute power from power supplies to load units (e.g., processors, storage devices, or network routers). The architecture may affect the efficiency, cost, modularity, accessibility, and space utilization of the components within the enclosure. Presented herein are power distribution architectures involving a distribution board oriented along a first (e.g., vertical) axis within the enclosure, comprising a power interconnect configured to distribute power among a set of load boards oriented along a second (e.g., lateral) axis and respectively connecting with a set of load units oriented along a third (e.g., sagittal) axis, and a set of power supplies also oriented along the third axis. This orientation may compactly and proximately position the loads near the power supplies in the distribution system, and result in a comparatively low local current that enables the use of printed circuit boards for the distribution board and load boards.
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