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公开(公告)号：US08667684B2
公开(公告)日：2014-03-11
申请号：US12824504
申请日：2010-06-28
申请人： Sheng-Liang Dai , Jin-Peng Liu , Yue Liu , Sheng-Guo Zhou , Sheng-Lin Wu , Nien-Tien Cheng
发明人： Sheng-Liang Dai , Jin-Peng Liu , Yue Liu , Sheng-Guo Zhou , Sheng-Lin Wu , Nien-Tien Cheng
CPC分类号： F28D15/04 , F28D15/0233 , F28D15/046 , Y10T29/49353
摘要： An exemplary flat heat pipe includes a hollow, flattened casing and a first wick structure and a second wick structure received in the casing. The casing includes a top plate and a bottom plate opposite to the top plate. The first wick structure is formed by weaving wires, and the second wick structure is made of sintered metal powder. The first and second wick structures are disposed at inner sides of the bottom and top plates of the casing, respectively. The first and second wick structures contact each other. The casing defines two vapor channels at opposite lateral sides of the combined first and second wick structures, respectively. A method for manufacturing the heat pipe is also provided.
摘要翻译： 示例性的扁平热管包括中空的扁平壳体和容纳在壳体中的第一芯结构和第二芯体结构。 壳体包括顶板和与顶板相对的底板。 第一芯结构由编织线形成，第二芯结构由烧结金属粉末制成。 第一和第二芯结构分别设置在壳体的底板和顶板的内侧。 第一个和第二个灯芯结构相互接触。 壳体分别在组合的第一和第二芯结构的相对侧面分别限定两个蒸气通道。 还提供了一种用于制造热管的方法。
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公开(公告)号：US20100212870A1
公开(公告)日：2010-08-26
申请号：US12489418
申请日：2009-06-22
申请人： Sheng-Lin Wu , Hai-Ping Shen , Sheng-Liang Dai , Yu-Liang Lo , Nien-Tien Cheng
发明人： Sheng-Lin Wu , Hai-Ping Shen , Sheng-Liang Dai , Yu-Liang Lo , Nien-Tien Cheng
IPC分类号： F28D15/02
CPC分类号： F28D15/0233 , F28D15/046 , H01L23/427 , H01L23/49548 , H01L2924/0002 , H01L2924/00
摘要： A flat heat pipe includes a casing and a wick structure received in the casing. The casing has a first lateral portion and a second lateral portion. Each of the first lateral portion and the second lateral portion has a C-shape configuration, and the second lateral portion has an opening facing an opening of the first lateral portion. The wick structure is attached to an inner surface of only one of the first and lateral portions of the casing. The inner surface of the other of the first and second lateral portions without the wick structure attached thereto defines a first vapor channel, and an inner surface of the wick structure defines a second vapor channel. The first vapor channel has a height greater than the second vapor channel.
摘要翻译： 平坦的热管包括容纳在壳体中的壳体和芯结构。 壳体具有第一横向部分和第二横向部分。 第一横向部分和第二侧部分中的每一个具有C形构造，并且第二侧部具有面向第一侧部的开口的开口。 芯结构附接到壳体的第一和侧部中的仅一个的内表面。 第一和第二侧部中另一个的内表面没有附着的芯结构限定了第一蒸汽通道，并且芯结构的内表面限定了第二蒸气通道。 第一蒸气通道的高度大于第二蒸气通道。
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3.发明授权Heat pipe including a main wick structure and at least one auxiliary wick structure 有权热管包括主芯结构和至少一个辅助灯芯结构公开(公告)号：US08622117B2
公开(公告)日：2014-01-07
申请号：US12491246
申请日：2009-06-25
申请人： Sheng-Lin Wu , Yu-Liang Lo , Wen-Hu Chen , Yue Liu , Nien-Tien Cheng
发明人： Sheng-Lin Wu , Yu-Liang Lo , Wen-Hu Chen , Yue Liu , Nien-Tien Cheng
IPC分类号： F28D15/00
CPC分类号： B21D53/02 , B23P15/26 , B23P2700/09 , F28D15/0233 , F28D15/046
摘要： A heat pipe includes a casing, a main wick structure received in the casing, an auxiliary wick structure received in the main wick structure, and a working fluid contained in the casing. The main wick structure is attached to an inner surface of the casing. An inner peripheral surface of the main wick structure and an outer peripheral surface of the auxiliary wick structure cooperatively define a vapor channel. The auxiliary wick structure is hollow, and extends along a longitudinal direction of the casing. A liquid channel is defined in the auxiliary wick structure. Two ends of the auxiliary wick structure are both fixed on the two ends of the casing. The working fluid is saturated in the main wick structure and the auxiliary wick structure.
摘要翻译： 热管包括壳体，容纳在壳体中的主芯结构，容纳在主芯结构中的辅助芯结构以及容纳在壳体中的工作流体。 主芯结构附接到壳体的内表面。 主芯结构的内周表面和辅助芯结构的外周表面协同地限定蒸气通道。 辅助油绳结构是中空的，并且沿壳体的纵向方向延伸。 在辅助油绳结构中限定了液体通道。 辅助油绳结构的两端都固定在壳体的两端。 工作油在主油芯结构和辅助油绳结构中饱和。
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公开(公告)号：US07381346B2
公开(公告)日：2008-06-03
申请号：US11521918
申请日：2006-09-15
申请人： Ching-Tai Cheng , Nien-Tien Cheng
发明人： Ching-Tai Cheng , Nien-Tien Cheng
CPC分类号： H01L23/42 , F28F13/00 , F28F2013/006 , H01L23/3737 , H01L2924/0002 , H01L2924/00
摘要： A thermal interface material is for being applied to the contact surfaces to eliminate the air interstices between the heat dissipating apparatus and the electronic component in order to improve heat dissipation of the electronic component. The thermal interface material includes pentaerythritol oleate as base oil and fillers filled in the pentaerythritol oleate for improving the heat conductivity of the thermal interface material. The pentaerythritol oleate is used for holding the fillers therein and filling the air interstices to achieve an intimate contact between the heat dissipating apparatus and the electronic component. The fillers include aluminum powders, zinc oxide powders and zinc oxide nano-particles.
摘要翻译： 热界面材料用于施加到接触表面以消除散热装置和电子部件之间的空气间隙，以便改善电子部件的散热。 热界面材料包括作为基础油的季戊四醇油酸酯和填充在油酸季戊四醇酯中的填料，用于改善热界面材料的导热性。 油酸季戊四醇用于保持其中的填料并填充空气间隙以实现散热装置和电子部件之间的紧密接触。 填料包括铝粉，氧化锌粉和氧化锌纳米颗粒。
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公开(公告)号：US06418393B1
公开(公告)日：2002-07-09
申请号：US09221648
申请日：1998-12-28
申请人： Chun-Hsin Lu , Pao-Lung Lin , Nien-Tien Cheng
发明人： Chun-Hsin Lu , Pao-Lung Lin , Nien-Tien Cheng
IPC分类号： G01K100
CPC分类号： G01M99/002
摘要： An inspecting device for a thermal module for cooling a CPU of a computer to decide whether the module can work properly is disclosed. The device includes a computer stored with preset data. A measuring unit has a heater generating heat with a predetermined temperature. A converter electrically connects the heater with the computer and converts an analogous signal corresponding to the temperature of the heater to a digital signal which is sent to the computer. A force generating mechanism is provided on the measuring unit which can generate a pressing force toward the heater. When the heater is contact with a heat-generating component contact part of the thermal module and the force generating mechanism is activated to press the part against the heater, the computer compares the data stored therein and the signal received from the converter to determine whether the thermal module can attain its required performance.
摘要翻译： 公开了一种用于冷却计算机的CPU以确定模块是否能正常工作的热模块的检查装置。 该设备包括存储有预设数据的计算机。 测量单元具有产生具有预定温度的热量的加热器。 A转换器将加热器与计算机电连接并将对应于加热器的温度的类似信号转换为发送到计算机的数字信号。 力产生机构设置在测量单元上，该力可以产生朝向加热器的按压力。 当加热器与热模块的发热部件接触部分接触并且力产生机构被激活以将部件压靠在加热器上时，计算机将存储在其中的数据和从转换器接收的信号进行比较，以确定是否 热模块可以达到要求的性能。
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6.发明授权Manufacturing method of a heat dissipation device with guiding lines and soldered heat pipes 有权具有引导线和焊接热管的散热装置的制造方法公开(公告)号：US08578605B2
公开(公告)日：2013-11-12
申请号：US13487274
申请日：2012-06-04
IPC分类号： B21D53/02
CPC分类号： H01L23/427 , F28D15/0275 , H01L23/467 , H01L2924/0002 , H05K7/20318 , Y10T29/4935 , H01L2924/00
摘要： An exemplary method of manufacturing a heat dissipation device includes, firstly, providing a heat pipe including a condenser section having a planar outer surface, and providing a heat sink including a supporting surface defining a guiding line. The guiding line has a width smaller than a width of the outer surface of the condenser section. Next, an amount solder is spread on the supporting surface along the guiding line to form a solder layer on the supporting surface. The solder layer has a size not larger than a size of the outer surface of the condenser section. Then the outer surface of condenser section of the heat pipe is attached to the solder layer on the supporting surface of the heat sink.
摘要翻译： 制造散热装置的一个典型的方法包括：首先，提供一种包括具有平坦外表面的冷凝器部分的热管，以及提供包括限定引导线的支撑表面的散热器。 引导线的宽度小于冷凝器部分的外表面的宽度。 接下来，沿着引导线在支撑表面上扩展焊料量，以在支撑表面上形成焊料层。 焊料层的尺寸不大于冷凝器部分的外表面的尺寸。 然后将热管的冷凝器部分的外表面附着在散热片的支撑表面上的焊料层上。
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7.发明授权公开(公告)号：US07869215B2
公开(公告)日：2011-01-11
申请号：US12506214
申请日：2009-07-20
申请人： Jui-Wen Hung , Nien-Tien Cheng , Ping-Yang Chuang
发明人： Jui-Wen Hung , Nien-Tien Cheng , Ping-Yang Chuang
CPC分类号： G06F1/203
摘要： An electronic device includes a casing, an electronic component received in the casing, and a fixing member. The casing includes a cutout defined in a side wall thereof for assembly or disassembly a heat dissipation member into or out of the electronic device. The fixing member is connected to the top wall of the casing. The fixing member includes an elongated pole, a guiding pole connected to an outer end of the elongated pole and located adjacent to the cutout, and a resilient element at an inner end of the elongated pole and located over the electronic component. The resilient element is compressed and abuts the heat dissipation member when the heat dissipation member is assembled into the electronic device to contact with the electronic component.
摘要翻译： 电子设备包括壳体，容纳在壳体中的电子部件和固定部件。 壳体包括限定在其侧壁中的切口，用于将散热构件组装或拆卸到电子设备中或从电子设备排出。 固定构件连接到壳体的顶壁。 固定构件包括细长杆，连接到细长杆的外端并邻近切口定位的引导杆，以及位于细长杆的内端处并位于电子部件上方的弹性元件。 当散热构件组装到电子设备中以与电子部件接触时，弹性元件被压缩并邻接散热构件。
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公开(公告)号：US07541403B2
公开(公告)日：2009-06-02
申请号：US11309611
申请日：2006-08-31
申请人： Ching-Tai Cheng , Nien-Tien Cheng
发明人： Ching-Tai Cheng , Nien-Tien Cheng
IPC分类号： C08K3/22
CPC分类号： C08L83/08 , C08K3/10 , C08K3/22 , Y10T428/25 , Y10T428/256 , Y10T428/257 , Y10T428/2982 , Y10T428/31663 , C08L83/00
摘要： A thermal interface material includes 100 parts by weight of base oil including amino-modified silicone fluid and at least one of methylphenylsilicone fluid and fluorosilicone fluid, and 800 to 1200 parts by weight of fillers filled in the base oil. The fillers have an average particle size of 0.1 to 5 um and are selected from the group consisting of zinc oxide powder, alumina powder and metallic aluminum powder.
摘要翻译： 热界面材料包括100重量份的基础油，包括氨基改性的硅氧烷流体和甲基苯基硅酮流体和氟硅酮流体中的至少一种，以及填充在基础油中的800至1200重量份的填料。 填料的平均粒径为0.1-5μm，选自氧化锌粉末，氧化铝粉末和金属铝粉末。
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公开(公告)号：US07537049B2
公开(公告)日：2009-05-26
申请号：US11309817
申请日：2006-10-03
申请人： Nien-Tien Cheng , Chen-Shen Lin
发明人： Nien-Tien Cheng , Chen-Shen Lin
CPC分类号： H01L23/427 , F28D15/0266 , F28D15/0275 , G06F1/20 , H01L23/3672 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation apparatus (10) includes a computer enclosure (110) made of thermally conductive material, a fin assembly (140) secured to the computer enclosure, and a heat pipe (130) having an evaporating section (131) thermally connecting with a heat generating electronic component and a condensing section (132) thermally connecting with the fin assembly. The fin assembly has a bottom surface contacting with a chassis of the enclosure to thereby transfer heat from the fin assembly to the chassis for dissipation. The enclosure forms a pair of clamping members (111) clamping the fin assembly therebetween.
摘要翻译： 散热装置（10）包括由导热材料制成的计算机外壳（110），固定到计算机外壳的翅片组件（140），以及具有与 发热电子部件和与散热片组件热连接的冷凝部分（132）。 翅片组件具有与外壳的底盘接触的底面，从而将热量从翅片组件传递到底盘以便耗散。 外壳形成一对夹紧翅片组件的夹紧件（111）。
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10.发明授权公开(公告)号：US08245763B2
公开(公告)日：2012-08-21
申请号：US12558602
申请日：2009-09-14
CPC分类号： H01L23/427 , F28D15/0275 , H01L23/467 , H01L2924/0002 , H05K7/20318 , Y10T29/4935 , H01L2924/00
摘要： A heat dissipation device includes a heat pipe and a heat sink. The heat pipe includes a condenser section and an evaporator section. The condenser section has a planar outer surface. The heat sink includes a supporting surface for contacting the outer surface of the condenser section. A guiding line is defined in the supporting surface for spreading a solder therealong. The guiding line has a width smaller than a width of the outer surface of the condenser section. The condenser section of the heat pipe is mounted on the supporting surface of the heat sink along the guiding line and firmly connected to the heat sink by the solder.
摘要翻译： 散热装置包括热管和散热器。 热管包括冷凝器部分和蒸发器部分。 冷凝器部分具有平坦的外表面。 散热器包括用于接触冷凝器部分的外表面的支撑表面。 引导线被限定在用于在其上铺展焊料的支撑表面中。 引导线的宽度小于冷凝器部分的外表面的宽度。 热管的冷凝器部分沿着引导线安装在散热器的支撑表面上，并通过焊料牢固地连接到散热器。
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