摘要:
A base layer is formed on an insulating substrate, and a semiconductor layer is formed in localized fashion thereon. A gate insulating film is then formed so as to cover the semiconductor layer, and a gate electrode is formed on a portion of the gate insulating film. An impurity is then implanted into the semiconductor layer via the gate insulating film, and a source region, a drain region, and an LDD region are formed. The gate insulating film is etched with dilute hydrofluoric acid. An electrode-protecting insulating film is then formed so as to cover the gate electrode, and the entire surface of the surface layer portion of the electrode-protecting insulating film is etched away using dilute hydrofluoric acid. Carrier traps introduced into the electrode-protecting insulating film and the gate insulating film are thereby removed.
摘要:
A base layer is formed on an insulating substrate, and a semiconductor layer is formed in localized fashion thereon. A gate insulating film is then formed so as to cover the semiconductor layer, and a gate electrode is formed on a portion of the gate insulating film. An impurity is then implanted into the semiconductor layer via the gate insulating film, and a source region, a drain region, and an LDD region are formed. The gate insulating film is etched with dilute hydrofluoric acid. An electrode-protecting insulating film is then formed so as to cover the gate electrode, and the entire surface of the surface layer portion of the electrode-protecting insulating film is etched away using dilute hydrofluoric acid. Carrier traps introduced into the electrode-protecting insulating film and the gate insulating film are thereby removed.
摘要:
A base layer is formed on an insulating substrate, and a semiconductor layer is formed in localized fashion thereon. A gate insulating film is then formed so as to cover the semiconductor layer, and a gate electrode is formed on a portion of the gate insulating film. An impurity is then implanted into the semiconductor layer via the gate insulating film, and a source region, a drain region, and an LDD region are formed. The gate insulating film is etched with dilute hydrofluoric acid. An electrode-protecting insulating film is then formed so as to cover the gate electrode, and the entire surface of the surface layer portion of the electrode-protecting insulating film is etched away using dilute hydrofluoric acid. Carrier traps introduced into the electrode-protecting insulating film and the gate insulating film are thereby removed.
摘要:
A thin-film transistor manufactured on a transparent substrate has a structure of a top gate type crystalline silicon thin-film transistor in which a light blocking film, a base layer, a crystalline silicon film, a gate insulating film, and a gate electrode film arranged not to overlap at least a channel region are sequentially formed on the transparent substrate. The channel region has channel length L, LDD regions having LDD length d on both sides of the channel region, a source region, and a drain region are formed in the crystalline silicon film. The light blocking film is divided across the channel region. Interval x between the divided light blocking films is equal to or larger than channel length L and equal to or smaller than a sum of channel length L and a double of LDD length d (L+2d), allowing low the manufacturing cost and suppressed photo leak current.
摘要:
A thin film transistor (TFT) substrate includes first and second TFTs on the same substrate. The first TFT has a feature that a lower conductive layer or a bottom gate electrode layer is provided between the substrate and a first insulating layer while an upper conductive layer or a top gate electrode layer is disposed on a second insulating layer formed on a semiconductor layer which is formed on the first insulating layer. The first conductive layer has first and second areas such that the first area overlaps with the first conductive layer without overlapping with the semiconductor layer while the second area overlaps with the semiconductor layer, and the first area is larger than the second area while the second insulating layer is thinner than the first insulating layer. The second TFT has the same configuration as the first TFT except that the gate electrode layer is eliminated.
摘要:
Recognizing the phenomenon that the film thickness of a semiconductor layer causes shift in the OFF-leak current characteristic that corresponds to back-gate voltage of a thin-film transistor, the average film thickness of a semiconductor layer is prescribed such that the shift of the OFF-leak current characteristic is reduced. Alternatively, the film thickness distribution (the ratio of the occurrence of each region having different film thickness) in the direction of the channel width of the semiconductor layer is prescribed.
摘要:
Recognizing the phenomenon that the film thickness of a semiconductor layer causes shift in the OFF-leak current characteristic that corresponds to back-gate voltage of a thin-film transistor, the average film thickness of a semiconductor layer is prescribed such that the shift of the OFF-leak current characteristic is reduced. Alternatively, the film thickness distribution (the ratio of the occurrence of each region having different film thickness) in the direction of the channel width of the semiconductor layer is prescribed.
摘要:
The present invention provides a magnetic recording apparatus including a magnetic recording medium and a magneto-resistance effect (MR) element opposing to the magnetic recording medium, so that an information recorded on the magnetic recording medium is reproduced via the MR element, wherein if it is assumed that the MR element has a sheet resistance &rgr;s, the magnetic recording medium has a sheet resistance &rgr;s′, and the magnetic recording medium generates a medium magnetic field having a resistance change ratio P, then the values &rgr;s, &rgr;s′, and P are set to satisfy the relationship as follows: &rgr;s′>&rgr;s/P.
摘要:
A performance evaluation method of an MR head whereby resolution performance of an MR head can be estimated, an isolated repreoduction wave form V(t) of the MR head is approximated by an equation V(t)=1/(1+(2t/PW50).sup.P), t denoting time difference from a timing which gives a peak value of the isolated reproduction wave form V(t), and PW50 denoting a half-peak-width where the isolated reproduction wave form V(t) shows more than 50% of the peak value. The resolution performance of the MR head is evaluated according to the order value P of the above equation which gives the most likelihood approximation of the isolated wave form, together with the half-peak-width PW50 relative to a minimum bit-interval to be reproduced by the MR head.
摘要:
A liquid crystal display includes pixels arrayed in a matrix of rows and columns, scanning lines extending along the rows of the pixels, signal lines extending along the columns of the pixels, and pixel driving sections which are disposed near intersections of the scanning lines and signal lines, and each of which is controlled via one scanning line to capture a data signal on one signal line and output the data signal to one pixel. Particularly, each pixel driving section includes a memory circuit having a transistor whose gate is connected to the one signal line, and first and second storage capacitances which are charged to positive and negative power supply voltages and connected to a source and drain of the transistor to store the data signal as analog drive voltages of positive and negative polarities, respectively.