摘要:
A three-dimensional ultrasonic inspection apparatus includes: an ultrasonic transducer disposed m×n piezoelectric vibrators in a matrix; a signal processing device to receive, detect an echo, and generate a three-dimensional image data by processing an electric signal of the echo detected; and a display processing device to display a result of processing the three-dimensional image data generated by the signal processing device, wherein the display processing device includes a peak detecting unit to detect a first peak and a second peak of an intensity distribution of the three-dimensional image data in a depth (z) direction, a joint portion image creation unit to create a three-dimensional image of the joined area by mapping z direction distance of the first peak and the second peak to x-y plane, a determination unit to determine whether the joined area is sound or not, and a display unit to display the three-dimensional image and the determination result of the joined area.
摘要:
A three-dimensional ultrasonic inspection apparatus includes: an ultrasonic transducer disposed m×n piezoelectric vibrators in a matrix; a signal processing device to receive, detect an echo, and generate a three-dimensional image data by processing an electric signal of the echo detected; and a display processing device to display a result of processing the three-dimensional image data generated by the signal processing device, wherein the display processing device includes a peak detecting unit to detect a first peak and a second peak of an intensity distribution of the three-dimensional image data in a depth (z) direction, a joint portion image creation unit to create a three-dimensional image of the joined area by mapping z direction distance of the first peak and the second peak to x-y plane, a determination unit to determine whether the joined area is sound or not, and a display unit to display the three-dimensional image and the determination result of the joined area.
摘要:
A three-dimensional ultrasonic inspection apparatus 10 can make increased inspection accuracy in comparison to the conventional apparatus and includes: an ultrasonic transducer 11 disposed m×n piezoelectric vibrators in a matrix; a signal processing unit 17 to receive, detect an echo, and generate a three-dimensional image data by processing an electric signal of the echo detected; a peak detecting element 51, 52 to detect a first peak and a second peak of an intensity distribution of the three-dimensional image data in a depth (z) direction; a joint portion image creation unit 36 to create a three-dimensional image of the joined area 15 by mapping z direction distance of the first peak and the second peak to x-y plane; a determination unit 37 to determine whether the joined area 15 is sound by two-step determination; and a display unit 38 to display the three-dimensional image and the determination result, of the joined area 15.
摘要:
A three-dimensional ultrasonic inspection apparatus 10 can make increased inspection accuracy in comparison to the conventional apparatus and includes: an ultrasonic transducer 11 disposed m×n piezoelectric vibrators in a matrix; a signal processing unit 17 to receive, detect an echo, and generate a three-dimensional image data by processing an electric signal of the echo detected; a peak detecting element 51, 52 to detect a first peak and a second peak of an intensity distribution of the three-dimensional image data in a depth (z) direction; a joint portion image creation unit 36 to create a three-dimensional image of the joined area 15 by mapping z direction distance of the first peak and the second peak to x-y plane; a determination unit 37 to determine whether the joined area 15 is sound by two-step determination; and a display unit 38 to display the three-dimensional image and the determination result, of the joined area 15.
摘要:
A semiconductor device (10) includes a support substrate (14), an adhered device part (11) adhered to the support substrate (14), a multilayer device part (13) stacked on the adhered device part (11), and an adjacent device part (12) formed in a region adjacent to the adhered device part on the support substrate (14). The adhered device part (11), the multilayer device part (13), and the adjacent device part (12) are electrically connected to one another.
摘要:
The present invention provides a semiconductor device having a plurality of MOS transistors with controllable threshold values in the same face and easy to manufacture, a manufacturing method thereof and a display device. The invention is a semiconductor device having a plurality of MOS transistors in the same face each having a structure formed by stacking a semiconductor active layer, a gate insulator, and a gate electrode, wherein the semiconductor device includes: an insulating layer stacked on a side opposite to a gate electrode side of the semiconductor active layer; and a conductive electrode stacked on a side opposite to a semiconductor active layer side of the insulating layer and extending over at least two of the plurality of MOS transistors.
摘要:
A method is disclosed for producing a semiconductor device produced by (i) doping hydrogen ions or rare gas ions into a device substrate in which a transfer layer (16) is formed, (ii) then bonding the device substrate to a carrier target substrate, and (iii) transferring the transfer layer (16) onto the carrier substrate (30) by cleaving the device substrate along a portion in which the hydrogen ions or the rare gas ions are doped, the method including providing a blocking layer (11) for blocking diffusion of a bubble-causing substance between (i) a bonding surface (13), which serves as a bonding interface between the device substrate and the carrier substrate, and (ii) the transfer layer (16). This prevents bubbles from forming at the bonding interface between the semiconductor substrate and the target substrate due to the diffusion of the bubble-causing substance.
摘要:
An initial crystallization method of a recording medium such as a phase-change optical disk, which comprises forming a light spot composed of at least two flat elliptical beam spots each having a long axis direction and a short axis direction and irradiating a rotating recording medium with the light spot such that the long axis direction of the beam spots becomes other direction than the parallel direction to the track direction of the recording medium, wherein the above-described light spot has at least two peaks of light intensity in the short axis direction and the interval of said two peaks of light intensity is 10 &mgr;m or smaller but not smaller than 2 &mgr;m, and a device for carrying out the initial crystallization method. By the initial crystallization method and the device thereof, the initial crystallization of the recording film of the recording medium can be surely carried out at a high speed without causing non-uniformity.
摘要:
The present invention is intended to provide a glass substrate (20), made of an insulating material, which can constitute a semiconductor apparatus (10) by transferring a single crystal silicon film (50) or a substrate including a semiconductor device onto a surface (24) of the insulating substrate, a transferred surface (26) being part of the surface (24), the single crystal silicon film (50) capable of being provided on the transferred surface (26), and the transferred surface (26) having an arithmetic mean roughness of not more than 0.4 nm.
摘要:
Disclosed is a semiconductor device including a substrate for bonding (10a), and a semiconductor element part (25aa) which is bonded to the substrate (10a), and in which an element pattern (T) is formed, wherein in a bonded interface between the substrate (10a) and the semiconductor element part (25aa), recessed portions (23a) are formed in at least one of the substrate (10a) and the semiconductor element part (25aa).