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1.发明申请ELECTRONIC DEVICE PACKAGE WITH ELECTROMAGNETIC COMPATIBILITY (EMC) COATING THEREON 有权具有电磁兼容性（EMC）涂层的电子器件封装公开(公告)号：US20100006965A1
公开(公告)日：2010-01-14
申请号：US12170857
申请日：2008-07-10
IPC分类号： H01L31/0203
CPC分类号： H01L27/14618 , H01L27/14625 , H01L2224/0554 , H01L2224/05548 , H01L2224/05573 , H01L2224/13 , H01L2924/00014 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： Electronic device packages with electromagnetic compatibility (EMC) coating thereon are presented. An electronic device package includes a chip scale package having a CMOS image sensor (CIS) array chip and a set of lenses configured with an aperture. An encapsulation is molded overlying the chip scale package. A shield is atop the encapsulation. A frame fixes the set of lenses to the encapsulation. An electromagnetic compatibility (EMC) coating is formed on the encapsulation to prevent electromagnetic interference.
摘要翻译： 提供了具有电磁兼容性（EMC）涂层的电子器件封装。 一种电子器件封装包括具有CMOS图像传感器（CIS）阵列芯片的芯片级封装以及配置有孔径的一组透镜。 将封装模制在芯片级封装上。 屏蔽是封装的顶部。 一个框架将该组透镜固定到封装。 在封装上形成电磁兼容（EMC）涂层，以防止电磁干扰。
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2.发明授权Electronic device package with electromagnetic compatibility (EMC) coating thereon 有权具有电磁兼容性（EMC）涂层的电子器件封装公开(公告)号：US07964936B2
公开(公告)日：2011-06-21
申请号：US12170857
申请日：2008-07-10
IPC分类号： H01L23/552
CPC分类号： H01L27/14618 , H01L27/14625 , H01L2224/0554 , H01L2224/05548 , H01L2224/05573 , H01L2224/13 , H01L2924/00014 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： Electronic device packages with electromagnetic compatibility (EMC) coating thereon are presented. An electronic device package includes a chip scale package having a CMOS image sensor (CIS) array chip and a set of lenses configured with an aperture. An encapsulation is molded overlying the chip scale package. A shield is atop the encapsulation. A frame fixes the set of lenses to the encapsulation. An electromagnetic compatibility (EMC) coating is formed on the encapsulation to prevent electromagnetic interference.
摘要翻译： 提供了具有电磁兼容性（EMC）涂层的电子器件封装。 一种电子器件封装包括具有CMOS图像传感器（CIS）阵列芯片的芯片级封装以及配置有孔径的一组透镜。 将封装模制在芯片级封装上。 屏蔽是封装的顶部。 一个框架将该组透镜固定到封装。 在封装上形成电磁兼容（EMC）涂层，以防止电磁干扰。
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公开(公告)号：US08355628B2
公开(公告)日：2013-01-15
申请号：US12399706
申请日：2009-03-06
IPC分类号： G03B17/02 , G03B13/34 , H01L31/0232
CPC分类号： G03B17/00 , H04N5/2253 , H04N5/2254 , H04N5/2257
摘要： The invention provides a compact camera module. The compact camera module includes an image sensing device, a set of optical elements, and a zooming device. The set of optical elements connects to the image sensing device, and comprises a lens set. The zooming device connects to the set of optical elements for adjusting a distance between the lens set and the image sensing device. The zooming device directly electrically joins with the image sensing device.
摘要翻译： 本发明提供了一种紧凑的相机模块。 紧凑型相机模块包括图像感测装置，一组光学元件和变焦装置。 该组光学元件连接到图像感测装置，并且包括透镜组。 变焦装置连接到一组光学元件，用于调整透镜组和图像感测装置之间的距离。 变焦装置与图像感测装置直接电连接。
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公开(公告)号：US08854526B2
公开(公告)日：2014-10-07
申请号：US12244431
申请日：2008-10-02
CPC分类号： H04N5/2252 , G03B17/00
摘要： The invention provides an image sensor device. The image sensor device includes a chip package and an opaque coating. The chip package includes an image sensor array chip, wherein a set of optical elements connect to the image sensor array chip, and an outer frame shielding the optical elements. The opaque coating overlies the outer frame.
摘要翻译： 本发明提供一种图像传感器装置。 图像传感器装置包括芯片封装和不透明涂层。 芯片封装包括图像传感器阵列芯片，其中一组光学元件连接到图像传感器阵列芯片，以及屏蔽光学元件的外部框架。 不透明涂层覆盖在外框架上。
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公开(公告)号：US09350906B2
公开(公告)日：2016-05-24
申请号：US12465092
申请日：2009-05-13
CPC分类号： H04N5/2254 , G03B19/00
摘要： The invention provides an encapsulant module for an image sensor device. The module includes an outer frame, a set of optical elements, and an opaque coating. The outer frame includes an enclosing wall and a first opening surrounded by the enclosing wall. The set of optical elements connects to and is disposed in the enclosing wall. The opaque coating overlies the enclosing wall.
摘要翻译： 本发明提供了一种用于图像传感器装置的密封剂模块。 该模块包括外框架，一组光学元件和不透明涂层。 外框包括封闭壁和由封闭壁包围的第一开口。 该组光学元件连接并设置在封闭壁中。 不透明涂层覆盖封闭壁。
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公开(公告)号：US07826148B2
公开(公告)日：2010-11-02
申请号：US11706192
申请日：2007-02-15
CPC分类号： B29D11/00019 , B29D11/00375
摘要： Aspheric lens structures with dual aspheric surfaces and fabrication methods thereof are disclosed. An aspheric lens structure includes a first lens component with an aspheric top surface disposed on a second lens component, wherein the interface between the first lens component and the second lens component is spherical. The second lens component includes an aspheric back surface, wherein the radius of curvature of the aspheric top surface of the first lens component is different than the radius of curvature of the aspheric back surface of the second lens component. The second lens component may also include a planar back surface with a third lens component disposed on the planar back surface of the second component. The third lens component includes an aspheric back surface, wherein the radius of curvature of the aspheric top surface of the first lens component is different than the radius of curvature of the aspheric back surface of the third lens component.
摘要翻译： 公开了具有双非球面表面的非球面透镜结构及其制造方法。 非球面透镜结构包括具有设置在第二透镜部件上的非球面顶表面的第一透镜部件，其中第一透镜部件和第二透镜部件之间的界面是球形的。 第二透镜部件包括非球面后表面，其中第一透镜部件的非球面上表面的曲率半径不同于第二透镜部件的非球面后表面的曲率半径。 第二透镜部件还可以包括平面后表面，其中第三透镜部件设置在第二部件的平面后表面上。 第三透镜部件包括非球面后表面，其中第一透镜部件的非球面顶表面的曲率半径不同于第三透镜部件的非球面后表面的曲率半径。
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7.发明授权公开(公告)号：US07679167B2
公开(公告)日：2010-03-16
申请号：US11707110
申请日：2007-02-16
IPC分类号： H01L23/552
CPC分类号： H04N5/335 , H01L27/14618 , H01L27/14683 , H01L2224/05001 , H01L2224/05008 , H01L2224/05548 , H01L2224/05569 , H01L2224/10 , H01L2924/00014 , H04N5/2254 , H04N5/2257 , H01L2224/05599 , H01L2224/05099
摘要： A package module for an image sensor device is disclosed. The package module comprises a device chip disposed between lower and upper substrates. A first conductive layer is over a first sidewall of the lower substrate and insulated from the device chip. A first protective layer is on the first conductive layer and exposes a portion of the first conductive layer over the first sidewall of the lower substrate. A first pad is on the bottom surface of the lower substrate and is electrically connected to the first conductive layer. The invention also discloses an electronic assembly for an image sensor device and a fabrication method thereof.
摘要翻译： 公开了一种用于图像传感器装置的封装模块。 封装模块包括设置在下基板和上基板之间的器件芯片。 第一导电层在下基板的第一侧壁上方并且与器件芯片绝缘。 第一保护层在第一导电层上，并且将第一导电层的一部分暴露在下基板的第一侧壁上。 第一焊盘在下基板的底表面上并且电连接到第一导电层。 本发明还公开了一种用于图像传感器装置的电子组件及其制造方法。
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公开(公告)号：US07928458B2
公开(公告)日：2011-04-19
申请号：US12173565
申请日：2008-07-15
申请人： Tzu-Han Lin , Jui-Ping Weng , Shin-Chang Shiung
发明人： Tzu-Han Lin , Jui-Ping Weng , Shin-Chang Shiung
IPC分类号： H01L33/00
CPC分类号： H01L33/507 , H01L33/46 , H01L33/486 , H01L33/58 , H01L33/62 , H01L2224/48091 , H01L2924/10253 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： A semiconductor device is disclosed. The semiconductor device comprises a light-emitting diode chip disposed in a cavity of a semiconductor substrate. At least two isolated outer wiring layers are disposed on the bottom surface of the semiconductor substrate and are electrically connected to the light-emitting diode chip, serving as input terminals. A lens module is adhered to the top surface of the semiconductor substrate to cap the cavity, in which the lens module comprises a molded lens and a molded fluorescent layer thereunder and the molded fluorescent layer faces the light-emitting diode chip. A method for fabricating the semiconductor devices is also disclosed.
摘要翻译： 公开了一种半导体器件。 半导体器件包括设置在半导体衬底的空腔中的发光二极管芯片。 至少两个隔离的外部布线层设置在半导体衬底的底表面上，并且与用作输入端子的发光二极管芯片电连接。 透镜模块粘附到半导体衬底的顶表面以盖住空腔，其中透镜模块包括模制透镜和其下的模制荧光层，并且模制的荧光层面向发光二极管芯片。 还公开了一种用于制造半导体器件的方法。
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公开(公告)号：US20100012957A1
公开(公告)日：2010-01-21
申请号：US12173565
申请日：2008-07-15
申请人： Tzu-Han LIN , Jui-Ping Weng , Shin-Chang Shiung
发明人： Tzu-Han LIN , Jui-Ping Weng , Shin-Chang Shiung
IPC分类号： H01L33/00
CPC分类号： H01L33/507 , H01L33/46 , H01L33/486 , H01L33/58 , H01L33/62 , H01L2224/48091 , H01L2924/10253 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： A semiconductor device is disclosed. The semiconductor device comprises a light-emitting diode chip disposed in a cavity of a semiconductor substrate. At least two isolated outer wiring layers are disposed on the bottom surface of the semiconductor substrate and are electrically connected to the light-emitting diode chip, serving as input terminals. A lens module is adhered to the top surface of the semiconductor substrate to cap the cavity, in which the lens module comprises a molded lens and a molded fluorescent layer thereunder and the molded fluorescent layer faces the light-emitting diode chip. A method for fabricating the semiconductor devices is also disclosed.
摘要翻译： 公开了一种半导体器件。 半导体器件包括设置在半导体衬底的空腔中的发光二极管芯片。 至少两个隔离的外部布线层设置在半导体衬底的底表面上，并且与用作输入端子的发光二极管芯片电连接。 透镜模块粘附到半导体衬底的顶表面以盖住空腔，其中透镜模块包括模制透镜和其下的模制荧光层，并且模制的荧光层面向发光二极管芯片。 还公开了一种用于制造半导体器件的方法。
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公开(公告)号：US20080198481A1
公开(公告)日：2008-08-21
申请号：US11706192
申请日：2007-02-15
CPC分类号： B29D11/00019 , B29D11/00375
摘要： Aspheric lens structures with dual aspheric surfaces and fabrication methods thereof are disclosed. An aspheric lens structure includes a first lens component with an aspheric top surface disposed on a second lens component, wherein the interface between the first lens component and the second lens component is spherical. The second lens component includes an aspheric back surface, wherein the radius of curvature of the aspheric top surface of the first lens component is different than the radius of curvature of the aspheric back surface of the second lens component. The second lens component may also include a planar back surface with a third lens component disposed on the planar back surface of the second component. The third lens component includes an aspheric back surface, wherein the radius of curvature of the aspheric top surface of the first lens component is different than the radius of curvature of the aspheric back surface of the third lens component.
摘要翻译： 公开了具有双非球面表面的非球面透镜结构及其制造方法。 非球面透镜结构包括具有设置在第二透镜部件上的非球面顶表面的第一透镜部件，其中第一透镜部件和第二透镜部件之间的界面是球形的。 第二透镜部件包括非球面后表面，其中第一透镜部件的非球面上表面的曲率半径不同于第二透镜部件的非球面后表面的曲率半径。 第二透镜部件还可以包括平面后表面，其中第三透镜部件设置在第二部件的平面后表面上。 第三透镜部件包括非球面后表面，其中第一透镜部件的非球面顶表面的曲率半径不同于第三透镜部件的非球面后表面的曲率半径。
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