SUBSTRATE AND METHOD FOR PRODUCING THE SAME
    1.
    发明公开

    公开(公告)号:US20230398655A1

    公开(公告)日:2023-12-14

    申请号:US18333125

    申请日:2023-06-12

    IPC分类号: B24B7/22

    CPC分类号: B24B7/228

    摘要: Proposed herein is a method for producing a substrate suitable for mask blanks for EUVL and the method being capable of suppressing a concave defect having a depth of less than 5 nm.
    The present invention provides a method for producing a substrate in which final polishing is performed by a polishing apparatus having an upper polishing plate equipped with a polishing pad, the method comprising the steps of placing a substrate stock in the polishing apparatus so that the main surface of the substrate stock face toward the upper polishing plate; rotating the upper polishing plate and polishing the substrate stock concomitantly with a polishing slurry on the main surface of the substrate stock; and raising the upper polishing plate which is kept being rotated to separate it from the main surface of the polished substrate stock.

    RECTANGULAR GLASS SUBSTRATE AND METHOD FOR PREPARING THE SAME

    公开(公告)号:US20180057399A1

    公开(公告)日:2018-03-01

    申请号:US15685520

    申请日:2017-08-24

    摘要: A rectangular glass substrate has a front surface, a back surface, four side surfaces, and eight chamfered surfaces, and a thickness of at least 6 mm. A first curved surface along the edge line between the front surface and the chamfered surface disposed adjacent thereto has an average gradient of up to 25% in a range from the front surface to a position of 50 μm below the front surface when the substrate is rested horizontal with the front surface facing upward. A second curved surface along the edge line between at least one of four side surfaces and the chamfered surface disposed adjacent to the front surface has an average gradient of at least 30% in a range from the at least one side surface to a position of 50 μm below the at least one side surface when the substrate is rested horizontal with the at least one side surface facing upward.

    LID FOR OPTICAL ELEMENT PACKAGE, OPTICAL ELEMENT PACKAGE, AND MANUFACTURING METHOD FOR LID FOR OPTICAL ELEMENT PACKAGE AND OPTICAL ELEMENT PACKAGE

    公开(公告)号:US20210351326A1

    公开(公告)日:2021-11-11

    申请号:US17277531

    申请日:2019-09-02

    IPC分类号: H01L33/48

    摘要: A lid for an optical element package, comprising: a window material provided in front of the light emitting direction of an optical element of a housing member, inside of which the optical element is housed; and a metal-based adhesive layer formed on a part at which the window material contacts the housing member, wherein with the lid for an optical element package, the metal-based adhesive layer is formed by an adhesive composition including metal nanoparticles, a solder powder, and a dispersion medium coated by a coating agent. It is possible to address deterioration and cracking due to light of short wavelengths, distortion or decay of the adhesive agent due to heat generation of the light emitting element, and the problem of long-term reliability accompanying these. Specifically, it is possible to provide the lid for an optical element package and the optical element package with excellent heat resistance, ultraviolet resistance, etc.

    Mask Blank Glass Substrate
    7.
    发明公开

    公开(公告)号:US20240053675A1

    公开(公告)日:2024-02-15

    申请号:US18495139

    申请日:2023-10-26

    IPC分类号: G03F1/60

    CPC分类号: G03F1/60

    摘要: A mask blank glass substrate having a maximum value of a circularly averaged power spectral density of 1,000 nm4 or less at a spatial frequency of 0.1 μm−1 or more and 20 μm−1 or less, the maximum value being obtained by measuring a surface morphology of a region of 10 μm×10 μm with an atomic force microscope.

    Mask Blank Glass Substrate
    8.
    发明申请

    公开(公告)号:US20210382386A1

    公开(公告)日:2021-12-09

    申请号:US17333379

    申请日:2021-05-28

    IPC分类号: G03F1/60

    摘要: A mask blank glass substrate having a maximum value of a circularly averaged power spectral density of 1,000 nm4 or less at a spatial frequency of 0.1 μm−1 or more and 20 μm−1 or less, the maximum value being obtained by measuring a surface morphology of a region of 10 μm×10 μm with an atomic force microscope.

    RECTANGULAR MOLD-FORMING SUBSTRATE
    10.
    发明申请
    RECTANGULAR MOLD-FORMING SUBSTRATE 有权
    矩形成型基板

    公开(公告)号:US20140120198A1

    公开(公告)日:2014-05-01

    申请号:US14068983

    申请日:2013-10-31

    IPC分类号: B29C59/02

    摘要: A rectangular substrate is used as a mold after it is provided with a topological pattern. The substrate has A-side and B-side opposed surfaces, the A-side surface being provided with the topological pattern. The A-side surface includes a central rectangular region of 1 to 50 mm by 1 to 50 mm having a flatness of up to 350 nm. Use of the mold-forming substrate prevents the occurrence of a pattern misalignment or pattern error between the step of forming a pattern on a mold-forming substrate and the transfer step. Transfer of a fine size and complex pattern is possible.

    摘要翻译: 矩形基板在设置有拓扑图案之后用作模具。 基板具有A侧和B侧相对的表面,A侧表面设置有拓扑图案。 A侧表面包括具有高达350nm的平坦度的1至50mm乘1至50mm的中心矩形区域。 使用成型基板防止在成型基板上形成图案的步骤与转印步骤之间发生图案错位或图案错误。 转移精细尺寸和复杂图案是可能的。