Radiation-sensitive resin composition
    1.
    发明授权
    Radiation-sensitive resin composition 有权
    辐射敏感树脂组合物

    公开(公告)号:US07141355B2

    公开(公告)日:2006-11-28

    申请号:US10477207

    申请日:2002-12-13

    IPC分类号: G03F7/038 G03F7/30

    CPC分类号: G03F7/033 G03F7/405

    摘要: A radiation-sensitive resin composition comprising (A) an alkali-soluble resin having an unsaturated group, (B) a compound having at least one ethylenically unsaturated double bond, and (C) a radiation-induced radical polymerization initiator, wherein: the alkali-soluble resin having an unsaturated group (A) is obtained by reacting: 100 parts by weight of a copolymer comprising 1 to 40 wt % structural units derived from (a) a radically polymerizable compound having a carboxyl group; 1 to 50 wt % structural units having a phenolic hydroxyl group which are derived from (b-1) a radically polymerizable compound having a phenolic hydroxyl group or (b-2) a radically polymerizable compound having a functional group convertible into a phenolic hydroxyl group after the copolymerization, other structural units of said copolymer being derived from (c) another radically polymerizable compound; with 0.1 to 20 parts by weight of (d) a radically polymerizable compound having an epoxy group. The resin composition can form a radiation-sensitive film in a thickness greater than a deposit thickness and has a high resolution.

    摘要翻译: 一种辐射敏感性树脂组合物,其包含(A)具有不饱和基团的碱溶性树脂,(B)具有至少一个烯键式不饱和双键的化合物和(C)辐射诱导的自由基聚合引发剂,其中:所述碱 通过使100重量份的由(a)具有羧基的自由基聚合性化合物衍生的1〜40重量%结构单元的共聚物反应得到具有不饱和基团(A)的可溶性树脂; (b-1)具有酚羟基的自由基聚合性化合物或(b-2)具有可转化为酚羟基的官能团的自由基聚合性化合物的酚羟基的1〜50重量%结构单元 共聚后,所述共聚物的其它结构单元衍生自(c)另一种可自由基聚合的化合物; (d)具有环氧基的自由基聚合性化合物为0.1〜20重量份。 树脂组合物可以形成厚度大于沉积物厚度的辐射敏感膜并具有高分辨率。

    Negative radiation-sensitive resin composition
    2.
    发明申请
    Negative radiation-sensitive resin composition 有权
    负辐射敏感树脂组合物

    公开(公告)号:US20070190450A1

    公开(公告)日:2007-08-16

    申请号:US10593972

    申请日:2005-03-24

    IPC分类号: G03C1/00

    摘要: It is an object of the present invention to provide a process capable of precisely producing a plated shaped article of a large thickness such as a bump or a wiring, a negative radiation-sensitive resin composition which is preferably used for the process and has excellent sensitivity and resolution, and a transfer film using the composition. The above object is achieved by a negative radiation-sensitive resin composition comprising (A) a polymer containing structural units represented by the following formula (1) and/or the following formula (2), (B) a compound having at least one ethylenically unsaturated double bond and (C) a radiation-sensitive radical polymerization initiator, and by forming a negative radiation-sensitive resin film using the composition.

    摘要翻译: 本发明的目的是提供一种能够精确地制造诸如凸块或布线的大厚度镀覆成形制品的方法,优选用于该方法并具有优异灵敏度的负型辐射敏感性树脂组合物 和分辨率,以及使用该组合物的转印膜。 上述目的是通过负辐射敏感性树脂组合物实现的,其包含(A)含有由下式(1)和/或下式(2)表示的结构单元的聚合物,(B)具有至少一个烯键式 不饱和双键和(C)辐射敏感自由基聚合引发剂,并使用该组合物形成负辐射敏感树脂膜。

    Negative radiation-sensitive resin composition
    3.
    发明授权
    Negative radiation-sensitive resin composition 有权
    负辐射敏感树脂组合物

    公开(公告)号:US07482111B2

    公开(公告)日:2009-01-27

    申请号:US10593972

    申请日:2005-03-24

    摘要: It is an object of the present invention to provide a process capable of precisely producing a plated shaped article of a large thickness such as a bump or a wiring, a negative radiation-sensitive resin composition which is preferably used for the process and has excellent sensitivity and resolution, and a transfer film using the composition. The above object is achieved by a negative radiation-sensitive resin composition comprising (A) a polymer containing structural units represented by the following formula (1) and/or the following formula (2), (B) a compound having at least one ethylenically unsaturated double bond and (C) a radiation-sensitive radical polymerization initiator, and by forming a negative radiation-sensitive resin film using the composition.

    摘要翻译: 本发明的目的是提供一种能够精确地制造诸如凸块或布线的大厚度镀覆成形制品的方法,优选用于该方法并具有优异灵敏度的负型辐射敏感性树脂组合物 和分辨率,以及使用该组合物的转印膜。 上述目的是通过负辐射敏感性树脂组合物实现的,其包含(A)含有由下式(1)和/或下式(2)表示的结构单元的聚合物,(B)具有至少一个烯键式 不饱和双键和(C)辐射敏感自由基聚合引发剂,并使用该组合物形成负辐射敏感树脂膜。

    Photosensitive resin film and cured film made therefrom
    4.
    发明申请
    Photosensitive resin film and cured film made therefrom 有权
    感光树脂膜和由其制成的固化膜

    公开(公告)号:US20060210912A1

    公开(公告)日:2006-09-21

    申请号:US10551447

    申请日:2004-03-25

    IPC分类号: G03C1/76

    摘要: The photosensitive resin film in an uncured state of the invention comprises (A) a specific alkali-soluble copolymer, (B) a compound having at least one ethylenically unsaturated double bond and (C) a radiation-sensitive radical polymerization initiator by the use of which a coating film having a dry film thickness of 70 μm in an uncured state has a 365 nm radiation transmittance of not less than 10% and a 405 nm radiation transmittance of not less than 60%, contains the radiation-sensitive radical polymerization initiator (C) in an amount of 20 to 40 parts by weight based on 100 parts by weight of the component (A), and has a dry film thickness of not less than 50 μm. According to the photosensitive resin film, a high bump having a height of not less than 50 μm can be readily formed on a chip substrate with high precision though formation of such a high bump is difficult by the conventional technique. Moreover, connection failure of an element can be inhibited, and reliability of an element can be enhanced.

    摘要翻译: 本发明的未固化状态的感光性树脂膜包含(A)特定的碱溶性共聚物,(B)具有至少一个烯键式不饱和双键的化合物和(C)使用辐射敏感性自由基聚合引发剂的 在未固化状态下具有70μm的干膜厚度的涂膜具有不小于10%的365nm辐射透射率和不小于60%的405nm辐射透射率,其含有辐射敏感性自由基聚合引发剂( C)相对于100重量份组分(A)为20至40重量份,干膜厚度不小于50微米。 根据感光性树脂膜,通过以往的技术难以形成这样高的凸起,难以高精度地在芯片基板上形成高度不小于50μm的高凸点。 此外,可以抑制元件的连接故障,并且可以提高元件的可靠性。

    Photosensitive resin film and cured film made therefrom
    5.
    发明授权
    Photosensitive resin film and cured film made therefrom 有权
    感光树脂膜和由其制成的固化膜

    公开(公告)号:US07214471B2

    公开(公告)日:2007-05-08

    申请号:US10551447

    申请日:2004-03-25

    IPC分类号: G03F7/033

    摘要: The photosensitive resin film in an uncured state of the invention comprises (A) a specific alkali-soluble copolymer, (B) a compound having at least one ethylenically unsaturated double bond and (C) a radiation-sensitive radical polymerization initiator by the use of which a coating film having a dry film thickness of 70 μm in an uncured state has a 365 nm radiation transmittance of not less than 10% and a 405 nm radiation transmittance of not less than 60%, contains the radiation-sensitive radical polymerization initiator (C) in an amount of 20 to 40 parts by weight based on 100 parts by weight of the component (A), and has a dry film thickness of not less than 50 μm. According to the photosensitive resin film, a high bump having a height of not less than 50 μm can be readily formed on a chip substrate with high precision though formation of such a high bump is difficult by the conventional technique. Moreover, connection failure of an element can be inhibited, and reliability of an element can be enhanced.

    摘要翻译: 本发明的未固化状态的感光性树脂膜包含(A)特定的碱溶性共聚物,(B)具有至少一个烯键式不饱和双键的化合物和(C)使用辐射敏感性自由基聚合引发剂的 在未固化状态下具有70μm的干膜厚度的涂膜具有不小于10%的365nm辐射透射率和不小于60%的405nm辐射透射率,其含有辐射敏感性自由基聚合引发剂( C)相对于100重量份组分(A)为20至40重量份,干膜厚度不小于50微米。 根据感光性树脂膜,通过以往的技术难以形成这样高的凸起,难以高精度地在芯片基板上形成高度不小于50μm的高凸点。 此外,可以抑制元件的连接故障,并且可以提高元件的可靠性。

    Acrylic copolymer and reflection-preventing film-forming composition containing the same
    6.
    发明授权
    Acrylic copolymer and reflection-preventing film-forming composition containing the same 有权
    丙烯酸共聚物和含有它的防反射膜成膜组合物

    公开(公告)号:US06242161B1

    公开(公告)日:2001-06-05

    申请号:US09320450

    申请日:1999-05-27

    IPC分类号: G03F711

    摘要: A reflection-preventing film-forming composition including a copolymer having structural units represented by the following general formulas (1) and (2) and a solvent: wherein R1 represents a hydrogen atom, a halogen atom, a hydrocarbon group, etc.; R2 represents a hydrogen atom or a methyl group; and m represents an integer of 1 to 9; wherein R3 represents a hydrogen atom or a methyl group, and R4 represents a hydrogen atom or an organic group. Reflection-preventing films formed of this composition have a high reflection-preventing effect, may cause no intermixing with the resist, have a high etching rate and also can form a resist pattern having superior resolution and precision.

    摘要翻译: 一种防反射膜成型组合物,其包含具有由以下通式(1)和(2)表示的结构单元的共聚物和溶剂:其中R1表示氢原子,卤素原子,烃基等; R2表示氢原子或甲基; m表示1〜9的整数,R 3表示氢原子或甲基,R 4表示氢原子或有机基团。 由该组合物形成的防反射膜具有高防反射效果,可能不会与抗蚀剂混合,蚀刻速度高,并且还可以形成具有优异分辨率和精度的抗蚀剂图案。

    Radiation sensitive resin composition
    7.
    发明授权
    Radiation sensitive resin composition 有权
    辐射敏感树脂组合物

    公开(公告)号:US6136500A

    公开(公告)日:2000-10-24

    申请号:US135855

    申请日:1998-08-18

    IPC分类号: G03F7/004 G03F7/038 G03F7/039

    摘要: Positive as well as negative radiation sensitive resin compositions that, in addition to being capable of providing excellent resolution and pattern profile, are particularly excellent in avoiding the problems of "nano-edge roughness" or "coating surface roughness". The positive type radiation sensitive resin composition comprises (A) (a) an acid-decomposable group-containing resin, or (b) an alkali-soluble resin and an alkali dissolution controller, and (B) a photoacid generator comprising "a compound that upon exposure to radiation generates a carboxylic acid having a boiling point of 150.degree. C. or higher", and "a compound that upon exposure to radiation generates an acid other than a carboxylic acid". The negative type radiation sensitive resin composition comprises (C) an alkali-soluble resin, (D) a cross-linking agent, and the component (B) as described above.

    摘要翻译: 除了能够提供优异的分辨率和图案轮廓之外,正面和负面的辐射敏感性树脂组合物在避免“纳米边缘粗糙度”或“涂层表面粗糙度”的问题方面特别优异。 正型辐射敏感性树脂组合物包含(A)(a)含酸可分解基团的树脂,或(b)碱溶性树脂和碱溶解控制剂,和(B)光酸产生剂,其包含“ 暴露于辐射后会产生沸点为150℃以上的羧酸“,”暴露于辐射后的化合物会产生羧酸以外的酸“。 负型辐射敏感性树脂组合物包含(C)碱溶性树脂,(D)交联剂和如上所述的组分(B)。

    Radiation-sensitive resin composition
    8.
    发明授权
    Radiation-sensitive resin composition 失效
    辐射敏感树脂组合物

    公开(公告)号:US6007961A

    公开(公告)日:1999-12-28

    申请号:US988068

    申请日:1997-12-10

    IPC分类号: G03F7/022 G03F7/023 G03F7/30

    CPC分类号: G03F7/022

    摘要: A radiation-sensitive resin composition including an alkali soluble resin and a quinonediazide compound is provided. The quinonediazide compound has the formula (1), for example: ##STR1## wherein, R.sup.1 to R.sup.6 are an alkyl, cycloalkyl or aryl group; a and b are an integer of 1 to 3; D.sup.1 and D.sup.2 are independently a hydrogen atom or a 1,2-quinonediazidosulfonyl group, provided that at least one of D.sup.1 is a 1,2-quinonediazidosulfonyl group; A is a bonding such as single bond; and x and y are an integer of 0 to 2. The composition is suitable as a positive resist, which effectively restrains the occurrence of scum, and excellent in developability, pattern shape, sensitivity, resolution and focus latitude.

    摘要翻译: 提供了包含碱溶性树脂和醌二叠氮化合物的辐射敏感性树脂组合物。 醌二叠氮化合物具有式(1),例如:其中,R 1至R 6为烷基,环烷基或芳基; a和b为1〜3的整数, D1和D2独立地为氢原子或1,2-醌二叠氮基磺酰基,条件是D1中的至少一个为1,2-醌二叠氮基磺酰基; A是单键键合; x和y为0〜2的整数。该组合物适合作为正性抗蚀剂,其有效地抑制浮渣的发生,显影性,图案形状,灵敏度,分辨率和聚焦纬度优异。

    Rubber composition comprising a thermosetting resin and a functional
rubber-like copolymer
    9.
    发明授权
    Rubber composition comprising a thermosetting resin and a functional rubber-like copolymer 失效
    包含热固性树脂和功能橡胶状共聚物的橡胶组合物

    公开(公告)号:US4599382A

    公开(公告)日:1986-07-08

    申请号:US714032

    申请日:1985-03-20

    摘要: A rubber composition consisting essentially of 5-99 parts by weight of a thermosetting resin and 94-1 parts by weight of one of the following functional rubber-like copolymers (I) to (III) having a Mooney viscosity ML.sub.1+4.sup.100 of 20-120:(I) a functional rubber-like copolymer consisting of 1-20% by weight of a monomer having epoxy groups, hydroxyl groups or amino groups, 15-50% by weight of acrylonitrile and 40-80% by weight of butadiene and/or isoprene as monomer units constituting the polymer,(II) a functional rubber-like copolymer consisting of 1-20% by weight of a monomer having epoxy groups, hydroxyl groups or amino groups, 40-99% by weight of an alkyl (meth)acrylate and/or an alkoxyalkyl (meth)acrylate and 0-30% by weight of monomers copolymerizable therewith other than butadiene and isoprene, as the monomer units constituting the polymer, and(III) a functional rubber-like copolymer consisting of 1-20% by weight of a monomer having epoxy groups, hydroxyl groups or amino groups, 15-50% by weight of acrylonitrile, 20-60% by weight of butadiene and/or isoprene and 5-65% by weight of an alkyl (meth)acrylate and/or an alkoxy (meth)acrylate as the monomer units constituting the polymer.Said functional rubber copolymer may include 10% by weight or less of a polyfunctional monomer as a monomer unit constituting the polymer. In this case, the ratio of the thermosetting resin to the functional rubber-like copolymer is 50-99 parts by weight of the former to 1-50 parts by weight of the latter.

    摘要翻译: 基本上由5-99重量份的热固性树脂和94-1重量份具有门尼粘度ML1 + 4100为20〜20的功能性橡胶状共聚物(I)〜(III)之一组成的橡胶组合物, 120:(I)由1-20重量%的具有环氧基,羟基或氨基的单体,15-50重量%的丙烯腈和40-80重量%的丁二烯组成的功能性橡胶状共聚物,以及 /或异戊二烯作为构成聚合物的单体单元,(II)由1-20重量%的具有环氧基,羟基或氨基的单体组成的官能橡胶状共聚物,40-99重量%的烷基( (甲基)丙烯酸酯和/或(甲基)丙烯酸烷氧基烷基酯和0-30重量%的除丁二烯和异戊二烯之外可共聚的单体作为构成聚合物的单体单元,和(III)由1 -20重量%的具有环氧基,羟基或氨基的单体,15 -50重量%的丙烯腈,20-60重量%的丁二烯和/或异戊二烯和5-65重量%的(甲基)丙烯酸烷基酯和/或烷氧基(甲基)丙烯酸酯作为构成聚合物的单体单元 。 所述功能橡胶共聚物可以包含10重量%以下的作为构成聚合物的单体单元的多官能单体。 在这种情况下,热固性树脂与官能橡胶状共聚物的比例为前者的50-99重量份,后者的1-50重量份。

    Positive Photosensitive Insulating Resin Composition And Cured Product Thereof
    10.
    发明申请
    Positive Photosensitive Insulating Resin Composition And Cured Product Thereof 审中-公开
    正极敏感绝缘树脂组合物及其固化产品

    公开(公告)号:US20080097032A1

    公开(公告)日:2008-04-24

    申请号:US11718303

    申请日:2005-10-28

    IPC分类号: C08G73/00

    摘要: Disclosed is a positive photosensitive insulating resin composition which comprises: (A) a copolymer comprising (A1) 10 to 99 mol % of a structural unit of the formula (1) and (A2) 90 to 1 mol % of a structural unit of the formula (2); (B) a quinone diazide group-containing compound; (C) at least one compound selected from the group consisting of (C1) an aromatic compound containing a methylol group and/or an alkoxy methyl group (except for aromatic compounds containing an amino group), (C2) an aromatic aldehyde compound, (C3) an aliphatic aldehyde compound, (C4) an alkyl-etherified amino group-containing compound and (C5) an epoxy group-containing compound; (D) a solvent; and (E) an adhesion assistant. Disclosed also is a cured product obtainable from the composition. wherein Ra and Rb are each an alkyl group having 1 to 4 carbon atoms, alkoxy group or aryl group, Rb and Rc are each hydrogen or a methyl group, n is an integer of 0 to 3 and m is an integer of 1 to 3. The cured product has excellent resolution, electrical insulating properties, thermal shock resistance, adhesion and other properties.

    摘要翻译: 公开了一种正性感光性绝缘性树脂组合物,其包含:(A)包含(A1)10〜99摩尔%的式(1)和(A2)的结构单元的共聚物,90〜1摩尔%的结构单元 公式(2); (B)含醌二叠氮基的化合物; (C)至少一种选自(C1)含有羟甲基和/或烷氧基甲基的芳族化合物(除了含有氨基的芳香族化合物之外)的化合物,(C2)芳族醛化合物,( C3)脂族醛化合物,(C4)烷基醚化氨基化合物和(C5)含环氧基化合物; (D)溶剂; 和(E)粘附助剂。 还公开了可从该组合物获得的固化产物。 其中,Ra和Rb分别为碳原子数1〜4的烷基,烷氧基或芳基,Rb和Rc分别为氢或甲基,n为0〜3的整数,m为1〜3的整数。 固化产品具有优异的分辨率,电绝缘性能,耐热冲击性,附着力等特性。