摘要:
A shield machine including an excavator capable of excavating tunnels of various cross-sectional shapes, the excavator including: a rotary drum supported at a front end side portion of a shield machine main body to be rotatable around a first center axis; a cutter supporting frame supported by the rotary drum to be rotatable around a second center axis; a rotary cutter head supported by the cutter supporting frame to be rotatable around a third center axis and including a plurality of cutter bits on a surface thereof; a rotary auxiliary cutter head supported by the rotary drum to be rotatable around a fourth center axis; and first, third, and fourth rotating mechanisms, and a swinging drive mechanism configured to respectively cause the rotary drum, the rotary cutter head, the rotary auxiliary cutter head, and the cutter supporting frame to independently rotate.
摘要:
A radiation-sensitive resin composition including (1) an alkali-soluble resin, (2) a quinonediazide compound and (3) a mixed solvent including a monoketone having 7 to 14 carbon atoms and an alkoxypropionic acid alkyl ester is provided. The composition can be coated in a uniform thickness in a small coating weight. The composition has a high sensitivity and a high resolution, and also enables formation of resist patterns having a superior pattern shape with less pattern defects. Thus, it is suitable as a positive resist.
摘要:
A radiation-sensitive resin composition comprising:(i) an alkali-soluble resin;(ii) a phenol compound represented by the following formula (1): ##STR1## wherein R.sub.1 to R.sub.4 each represent halogen, alkyl, alkoxyl, aryl, nitro, cyano, hydroxyalkyl, hydroxyalkoxyl or hydroxyl; a, b, c and d each represent an integer of 0 to 4 and satisfying 0.ltoreq.a+b.ltoreq.4 and 0.ltoreq.c+d.ltoreq.4, provided that when a+b is 1 and c+d is 1 at least one of R.sub.1 (or R.sub.2) and R.sub.3 (or R.sub.4) is alkyl, hydroxyalkyl or hydroxyalkoxyl; R.sub.5 to R.sub.10 each represent hydrogen, alkyl or aryl; and X.sub.1 and X.sub.2 each represent oxygen or sulfur atom; and(iii) a 1,2-quinonediazide compound. This composition has good resolution, sensitivity and developability, as well as has as a positive resist good focal latitude and heat resistance. The patterns formed have good shapes, and the composition may cause no fine particles during storage.
摘要:
The present invention provides a radiation sensitive resin composition which contains an alkali soluble resin and a 1,2-quinonediazide compound represented by the following formula, for example. ##STR1## The radiation sensitive resin composition of the present invention has an excellent developability, provides an excellent pattern shape, is superior in sensitivity and resolution, and has greatly improved focus latitude and heat resistance in particular. Therefore, the radiation sensitive resin composition of the present invention can be suitably used as a resist for the production of LSIs.
摘要:
The present invention provides a shield machine (1) including an excavator (5) capable of excavating tunnels of various cross-sectional shapes, the excavator (5) including: a rotary drum (40) supported at a front end side portion of a shield machine main body (2) to be rotatable around a first center axis (A1); a cutter supporting frame (50) supported by the rotary drum to be rotatable around a second center axis (A2); a rotary cutter head (60) supported by the cutter supporting frame (50) to be rotatable around a third center axis (A3) and including a plurality of cutter bits (61) on a surface thereof; a rotary auxiliary cutter head (70) supported by the rotary drum (40) to be rotatable around a fourth center axis (A4); and first, third, and fourth rotating mechanisms (45, 65, and 75), and a swinging drive mechanism (55) configured to respectively cause the rotary drum (40), the rotary cutter head (60), the rotary auxiliary cutter head (70), and the cutter supporting frame (50) to independently rotate.
摘要:
The invention concerns a lift-off process for patterning layers that are deposited and/or sputtered. The invention provides a two-layer resist and a patterning method using the resist. The patterning method can readily produce burr-free layers on a substrate. The method comprises the steps of: sequentially applying positive radiation-sensitive resin compositions 1 and 2 to form a two-layer laminate; subjecting the two-layer resist to single exposure and development to produce fine patterns having an undercut cross section; depositing and/or sputtering an organic or inorganic thin layer with use of the resist pattern as a mask; and lifting off the resist pattern to leave a pattern of the thin layer in desired shape.
摘要:
The present invention provides a photosensitive insulating resin composition which can be cured at low temperatures without inhibiting functions of an organic semiconductor device or the like, by the use of which a cured product excellent in various properties such as resolution, electrical insulation, thermal shock resistance and chemical resistance can be obtained and which is suitably used for a surface protective film or a layer insulating film of a semiconductor device. The photosensitive insulating resin composition of the present invention comprises a copolymer (A), which is obtained by copolymerizing monomer components containing a vinyl monomer having an epoxy group and a vinyl monomer having an oxetanyl group, and a photosensitive acid generator (B). The copolymer (A) is preferably obtained by copolymerizing monomer components containing a vinyl monomer having an epoxy group, a vinyl monomer having an oxetanyl group and another vinyl monomer.
摘要:
A heat curable resin composition having a low elastic modulus comprising (A) an epoxy resin, (B) crosslinked fine particles, and (C) a curing agent, which when cured with heat, produces a cured product having a elastic modulus of less than 1 GPa is provided. A cured product excelling in characteristics such as stress relaxation property (low stress properties), electric insulation properties, heat shock resistance, and heat resistance can be produced from the heat curable resin.
摘要:
A process for forming bumps on electrode pads for a wiring board including a substrate and a plurality of electrode pads. The process (a) forms a laminated two-layer film on the wiring board and forms a pattern of apertures at positions corresponding to the electrode pads, the laminated two-layer film including a lower layer containing an alkali-soluble radiation-nonsensitive resin composition and an upper layer containing a negative radiation-sensitive resin composition; (b) fills a low-melting metal in the aperture pattern; (c) reflows the low-melting metal by pressing or heating to form bumps; and (d) peels and removes the laminated two-layer film from the board. The laminated film including two layers with different properties permits high resolution and easy peeling.
摘要:
A radiation sensitive resin composition containing an alkali soluble resin and a 1,2-quinonediazide compound of a polyphenol or a radiation sensitive resin composition containing an alkali soluble resin and a 1,2-quinonediazide compound and a polyphenol compound.