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98 条记录 (耗时 0.031 秒)

    Positive resist composition
    1.
    发明授权
    Positive resist composition 失效
    正抗蚀剂组成

    公开(公告)号：US07335454B2

    公开(公告)日：2008-02-26

    申请号：US10317110

    申请日：2002-12-12

    申请人： Shinichi Kanna ,  Kazuyoshi Mizutani ,  Kunihiko Kodama ,  Tomoya Sasaki

    发明人： Shinichi Kanna ,  Kazuyoshi Mizutani ,  Kunihiko Kodama ,  Tomoya Sasaki

    IPC分类号： G03C1/00

    CPC分类号： G03F7/0395 ,  G03F7/0045 ,  G03F7/0046 ,  G03F7/0392 ,  G03F7/0397 ,  Y10S430/106 ,  Y10S430/114 ,  Y10S430/115

    摘要： A positive resist composition comprising (A) a fluorine group-containing resin, which has a structure substituted with a fluorine atom in the main chain and/or side chain of polymer skeleton and a group that is decomposed by the action of an acid to increase solubility in an alkali developer and (B) an acid generator capable of generating an acid upon irradiation of an actinic ray or radiation, and the acid generator of (B) is a compound selected from a sulfonium salt containing no aromatic ring and a compound having a phenacylsulfonium salt structure.

    摘要翻译： 一种正型抗蚀剂组合物，其包含（A）在聚合物骨架的主链和/或侧链中具有被氟原子取代的结构的含氟基树脂和通过酸的作用而分解的基团以增加 在碱显影剂中的溶解度和（B）能够在光化射线或辐射照射时能产生酸的酸发生剂，（B）的酸产生剂是选自不含芳环的锍盐和具有 苯甲酰锍盐结构。

    Positive resist composition
    3.
    发明授权
    Positive resist composition 有权
    正抗蚀剂组成

    公开(公告)号：US07198880B2

    公开(公告)日：2007-04-03

    申请号：US10422789

    申请日：2003-04-25

    申请人： Tomoya Sasaki ,  Kazuyoshi Mizutani ,  Shinichi Kanna

    发明人： Tomoya Sasaki ,  Kazuyoshi Mizutani ,  Shinichi Kanna

    IPC分类号： G03F7/004

    CPC分类号： G03F7/0046 ,  G03F7/0395 ,  G03F7/0397

    摘要： A positive resist composition comprising: (A1) a resin containing at least one type of repeating unit represented by the specific formula and additionally containing at least one type of repeating unit represented by the specific formula, which increases the solubility in an alkali developing solution by the action of an acid, and (B) a compound which is capable of generating an acid by the action of actinic ray or radiation.

    摘要翻译： 正性抗蚀剂组合物包含

    Photosensitive resin composition
    5.
    发明授权
    Photosensitive resin composition 有权
    感光树脂组合物

    公开(公告)号：US07214467B2

    公开(公告)日：2007-05-08

    申请号：US10455459

    申请日：2003-06-06

    申请人： Shinichi Kanna ,  Kazuyoshi Mizutani ,  Tomoya Sasaki

    发明人： Shinichi Kanna ,  Kazuyoshi Mizutani ,  Tomoya Sasaki

    IPC分类号： G03F7/00

    CPC分类号： G03F7/0046 ,  G03F7/0045 ,  G03F7/0392 ,  G03F7/0395 ,  G03F7/0397 ,  Y10S430/114 ,  Y10S430/115

    摘要： The photosensitive resin composition of the present invention is an excellent photosensitive resin composition: exhibiting significant transmissibility at the use of an exposure light source of 160 nm or less, more specifically F2 excimer laser light, where line edge roughness and development time dependence are small and a problem of footing formation is improved; and comprising a resin which decomposes by an action of acid to increase the solubility in alkali developer, in which the resin contains a specific repeat unit; a compound capable of generating an acid upon irradiation with one of an actinic ray and a radiation, in which the compound includes at least two kinds of compounds selected from the group consisting of specific compounds (B1), (B2), (B3) and (B4).

    摘要翻译： 本发明的感光性树脂组合物是优异的感光性树脂组合物，其在使用160nm以下的曝光光源，更具体地是2/2准分子激光的情况下显示显着的透射性，其中线边 粗糙度和开发时间依赖性小，基础形成问题得到改善; 并且包含通过酸的作用分解以提高在碱性显影剂中的溶解度的树脂，其中树脂含有特定的重复单元; 其中化合物包括选自特定化合物（B1），（B2），（B3）和（B3）中的至少两种化合物， （B4）。

    Positive photoresist composition and pattern making method using the same
    6.
    发明授权
    Positive photoresist composition and pattern making method using the same 有权
    正光致抗蚀剂组合物和使用其的图案制造方法

    公开(公告)号：US07202015B2

    公开(公告)日：2007-04-10

    申请号：US10921962

    申请日：2004-08-20

    申请人： Shinichi Kanna ,  Kazuyoshi Mizutani ,  Tomoya Sasaki

    发明人： Shinichi Kanna ,  Kazuyoshi Mizutani ,  Tomoya Sasaki

    IPC分类号： G03F7/004 ,  G03C5/00

    CPC分类号： G03F7/0046 ,  G03F7/0045 ,  G03F7/0392 ,  Y10S430/108

    摘要： A positive photoresist composition containing: (A) a resin which contains at least one of a repeating unit represented by the formula (IA) defiend herein and a repeating unit represented by the formula (IB) defined herein, and is decomposed by an action of an acid and shows an increase in a solubility in an alkali developer; and (B) as compounds capable of generating an acid upon irradiation with one of an actinic ray and a radiation, at least two compounds selected from the compounds (B1), (B2), (B3) and (B4) as defiend herein.

    摘要翻译： 一种正性光致抗蚀剂组合物，其含有：（A）含有本文所述的由式（IA）表示的重复单元和本文定义的式（IB）表示的重复单元中的至少一种的树脂，并且通过 酸显示出在碱性显影剂中的溶解度的增加; 和（B）作为能够在用光化学射线和辐射之一照射时产生酸的化合物，至少两种选自化合物（B1），（B2），（B3）和（B4）的化合物，如本文所述。

    Positive photoresist composition and pattern making method using the same
    10.
    发明申请
    Positive photoresist composition and pattern making method using the same 有权
    正光致抗蚀剂组合物和使用其的图案制造方法

    公开(公告)号：US20050042543A1

    公开(公告)日：2005-02-24

    申请号：US10921962

    申请日：2004-08-20

    申请人： Shinichi Kanna ,  Kazuyoshi Mizutani ,  Tomoya Sasaki

    发明人： Shinichi Kanna ,  Kazuyoshi Mizutani ,  Tomoya Sasaki

    IPC分类号： C08F20/10 ,  C08F32/00 ,  G03F7/004 ,  G03F7/039 ,  H01L21/027 ,  G03C1/76

    CPC分类号： G03F7/0046 ,  G03F7/0045 ,  G03F7/0392 ,  Y10S430/108

    摘要： A positive photoresist composition containing: (A) a resin which contains at least one of a repeating unit represented by the formula (IA) defiend herein and a repeating unit represented by the formula (IB) defined herein, and is decomposed by an action of an acid and shows an increase in a solubility in an alkali developer; and (B) as compounds capable of generating an acid upon irradiation with one of an actinic ray and a radiation, at least two compounds selected from the compounds (B1), (B2), (B3) and (B4) as defiend herein.

    摘要翻译： 一种正性光致抗蚀剂组合物，其含有：（A）含有本文所述的由式（IA）表示的重复单元和本文定义的式（IB）表示的重复单元中的至少一种的树脂，并且通过 酸显示出在碱性显影剂中的溶解度的增加; 和（B）作为能够在用光化学射线和辐射之一照射时产生酸的化合物，至少两种选自化合物（B1），（B2），（B3）和（B4）的化合物，如本文所述。