摘要:
A heating device of the light irradiation type having an article to be heated, a guard ring located on the periphery of that article, multiple lamps located above the article to be heated and the guard ring, and a reflecting mirror located above the lamps, in which a light diffusion part is located in the upper region corresponding to the article to be heated so that the diffused light projects onto the entire surface of the article to be heated. The light diffusion part can be formed, for example, on a reflecting mirror, an optically transparent window part located between the article to be heated and the lamps or a light diffusion area formed on the light-emitting bulbs of the lamps. The size of the region occupied by the light diffusion part is such that diffused light is not projected to the guard ring.
摘要:
A heating device of the light irradiation type having an article to be heated, a guard ring located on the periphery of that article, multiple lamps located above the article to be heated and the guard ring, and a reflecting mirror located above the lamps, in which a light diffusion part is located in the upper region corresponding to the article to be heated so that the diffused light projects onto the entire surface of the article to be heated. The light diffusion part can be formed, for example, on a reflecting mirror, an optically transparent window part located between the article to be heated and the lamps or a light diffusion area formed on the light-emitting bulbs of the lamps. The size of the region occupied by the light diffusion part is such that diffused light is not projected to the guard ring.
摘要:
A light emission type heating apparatus comprises a first lamp unit which includes two or more lamps, in which at least one of the lamps includes two or more filaments in its light emission bulb, and intensity of light emitted from each filament is independently controlled, and a second lamp unit which is made up of two or more lamps, and wherein the lamps of the first lamp unit are grouped, in each of which a filament of at least one of the lamps and a filament of another one of the lamps are arranged to form groups, wherein a temperature of the workpiece is detected, and electric power to be applied to each of the groups of filaments is controlled based on the detected temperature of the workpiece.
摘要:
To devise a heating device of the light irradiation type in which costs can reduced by reducing the number of filament lamps and current source parts without adversely affecting the illuminance distribution with respect to a wafer, in a heating device of the light irradiation type that has a light source part, in which several filament lamps are located parallel to one another, in which at least one of the filament lamps has several filaments which are located along the bulb axis are supplied with power individually to produce light which is irradiated from the light source parts onto an article to be treated, the distance between at least some of the adjacent filament lamps to one another is nonuniform.
摘要:
A light irradiation heating process in which, even in the case of an asymmetrical physical property of an article to be treated, uniform heating is possible, or in which heating can be performed such that the article acquires a desired physical property after heat treatment. Based on the measured value of the local physical property of the article to be treated, the emissivity distribution is obtained and the distribution pattern of the light intensity on the article to be treated is determined. According to this light intensity pattern, the individual intensity of the light emitted from respective light emitting parts of lamp units of the heating device are determined beforehand. According to this determined result, the intensity of the light emitted from the respective light emitting parts of the lamp units are controlled individually, and thus, the article to be treated is irradiated with light.
摘要:
A heating device in which uniform heating of an article to be processed is possible even in the case a temperature change which leads to a loss of the uniformity of the temperature distribution in a narrowly delineated area, and in which a reduction in the size of the device is possible. The heating device has a plurality of heaters, each heater having a single bulb of transparent material in which there is a filament that is divided in the axial direction into several filament parts and the respective filament parts are supplied with power independently of each other.
摘要:
A heating device in which uniform heating of an article to be processed is possible even in the case a temperature change which leads to a loss of the uniformity of the temperature distribution in a narrowly delineated area, and in which a reduction in the size of the device is possible. The heating device has a plurality of heaters, each heater having a single bulb of transparent material in which there is a filament that is divided in the axial direction into several filament parts and the respective filament parts are supplied with power independently of each other.
摘要:
The object of the invention is to provide an ashing method and an asher in order to avoid damage to semiconductor components occurring during ashing of a photoresist resin film by active oxygen plasma and to avoid a long treatment time occurring in an ashing method using a low pressure mercury discharge lamp. According to the invention, this object is achieved by a method and an apparatus for ashing a photoresist resin film. In the method, a wafer provided with a photoresist resin film is placed in an ozone-containing atmosphere. An activated oxygen is produced through the radiation light of a discharge lamp, which emits a continuous spectrum in a wavelength range of 200 to 300 nm. The photoresist resin film is ashed by the activated oxygen.
摘要:
High temperature plasma raw material (21) is gasified by irradiation with a first energy beam (23). When the gasified raw material reaches the discharge region, pulsed power is applied between the electrodes (11, 12) and a second energy beam (24) irradiates. In this manner, the plasma is heated and excited and an EUV emission occurs. The emitted EUV emission is collected and extracted by EUV collector optics. Because of irradiation by the first and second energy beams (23, 24), a special distribution of high temperature plasma raw material density can be set to a specified distribution and demarcation of the position of the discharge channel can be set. Moreover, it is possible to lengthen pulses of extreme ultraviolet emission by supplying raw material gas of which the ion density in the discharge path is nearly the same as the ion density under EUV radiation emission conditions.
摘要:
An EUV radiation source device with a chamber that is divided into a discharge space and a collector mirror space provided with EUV collector optics. Between them, an aperture component with an opening which is cooled is provided. First and second discharge electrodes are rotated. Sn or Li is irradiated with a laser. Pulsed power is applied between the first and second discharge electrodes to form a high density and high temperature plasma between the two electrodes so that EUV radiation with a wavelength of 13.5 nm is emitted, is focused by the EUV collector optics and is guided into the irradiation optical system of an exposure tool. There are a first pumping device and a second pumping device for pumping the discharge space and the collector mirror space. The discharge space is kept at a few Pa, and the collector mirror space is kept at a few 100 Pa.