公开(公告)号：US09418881B2

公开(公告)日：2016-08-16

申请号：US13192784

申请日：2011-07-28

申请人： Shinobu Sugiura ,  Masaaki Ueno ,  Kazuo Tanaka ,  Masashi Sugishita ,  Hideto Yamaguchi ,  Kenji Shirako

发明人： Shinobu Sugiura ,  Masaaki Ueno ,  Kazuo Tanaka ,  Masashi Sugishita ,  Hideto Yamaguchi ,  Kenji Shirako

IPC分类号： H01L21/67 ,  G05D23/19 ,  G05D23/20 ,  C23C14/54 ,  C23C16/458 ,  C23C16/52 ,  G05D23/22

CPC分类号： H01L21/67248 ,  C23C14/541 ,  C23C16/4584 ,  C23C16/52 ,  G05D23/1931 ,  G05D23/22 ,  H01L21/67109

摘要： Provided is a substrate processing apparatus capable of suppressing inferiority when heat treatment is controlled using a temperature sensor. The substrate processing apparatus includes a heating means configured to heat a process chamber wherein a substrate is accommodated; a first temperature detection means configured to detect a temperature about the substrate using a first thermocouple; a second temperature detection means configured to detect a temperature about the heating means using a second thermocouple; a control unit configured to control the heating means based on the temperature detected by the first temperature detection means and the temperature detected by the second temperature detection means; and a control switching means configured to control the control unit based on the temperatures detected by the first temperature detection means and the second temperature detection means such that the control unit is switched between a first control mode and a second control mode, wherein a heat resistance of the first thermocouple is greater than that of the second thermocouple, and a temperature detection performance of the second thermocouple is higher than that of the first thermocouple.

摘要翻译： 提供一种当使用温度传感器控制热处理时能够抑制劣化的基板处理装置。 基板处理装置包括加热装置，其构造成加热容纳基板的处理室; 第一温度检测装置，被配置为使用第一热电偶检测关于所述基板的温度; 第二温度检测装置，被配置为使用第二热电偶检测关于加热装置的温度; 控制单元，被配置为基于由第一温度检测装置检测的温度和由第二温度检测装置检测的温度来控制加热装置; 以及控制切换装置，被配置为基于由第一温度检测装置和第二温度检测装置检测到的温度来控制控制单元，使得控制单元在第一控制模式和第二控制模式之间切换，其中耐热性 的第一热电偶的温度检测性能高于第一热电偶的温度检测性能。

公开(公告)号：US20060188240A1

公开(公告)日：2006-08-24

申请号：US10550202

申请日：2004-06-18

申请人： Kazuo Tanaka ,  Masaaki Ueno ,  Masashi Sugishita

发明人： Kazuo Tanaka ,  Masaaki Ueno ,  Masashi Sugishita

IPC分类号： F26B19/00

CPC分类号： H01L21/67248 ,  G05D23/1928 ,  G05D23/22 ,  H01L21/67109

摘要： It is an object of the invention to provide a substrate processing equipment that can predict a temperature of a substrate and easily control temperature of the substrate. Formed in a reactor (processing chamber) 3 are four temperature adjustment zones, of which setting and adjustment of temperature can be made by zone heaters 340-1 to 340-4. A temperature controller 4 mixes temperatures detected by inner thermocouples 302-1 to 302-4 and outer thermocouples 342-1 to 342-4 to calculate predicted temperatures of substrates by means of the first-order lag calculation on the basis of time constants of temperatures of substrates heated by the zone heaters 340-1 to 340-4. Also, the temperature controller 4 calculates electric power values (operating variables) for the zone heaters 340-1 to 340-4 with the use of predicted temperatures of substrates to output the same to the zone heaters 340-1 to 340-4.

摘要翻译： 本发明的目的是提供一种能够预测基板的温度并容易地控制基板的温度的基板处理设备。 在反应器（处理室）3中形成的是四个温度调节区域，其中温度的设定和调节可以由区域加热器340-1至340-4进行。 温度控制器4将由内部热电偶302-1至302-4检测的温度与外部热电偶342-1至342-4混合，以基于温度的时间常数通过一阶滞后计算来计算衬底的预测温度 的区域加热器340-1至340-4加热的基底。 此外，温度控制器4使用基板的预测温度来计算区域加热器340-1至340-4的电功率值（操作变量），以将其输出到区域加热器340-1至340-4。

公开(公告)号：US07346273B2

公开(公告)日：2008-03-18

申请号：US10550202

申请日：2004-06-18

申请人： Kazuo Tanaka ,  Masaaki Ueno ,  Masashi Sugishita

发明人： Kazuo Tanaka ,  Masaaki Ueno ,  Masashi Sugishita

IPC分类号： F26B3/30 ,  H05B3/02

CPC分类号： H01L21/67248 ,  G05D23/1928 ,  G05D23/22 ,  H01L21/67109

摘要： It is an object of the invention to provide a substrate processing equipment that can predict a temperature of a substrate and easily control temperature of the substrate. Formed in a reactor (processing chamber) 3 are four temperature adjustment zones, of which setting and adjustment of temperature can be made by zone heaters 340-1 to 340-4. A temperature controller 4 mixes temperatures detected by inner thermocouples 302-1 to 302-4 and outer thermocouples 342-1 to 342-4 to calculate predicted temperatures of substrates by means of the first-order lag calculation on the basis of time constants of temperatures of substrates heated by the zone heaters 340-1 to 340-4. Also, the temperature controller 4 calculates electric power values (operating variables) for the zone heaters 340-1 to 340-4 with the use of predicted temperatures of substrates to output the same to the zone heaters 340-1 to 340-4.

摘要翻译： 本发明的目的是提供一种能够预测基板的温度并容易地控制基板的温度的基板处理设备。 在反应器（处理室）3中形成的是四个温度调节区域，其中温度的设定和调节可以由区域加热器340-1至340-4进行。 温度控制器4将由内部热电偶302-1至302-4检测的温度与外部热电偶342-1至342-4混合，以基于温度的时间常数通过一阶滞后计算来计算衬底的预测温度 的区域加热器340-1至340-4加热的基底。 此外，温度控制器4使用基板的预测温度来计算区域加热器340-1至340-4的电功率值（操作变量），以将其输出到区域加热器340-1至340-4。

公开(公告)号：US06746908B2

公开(公告)日：2004-06-08

申请号：US09964863

申请日：2001-09-28

申请人： Kazuo Tanaka ,  Masaaki Ueno ,  Minoru Nakano ,  Hideto Yamaguchi

发明人： Kazuo Tanaka ,  Masaaki Ueno ,  Minoru Nakano ,  Hideto Yamaguchi

IPC分类号： H01L218238

CPC分类号： H01L21/67248 ,  C23C16/46 ,  C30B25/16 ,  C30B31/18 ,  F27D19/00 ,  F27D2019/0018 ,  F27D2019/0028

摘要： A temperature control method is provided which is capable of performing quick, accurate, and error-free soaking control over all wafer areas to be thermally treated at a target temperature without requiring any skilled operator and which can be automated by using a computer. In the temperature control method of controlling a heating apparatus having at least two heating zones in such a manner that temperatures detected at predetermined locations equal a target temperature therefor, temperatures are detected at predetermined locations the number of which is larger than the number of the heating zones, and the heating apparatus is controlled in such a manner that the target temperature falls between a maximum value and a minimum value of a plurality of detected temperatures.

摘要翻译： 提供一种温度控制方法，其能够对目标温度下热处理的所有晶片区域执行快速，准确和无错误的均热控制，而不需要任何熟练的操作者并且可以通过使用计算机自动化。 在控制具有至少两个加热区域的加热装置的温度控制方法中，使得在预定位置处检测的温度等于目标温度，在预定位置检测温度，其数量大于加热次数 区域，并且加热装置以使得目标温度落在多个检测温度的最大值和最小值之间的方式被控制。

公开(公告)号：US06711531B1

公开(公告)日：2004-03-23

申请号：US09369926

申请日：1999-08-09

申请人： Kazuo Tanaka ,  Hideto Yamaguchi ,  Kenzo Urabe

发明人： Kazuo Tanaka ,  Hideto Yamaguchi ,  Kenzo Urabe

IPC分类号： G06G748

CPC分类号： G06G7/66

摘要： A temperature control simulation method and apparatus for forming a temperature system simulation model on a computer, provide substantially the same response or simulation characteristics as a temperature change in an actual furnace, whereby a temperature control algorithm can be developed and the method or manner of manipulating the temperature control can be learned without using an actual furnace. A transfer function is determined which represents a relationship between a heater input and a temperature output. A temperature control simulation for a heating furnace is executed using the transfer function of a heating furnace as a transfer function that a temperature system simulation device uses.

摘要翻译： 用于在计算机上形成温度系统模拟模型的温度控制模拟方法和装置提供与实际炉中的温度变化基本相同的响应或模拟特性，由此可以开发温度控制算法，以及操作的方法或方式 可以在不使用实际炉的情况下学习温度控制。 确定表示加热器输入和温度输出之间的关系的传递函数。 使用加热炉的传递函数作为温度系统模拟装置使用的传递函数来执行加热炉的温度控制模拟。

公开(公告)号：US06496749B1

公开(公告)日：2002-12-17

申请号：US09413467

申请日：1999-10-06

申请人： Hideto Yamaguchi ,  Kazuo Tanaka ,  Kenzo Urabe

发明人： Hideto Yamaguchi ,  Kazuo Tanaka ,  Kenzo Urabe

IPC分类号： G06F1900

CPC分类号： H01L21/67248

摘要： A semiconductor producing apparatus is capable of quickly and accurately changing a controlled variable to a target value to thereby make the controlled variable quickly follow the target value. Moreover, the controlled variable and target value can be adjusted automatically, thus improving the productivity of a process. The semiconductor producing apparatus includes a PID adjustment section to which a target value and a detected control value are inputted through an adder, a pattern generation section having an approximate function for calculating a pattern output and making it possible to change the pattern output in accordance wit parameter values of the approximate function, and a switcher for switching between an output including at least an output of the pattern generation section and an output of the PID adjustment section to thereby generate an output.

摘要翻译： 半导体制造装置能够快速，准确地将受控变量变更为目标值，从而使受控变量快速地追随目标值。 此外，控制变量和目标值可以自动调整，从而提高过程的生产率。 半导体制造装置包括通过加法器输入目标值和检测到的控制值的PID调整部，具有用于计算图案输出的近似函数的图案生成部，并且能够根据机智改变图案输出 近似功能的参数值，以及用于在至少包括模式生成部的输出的输出与PID调整部的输出之间切换的切换器，从而生成输出。

公开(公告)号：US20050266685A1

公开(公告)日：2005-12-01

申请号：US11153223

申请日：2005-06-15

申请人： Minoru Nakano ,  Masaaki Ueno ,  Kazuo Tanaka

发明人： Minoru Nakano ,  Masaaki Ueno ,  Kazuo Tanaka

IPC分类号： H01L21/205 ,  C23C16/46 ,  G05D23/19 ,  H01L21/00 ,  H01L21/44

CPC分类号： G05D23/1935 ,  H01L21/67248

摘要： In a method for controlling temperatures in a semiconductor manufacturing apparatus including a reaction chamber and a plurality of heating sources, a set of power ratios to be fed to the heating sources is determined for each of two or more selected temperatures. Then, a temperature of the reaction chamber is controlled by performing power control on the heating sources based on at least one set of power ratios obtained.

摘要翻译： 在用于控制包括反应室和多个加热源的半导体制造装置中的温度的方法中，针对两个或多个所选择的温度中的每一个确定要供给到加热源的一组功率比。 然后，通过基于获得的至少一组功率比，对加热源进行功率控制来控制反应室的温度。

公开(公告)号：US08973253B2

公开(公告)日：2015-03-10

申请号：US14074858

申请日：2013-11-08

申请人： Tatsuki Hirano ,  Kazuo Tanaka

发明人： Tatsuki Hirano ,  Kazuo Tanaka

IPC分类号： H01C17/00 ,  H01C17/245

CPC分类号： H01C17/006 ,  H01C17/245

摘要： The object of the invention is to provide a method and an apparatus that allow production of metal plate chip resistors having a relatively low resistance with high accuracy and yield through simple process. The object is achieved by apparatus for manufacturing metal plate chip resistors including cutting mold for cutting intermediate product strip transversely to obtain worked product chip, ohm meter for measuring the resistance of the worked product chip, control device having a calculating part for performing a calculation using the resistance measured by the ohm meter to work out a width in which the strip is to be cut transversely so as to obtain a worked product chip of a desired resistance, and cutting width adjustor for making an adjustment so that the strip is to be cut transversely in the width obtained from the calculating part.

摘要翻译： 本发明的目的是提供一种通过简单的工艺制造具有相对较低电阻的金属板片式电阻器的方法和装置，其具有高精度和高产率。 该目的是通过用于制造金属板片电阻器的装置实现的，包括用于横向切割中间产品带的切割模具，以获得加工产品芯片，用于测量加工产品芯片的电阻的欧姆表，具有用于执行计算的计算部分的控制装置 由欧姆计测量的电阻以横向切割条的宽度，以获得期望电阻的加工产品芯片，以及用于进行调整的切割宽度调节器，使得条被切割 横向于从计算部分获得的宽度。

公开(公告)号：US08590141B2

公开(公告)日：2013-11-26

申请号：US13196078

申请日：2011-08-02

申请人： Tatsuki Hirano ,  Kazuo Tanaka

发明人： Tatsuki Hirano ,  Kazuo Tanaka

IPC分类号： H01C17/00

CPC分类号： H01C17/006 ,  H01C17/245

摘要： The object of the invention is to provide a method and an apparatus that allow production of metal plate chip resistors having a relatively low resistance with high accuracy and yield through simple process. The object is achieved by apparatus 10 for manufacturing metal plate chip resistors including cutting mold 21 for cutting intermediate product strip 14 transversely to obtain worked product chip 16a, ohm meter 22 for measuring the resistance of the worked product chip 16a, control device 23 having a calculating part for performing a calculation using the resistance measured by the ohm meter 22 to work out a width in which the strip 14 is to be cut transversely so as to obtain a worked product chip of a desired resistance, and cutting width adjusting means 26, 27 for making an adjustment so that the strip 14 is to be cut transversely in the width obtained from the calculating part.

摘要翻译： 本发明的目的是提供一种通过简单的工艺制造具有相对较低电阻的金属板片式电阻器的方法和装置，其具有高精度和高产率。 该目的是通过用于制造金属板片式电阻器的装置10实现的，包括用于横向切割中间产品条带14的切割模具21，以获得加工产品芯片16a，用于测量加工产品芯片16a的电阻的欧姆计22，具有 使用由欧姆计22测量的电阻进行计算的计算部分，以计算要横向切割条带14的宽度，以获得期望电阻的加工产品芯片;以及切割宽度调节装置26， 27，用于进行调整，使得条带14在从计算部分获得的宽度上横向切割。

公开(公告)号：US08584783B2

公开(公告)日：2013-11-19

申请号：US13531361

申请日：2012-06-22

申请人： Daisuke Saeki ,  Kazuo Tanaka

发明人： Daisuke Saeki ,  Kazuo Tanaka

IPC分类号： B62M27/02

CPC分类号： B62M7/02 ,  B62K19/30 ,  F02B33/32 ,  F02M35/162

摘要： A motorcycle includes a combustion engine (E) of a type, in which a cylinder block (34) protrudes upwardly from a crankcase (32), an air cleaner unit (42) for substantially purifying an air, and a supercharger (44) for taking a substantially purified air from the air cleaner unit (42) thereinto and supplying the air towards the combustion engine (E). The supercharger (44) is disposed rearwardly of the cylinder block (34) and the air cleaner unit (42) is disposed rearwardly thereof. Also, a surge tank (48) is disposed rearwardly upwardly of the cylinder block (34) of the combustion engine (E) and above the supercharger (44).

摘要翻译： 摩托车包括一种内燃机（E），其中气缸体（34）从曲轴箱（32）向上突出，用于基本上净化空气的空气滤清器单元（42），以及增压器（44），用于 从空气滤清器单元（42）中取出基本上净化的空气并将空气供给到内燃机（E）。 增压器（44）设置在气缸体（34）的后方，空气滤清器单元（42）设置在气缸体的后方。 此外，缓冲罐（48）设置在内燃机（E）的气缸体（34）的上方的上方并且位于增压器（44）的上方。