公开(公告)号：US4739444A

公开(公告)日：1988-04-19

申请号：US835764

申请日：1986-03-03

申请人： Shizuo Zushi ,  Tetsuo Ogata ,  Mitsuo Miyamoto ,  Tsutomu Imai ,  Fumiyuki Kobayashi

发明人： Shizuo Zushi ,  Tetsuo Ogata ,  Mitsuo Miyamoto ,  Tsutomu Imai ,  Fumiyuki Kobayashi

IPC分类号： H05K7/20

CPC分类号： H05K7/20563

摘要： In a cooling structure for electronic apparatus in which cards consisting of electronic components mounted on circuit boards are arranged in parallel on a motherboard. A pressure adjustment device with holes is arranged in a cooling air flow passage of each card. The area of the holes is selected in relation to the pressure loss characteristics of the related card based upon average air-flow sectional area.

摘要翻译： 在用于电子设备的冷却结构中，其中安装在电路板上的电子部件组成的卡片平行排列在母板上。 具有孔的压力调节装置布置在每个卡的冷却空气流动通道中。 基于平均气流截面面积，相对于相关卡的压力损失特性来选择孔的面积。

公开(公告)号：US4837663A

公开(公告)日：1989-06-06

申请号：US145473

申请日：1988-01-19

申请人： Shizuo Zushi ,  Mitsuo Miyamoto ,  Hiroshi Gou ,  Fumiyuki Kobayashi ,  Tetsuo Ogata

发明人： Shizuo Zushi ,  Mitsuo Miyamoto ,  Hiroshi Gou ,  Fumiyuki Kobayashi ,  Tetsuo Ogata

IPC分类号： F25D1/02 ,  H05K7/20

CPC分类号： H05K7/20572

摘要： A cooling system for an electronic apparatus comprises a plurality of mother boards each having a circuit board to be cooled, a blower for causing an air flow from one of the mother boards to the other, and a draft duct for directing the air flow between the mother boards.The draft duct includes an inlet for dividing the air flow into a plurality of partial flows, a partition for changing an air flow direction of the partial flows into some other directions, and an outlet for intermixing the partial flows.

摘要翻译： 一种用于电子设备的冷却系统包括多个母板，每个母板具有要冷却的电路板，用于使空气从一个母板引导到另一个的鼓风机，以及用于将空气流引导到 母板 引流管包括用于将空气流分成多个部分流的入口，用于将部分流动的空气流动方向改变成一些其它方向的分隔件和用于混合部分流动的出口。

公开(公告)号：US5040992A

公开(公告)日：1991-08-20

申请号：US444859

申请日：1989-12-04

申请人： Mitsuo Miyamoto ,  Fumiyuki Kobayashi ,  Shizuo Zushi ,  Norio Sengoku ,  Yoshiaki Horita

发明人： Mitsuo Miyamoto ,  Fumiyuki Kobayashi ,  Shizuo Zushi ,  Norio Sengoku ,  Yoshiaki Horita

IPC分类号： G06F1/18 ,  H05K1/14 ,  H05K7/14

CPC分类号： H05K7/1449 ,  H05K1/14 ,  H05K1/148 ,  Y10S439/928

摘要： A first mother board among a plurality of mother boards is mounted adjacent to a reference mother board and a second mother board among said plurality of mother boards is mounted in a position rotated 180.degree. about the horizontal centerline of the second mother board and mounted back to back to the first mother board, whereby the reference mother board and the first and second mother boards can be interconnected at a minimal distance.

摘要翻译： 多个母板中的第一母板安装在参考母板附近，并且所述多个母板中的第二母板安装在围绕第二母板的水平中心线旋转180°的位置，并安装回 返回到第一母板，由此参考母板和第一和第二母板可以以最小的距离相互连接。

公开(公告)号：US5109317A

公开(公告)日：1992-04-28

申请号：US604953

申请日：1990-10-29

申请人： Mitsuo Miyamoto ,  Shizuo Zushi ,  Hiroshi Go ,  Fumiyuki Kobayashi ,  Hiroyuki Kojima

发明人： Mitsuo Miyamoto ,  Shizuo Zushi ,  Hiroshi Go ,  Fumiyuki Kobayashi ,  Hiroyuki Kojima

IPC分类号： H01L23/40 ,  H01L23/433 ,  H01L23/473

CPC分类号： H01L23/4006 ,  H01L23/433 ,  H01L23/473 ,  H01L2224/16225

摘要： A cooling structure for cooling a multi-chip module by a heat sink is disclosed in which the heat sink is disposed above the multi-chip module in a state that heat-conductive grease is sandwiched between the heat sink and the module cap of the multi-chip module, and the heat sink, the module cap and the wiring board of the multi-chip module are clamped as one body by clamp member, and in which a heat-sink pushing member for pressing the heat sink against the module cap by a constant force is attached to the clamp members.

摘要翻译： 公开了一种用于通过散热器冷却多芯片模块的冷却结构，其中散热器设置在多芯片模块上方，导热油脂被夹在散热器和多重模块的模块盖之间 芯片模块，并且多芯片模块的散热器，模块盖和布线板通过夹紧构件夹紧为一体，其中散热器推动构件用于将散热器按压在模块盖上 固定力附着在夹紧件上。

公开(公告)号：US5089936A

公开(公告)日：1992-02-18

申请号：US404341

申请日：1989-09-07

申请人： Hiroyuki Kojima ,  Toshio Hatsuda ,  Takahiro Daikoku ,  Shizuo Zushi ,  Fumiyuki Kobayashi

发明人： Hiroyuki Kojima ,  Toshio Hatsuda ,  Takahiro Daikoku ,  Shizuo Zushi ,  Fumiyuki Kobayashi

IPC分类号： H01L23/40 ,  H01L23/473

CPC分类号： H01L23/473 ,  H01L23/4006 ,  H01L2023/4043 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2224/16225 ,  H01L2224/73253

摘要： In a semiconductor module including a wiring substrate having one or a plurality of semiconductor devices electrically connected thereon, a housing constituted of a sealing frame and a ceiling board to enclose the semiconductor devices therein, and a cooling jacket to cool the semiconductor devices. The semiconductor module comprises an elastic arm placed on the cooling jacket for exerting pressure to cause the cooling jacket to be uniformly contacted with the housing ceiling board, and clamping jigs press the cooling jacket and the ceiling board through the elastic arm, so that the clamping jigs may serve to press the respective intermediate positions of the four sides of the cooling jacket through the elastic arm, or screw fasteners may be provided on the elastic arm for controlling the displacements and pressing force.

摘要翻译： 在包括具有电连接在其上的一个或多个半导体器件的布线基板的半导体模块中，由密封框架和顶板组成的壳体以封装其中的半导体器件，以及用于冷却半导体器件的冷却套。 半导体模块包括放置在冷却套上的弹性臂，用于施加压力以使冷却套与壳体天花板均匀地接触，并且夹具通过弹性臂挤压冷却套和顶板，使得夹紧 夹具可以用于通过弹性臂挤压冷却套的四个侧面的相应中间位置，或者可以在弹性臂上设置螺钉紧固件以控制位移和按压力。

公开(公告)号：US06182742B2

公开(公告)日：2001-02-06

申请号：US08879303

申请日：1997-06-19

申请人： Tatsuya Takahashi ,  Shizuo Zushi ,  Tetsuo Ogata

发明人： Tatsuya Takahashi ,  Shizuo Zushi ,  Tetsuo Ogata

IPC分类号： F28D1500

CPC分类号： H05K7/20281

摘要： A cooling apparatus for use with an electronic system provides an uninterrupted operation capability. A pump supplies a cooling liquid to a liquid-cooled electronic system. The pump is controlled by a controller that also controls a three way valve for controlling the operation of a three-way valve for regulating the flow quantity of the cooling liquid flowing into a heat exchanger for cooling the cooling liquid. The cooling apparatus has a plurality of cooling control units. While one cooling control unit is in operation, the other is in the standby state. If one cooling control unit fails, the standby cooling control unit is automatically put in the operating state, thereby allowing servicing of the failing unit without interrupting the operation of the liquid-cooled electronic system and the cooling apparatus.

摘要翻译： 用于电子系统的冷却装置提供不间断的操作能力。 泵将冷却液供给液冷电子系统。 该泵由控制器控制，该控制器还控制用于控制三通阀的操作的三通阀，用于调节流入用于冷却冷却液体的热交换器中的冷却液的流量。 冷却装置具有多个冷却控制单元。 一个冷却控制单元正在运行时，另一个处于待机状态。 如果一个冷却控制单元发生故障，则备用冷却控制单元自动处于运行状态，从而允许对故障单元进行维修而不中断液冷式电子系统和冷却装置的运行。

公开(公告)号：US5133403A

公开(公告)日：1992-07-28

申请号：US423386

申请日：1989-10-19

申请人： Hitoshi Yokono ,  Takao Terabayashi ,  Nobuo Kayaba ,  Takahiro Daikoku ,  Shigekazu Kieda ,  Fumiyuki Kobayashi ,  Shizuo Zushi

发明人： Hitoshi Yokono ,  Takao Terabayashi ,  Nobuo Kayaba ,  Takahiro Daikoku ,  Shigekazu Kieda ,  Fumiyuki Kobayashi ,  Shizuo Zushi

IPC分类号： H01L23/373 ,  H01L23/433 ,  H01L23/473 ,  H05K7/20

CPC分类号： H01L23/4338 ,  H01L23/3733 ,  F28F2255/18 ,  H01L2224/16225

摘要： A cooling device for cooling semiconductor elements by removing heat generated from the semiconductor elements such as, for example, semiconductor integrated chips in a large-sized electronic computer. The cooling device is fashioned of a composite AlN-BN sintered material having a Vickers hardness not higher than one-fifth of that of an AlN material, and an anisotropic property of thermal conductivity in a two dimensional direction is higher than that of AlN which is isotropic in thermal conductivity. The cooling device may be mass-produced while nevertheless having a high transfer performance matching the quantity of heat generated for each semiconductor element even if the composite sintered material is uniform in shape and size. The composite sintered material is formed by a mixture of a hexagonal BN powder having an average particle diameter of not less than 1 .mu.m and an AlN powder having an average particle diameter of about 2 .mu.m, with a sintering aid being added and the powdery mixture being subjected to a hot press sintering whereby the sintered material is low in thermal conductivity in a direction parallel to an axis of a shaft of the hot press.

摘要翻译： 一种用于通过从大型电子计算机中的诸如半导体集成芯片的半导体元件产生的热量来冷却半导体元件的冷却装置。 该冷却装置由维氏硬度不高于AlN材料的五分之一的复合AlN-BN烧结材料制成，并且二维方向的热导率的各向异性特性比AlN的各向异性高 各向同性的导热性。 即使复合烧结体的形状和尺寸一致，冷却装置也可以批量生产，同时具有与每个半导体元件产生的热量匹配的高转印性能。 复合烧结材料由平均粒径不小于1μm的六方晶BN粉末和平均粒径约2μm的AlN粉末的混合物形成，并加入烧结助剂。 混合物进行热压烧结，由此烧结材料在与热压机的轴的轴线平行的方向上的导热性低。

公开(公告)号：US5077601A

公开(公告)日：1991-12-31

申请号：US404350

申请日：1989-09-07

申请人： Toshio Hatada ,  Takayuki Atarashi ,  Takahiro Daikoku ,  Satomi Kobayashi ,  Shizuo Zushi ,  Fumiyuki Kobayashi ,  Susumu Iwai

发明人： Toshio Hatada ,  Takayuki Atarashi ,  Takahiro Daikoku ,  Satomi Kobayashi ,  Shizuo Zushi ,  Fumiyuki Kobayashi ,  Susumu Iwai

IPC分类号： H01L23/467

CPC分类号： H01L23/467 ,  H01L2924/0002

摘要： A cooling system for cooling an electronic device by allowing a cooling fluid to flow in contact with heat generating components such as LSI chips of the electronic device arranged in series along the major flow of the cooling fluid. The cooling system has heat radiation fins attached to the heat-generating components, and a cooling duct defining a cooling fluid flow passage in which assemblies composed of the heat-generating components and the heat radiation fins are disposed. The flow passage has, at the upstream end of the upstream end assembly, a cross-sectional area greater than that of the assembly when taken in a plane perpendicular to the direction of the major flow of the cooling fluid. The cross-sectional area of the flow passage progressively decreases towards the downstream end, whereby the flow passage is divided into a main passage through which a main flow component of the cooling fluid directly flows into the series of assemblies and an auxiliary passage through which an auxiliary component of the cooling fluid flows substantially vertically towards the heat-generating component to impinge upon the heat generating component.

摘要翻译： 一种冷却系统，用于通过使冷却流体沿着沿着冷却流体的主流排列成串联的电子装置的发热部件等发热部件而流动而冷却电子设备。 冷却系统具有附接到发热部件的散热翅片，以及限定冷却流体流动通道的冷却管道，其中设置有由发热部件和散热翅片组成的组件。 当在垂直于冷却流体的主流方向的平面中时，流动通道在上游端组件的上游端处具有大于组件的截面面积的横截面面积。 流动通道的横截面积朝向下游端逐渐减小，由此流动通道被分成主通道，冷却流体的主流分量通过该主通道直接流入一系列组件和辅助通道，通过该辅助通道 冷却流体的辅助部件基本垂直地朝着发热部件流动以撞击发热部件。

公开(公告)号：US5144531A

公开(公告)日：1992-09-01

申请号：US637690

申请日：1991-01-07

申请人： Hiroshi Go ,  Shizuo Zushi ,  Mitsuo Miyamoto

发明人： Hiroshi Go ,  Shizuo Zushi ,  Mitsuo Miyamoto

IPC分类号： H01L23/427 ,  H01L23/473 ,  H05K7/20

CPC分类号： H01L23/473 ,  H01L2924/0002

摘要： In a liquid cooling system comprising cold plates attached to their respective circuit modules, quick couplers are provided for connecting flexible hoses to these cold plates, a supply duct and a return duct to form strings of cold plates connected between the supply duct and the return duct. Valved quick couplers are used for the connection to the supply duct and the return duct, and valveless quick couplers are used for the connection to the cold plates. When a circuit module is to be serviced, a desired string of cold plates is disconnected from the supply duct and the return duct by disjoining the valved quick couplers for the connection thereto. The disconnected string of cold plates is drained of the coolant, and then the cold plate attached to the desired circuit module is disconnected from the hoses. Subsequently the desired circuit module and the cold plate attached thereto can be detached as one body from an associated connector.

摘要翻译： 在包括连接到它们各自的电路模块的冷板的液体冷却系统中，提供快速联接器用于将柔性软管连接到这些冷板，供应管道和回流管道，以形成连接在供应管道和回流管道 。 带阀的快速接头用于连接到供气管道和回流管道，无阀快速接头用于连接冷板。 当要对电路模块进行维修时，将所需的一系列冷板与供应管道和回流管道分离，通过分离与阀连接的带阀的快速联接器。 断开的冷却板串排出冷却液，然后连接到所需电路模块的冷板与软管断开连接。 随后，所需的电路模块和附接到其上的冷板可以作为一个主体从相关联的连接器分离。

公开(公告)号：US5345107A

公开(公告)日：1994-09-06

申请号：US839071

申请日：1992-02-20

申请人： Takahiro Daikoku ,  Nobuo Kawasaki ,  Noriyuki Ashiwake ,  Keizou Kawamura ,  Shizuo Zushi ,  Mitsuo Miyamoto ,  Atsushi Morihara

发明人： Takahiro Daikoku ,  Nobuo Kawasaki ,  Noriyuki Ashiwake ,  Keizou Kawamura ,  Shizuo Zushi ,  Mitsuo Miyamoto ,  Atsushi Morihara

IPC分类号： F28F13/00 ,  H01L23/433 ,  H01L23/473 ,  H01L25/065 ,  F28F7/00 ,  H01L23/00 ,  H05K7/20

CPC分类号： H01L24/32 ,  F28F13/00 ,  H01L23/4338 ,  H01L23/473 ,  H01L25/0655 ,  F28F2013/005 ,  H01L2224/16 ,  H01L2224/32057 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/83385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/0132 ,  H01L2924/15312 ,  H01L2924/16152

摘要： The present invention relates to a cooling apparatus for an electronic device, in which a cooling solid body in close contact through thermal conductive fluid with a heat transfer portion of the electronic device is provided, on its one surface in contact with the electronic device, with a number of grooves communicating with the outside of the heat transfer portion, and a spring member for elastically pressing this cooling solid body on the electronic device is provided for forcing the cooling solid body into close contact with the electronic device by means of the thermal conductive fluid in a third layer.

摘要翻译： 本发明涉及一种用于电子设备的冷却装置，其中在其与电子设备接触的一个表面上设置有通过导电流体与电子设备的传热部分紧密接触的冷却固体，与 提供与传热部分的外部连通的多个槽，以及用于将该冷却固体本体弹性挤压在电子装置上的弹簧构件，用于迫使冷却固体与电子装置紧密接触，借助于导热 流体在第三层。