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    Cooling apparatus for electronic device
    2.
    发明授权
    Cooling apparatus for electronic device 失效
    电子设备冷却装置

    公开(公告)号：US5126829A

    公开(公告)日：1992-06-30

    申请号：US412130

    申请日：1989-09-25

    申请人： Takahiro Daikoku ,  Nobuo Kawasaki ,  Noriyuki Ashiwake ,  Shizuo Zushi

    发明人： Takahiro Daikoku ,  Nobuo Kawasaki ,  Noriyuki Ashiwake ,  Shizuo Zushi

    IPC分类号： H01L23/433 ,  H05K7/20

    CPC分类号： H01L23/4338 ,  H01L2224/16

    摘要： A cooling apparatus for an electronic device makes a cooling solid body in contact with the electronic device so as to cool the electronic device. The apparatus has a high viscous thermal conductive fluid provided on a heat transfer portion of the electronic device, and a cooling solid body in close contact through the thermal conductive fluid with the heat transfer portion of the electronic device. The close contact portion of at least one of the cooling solid body and the electronic device has multiple grooves open to the outside of the one of the cooling solid body and the electronic device.

    摘要翻译： 一种用于电子设备的冷却装置使冷却固体与电子设备接触，以冷却电子设备。 该设备具有设置在电子设备的传热部分上的高粘性导热流体和通过导电流体与电子设备的传热部分紧密接触的冷却固体。 冷却固体和电子装置中的至少一个的紧密接触部分具有向冷却固体和电子装置之一的外部开口的多个凹槽。

    Cooling apparatus of electronic devices
    3.
    发明授权
    Cooling apparatus of electronic devices 失效
    电子设备冷却装置

    公开(公告)号：US5595240A

    公开(公告)日：1997-01-21

    申请号：US464581

    申请日：1995-06-05

    申请人： Takahiro Daikoku ,  Noriyuki Ashiwake ,  Nobuo Kawasaki ,  Shizuo Zushi

    发明人： Takahiro Daikoku ,  Noriyuki Ashiwake ,  Nobuo Kawasaki ,  Shizuo Zushi

    IPC分类号： H01L23/36 ,  H01L23/433 ,  H01L23/34

    CPC分类号： H01L23/4338 ,  H01L2224/16225

    摘要： A cooling apparatus of electronic devices including thermal conductive members each of which is positioned with one side thereof being in contact with a surface of each electronic device, the other side thereof being fitted to a housing with a small clearance provided therebetween, so as to diffuse and remove heat generated in the electronic devices. In order to press each thermal conductive member onto the associated electronic device, a resilient member is provided between the housing and the thermal conductive member, and is arranged to have a width larger than a width of grooves between fins formed on the housing and also larger than a width of grooves between fins formed on the thermal conductive member. A setting space to receive each resilient member therein is formed in a region where the fins are fitted to each other, so that the resilient member and the thermal conductive member can be fitted and positioned with respect to the housing when the resilient member is provided in this setting space.

    摘要翻译： 一种电子设备的冷却装置，包括导热构件，每个导热构件的一侧与每个电子装置的表面接触，其另一侧装配到具有设置在其间的小间隙的壳体，以便扩散 并去除电子设备中产生的热量。 为了将每个导热构件按压到相关联的电子装置上，弹性构件设置在壳体和导热构件之间，并且布置成具有比形成在壳体上的翅片之间的凹槽的宽度更大的宽度，并且还更大 比形成在导热构件上的翅片之间的槽宽度大。 在翅片彼此装配的区域中形成有用于接收其中的每个弹性构件的设置空间，使得当弹性构件设置在弹性构件中时，可以将弹性构件和导热构件相对于壳体配合和定位 这个设置空间。

    Cooling apparatus of electronic devices
    4.
    发明授权
    Cooling apparatus of electronic devices 失效
    电子设备冷却装置

    公开(公告)号：US5515912A

    公开(公告)日：1996-05-14

    申请号：US664605

    申请日：1991-03-04

    申请人： Takahiro Daikoku ,  Noriyuki Ashiwake ,  Nobuo Kawasaki ,  Shizuo Zushi

    发明人： Takahiro Daikoku ,  Noriyuki Ashiwake ,  Nobuo Kawasaki ,  Shizuo Zushi

    IPC分类号： H01L23/36 ,  H01L23/433 ,  H01L23/34

    CPC分类号： H01L23/4338 ,  H01L2224/16225

    摘要： A cooling apparatus of electronic devices including thermal conductive members each of which is positioned with one side thereof being in contact with a surface of each electronic device, the other side thereof being fitted to a housing with a small clearance provided therebetween, so as to diffuse and remove heat generated in the electronic devices. In order to press each thermal conductive member onto the associated electronic device, a resilient member is provided between the housing and the thermal conductive member, and is arranged to have a width larger than a width of grooves between fins formed on the housing and also larger than a width of grooves between fins formed on the thermal conductive member. A setting space to receive each resilient member therein is formed in a region where the fins are fitted to each other, so that the resilient member and the thermal conductive member can be fitted and positioned with respect to the housing when the resilient member is provided in this setting space.

    摘要翻译： 一种电子设备的冷却装置，包括导热构件，每个导热构件的一侧与每个电子装置的表面接触，其另一侧装配到具有设置在其间的小间隙的壳体，以便扩散 并去除电子设备中产生的热量。 为了将每个导热构件按压到相关联的电子装置上，弹性构件设置在壳体和导热构件之间，并且布置成具有比形成在壳体上的翅片之间的沟槽宽度更大的宽度，并且还更大 比形成在导热构件上的翅片之间的槽宽度大。 在翅片彼此装配的区域中形成有用于接收其中的每个弹性构件的设置空间，使得当弹性构件设置在弹性构件中时，可以将弹性构件和导热构件相对于壳体配合和定位 这个设置空间。

    Heat sinks and semiconductor cooling device using the heat sinks
    5.
    发明授权
    Heat sinks and semiconductor cooling device using the heat sinks 失效
    散热片和使用散热片的半导体冷却装置

    公开(公告)号：US5365400A

    公开(公告)日：1994-11-15

    申请号：US771777

    申请日：1991-10-04

    申请人： Noriyuki Ashiwake ,  Takahiro Daikoku ,  Toshio Hatsuda ,  Shizuo Zushi ,  Satomi Kobayashi

    发明人： Noriyuki Ashiwake ,  Takahiro Daikoku ,  Toshio Hatsuda ,  Shizuo Zushi ,  Satomi Kobayashi

    IPC分类号： H01L23/433 ,  H01L23/473 ,  H01L25/065 ,  H05K7/20

    CPC分类号： H01L23/433 ,  H01L23/4735 ,  H01L25/0655 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01014 ,  H01L2924/15312 ,  H01L2924/16152 ,  Y10S165/908

    摘要： Disclosed are heat sinks particularly effective in cooling semiconductors of a high heat dissipating density and including a multiplicity of tabular fins laminated via spacers and having through-holes pierced in their central parts, the holes admitting introduction of cooling fluids which radially flow in between the fins. The cooling fluids are supplied to the respective heat sinks attached to the multiplicity of semiconductors mounted on a board. In a specific form of the invention, the semiconductor cooling device has a heat sink provided with parallel tabular internal fins and a cooling fluid nozzle having an elongated opening substantially orthogonal to the fins, the nozzle being disposed to span over the parallel tabular fins substantially at longitudinal mid portions of these fins, so that the cooling fluid is evenly distributed from the mid portions of the fins to both longitudinal ends of the fins.

    摘要翻译： 公开了散热器在散热密度高的冷却半导体中特别有效，并且包括通过间隔件层叠的多个片状翅片，并且在其中心部分中穿透通孔，允许在散热片之间径向流动的冷却流体的引入 。 冷却流体被供应到附接到安装在板上的多个半导体的各个散热器。 在本发明的具体形式中，半导体冷却装置具有设置有平行的片状内部散热片的散热器和具有与散热片基本正交的细长开口的冷却流体喷嘴，该喷嘴设置成跨越平行板状翅片， 这些翅片的纵向中间部分，使得冷却流体从翼片的中部均匀地分布到翅片的两个纵向端部。

    Cooling device of multi-chip module
    7.
    发明授权
    Cooling device of multi-chip module 失效
    多芯片模块冷却装置

    公开(公告)号：US5751062A

    公开(公告)日：1998-05-12

    申请号：US571711

    申请日：1995-12-13

    申请人： Takahiro Daikoku ,  Fumiyuki Kobayashi ,  Noriyuki Ashiwake ,  Kenichi Kasai ,  Keizou Kawamura ,  Akio Idei

    发明人： Takahiro Daikoku ,  Fumiyuki Kobayashi ,  Noriyuki Ashiwake ,  Kenichi Kasai ,  Keizou Kawamura ,  Akio Idei

    IPC分类号： H01L23/36 ,  H01L23/433 ,  H01L23/367

    CPC分类号： H01L23/4338 ,  H01L2224/73253

    摘要： A cooling device of a multi-chip module has micropackages that are independent of thermal deformation and easy to assembly and disassembly. The multi-chip module includes a multi-layer substrate on which the micropackages, each encasing an LSI chip, are mounted, and a housing formed integrally with a cooler. Each of the micropackages includes a first heat conduction member, having a cap portion for receiving the LSI chip and a first fin made of the same material as the cap portion to be integral therewith, and a substrate fixed to the cap portion of the first heat conduction member, the LSI chip being mounted on the substrate which is securely fixed to the cap portion of the heat conduction member while being fixedly joined at the back surface thereof to an inner surface of the cap portion of the first heat conduction member. Second heat conduction members, each including a base portion and a second fin, are disposed to engage with the first fins and be pressed against the cooler by a spring, respectively.

    摘要翻译： 多芯片模块的冷却装置具有独立于热变形和易于组装和拆卸的微封装。 多芯片模块包括多层基板，其上安装有每个包装LSI芯片的微封装以及与冷却器一体形成的壳体。 每个微封装包括第一导热构件，具有用于容纳LSI芯片的盖部分和与其一体形成的与盖部分相同的材料制成的第一鳍片，以及固定到第一热量帽盖部分的基板 所述LSI芯片被安装在所述基板上，所述基板被牢固地固定到所述导热部件的盖部，同时在其背面牢固地接合到所述第一导热部件的盖部的内表面。 每个包括基部和第二翅片的第二热传导构件设置成与第一翅片接合并且分别通过弹簧压靠在冷却器上。

    Semiconductor module
    10.
    发明授权
    Semiconductor module 失效
    半导体模块

    公开(公告)号：US5089936A

    公开(公告)日：1992-02-18

    申请号：US404341

    申请日：1989-09-07

    申请人： Hiroyuki Kojima ,  Toshio Hatsuda ,  Takahiro Daikoku ,  Shizuo Zushi ,  Fumiyuki Kobayashi

    发明人： Hiroyuki Kojima ,  Toshio Hatsuda ,  Takahiro Daikoku ,  Shizuo Zushi ,  Fumiyuki Kobayashi

    IPC分类号： H01L23/40 ,  H01L23/473

    CPC分类号： H01L23/473 ,  H01L23/4006 ,  H01L2023/4043 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2224/16225 ,  H01L2224/73253

    摘要： In a semiconductor module including a wiring substrate having one or a plurality of semiconductor devices electrically connected thereon, a housing constituted of a sealing frame and a ceiling board to enclose the semiconductor devices therein, and a cooling jacket to cool the semiconductor devices. The semiconductor module comprises an elastic arm placed on the cooling jacket for exerting pressure to cause the cooling jacket to be uniformly contacted with the housing ceiling board, and clamping jigs press the cooling jacket and the ceiling board through the elastic arm, so that the clamping jigs may serve to press the respective intermediate positions of the four sides of the cooling jacket through the elastic arm, or screw fasteners may be provided on the elastic arm for controlling the displacements and pressing force.

    摘要翻译： 在包括具有电连接在其上的一个或多个半导体器件的布线基板的半导体模块中，由密封框架和顶板组成的壳体以封装其中的半导体器件，以及用于冷却半导体器件的冷却套。 半导体模块包括放置在冷却套上的弹性臂，用于施加压力以使冷却套与壳体天花板均匀地接触，并且夹具通过弹性臂挤压冷却套和顶板，使得夹紧 夹具可以用于通过弹性臂挤压冷却套的四个侧面的相应中间位置，或者可以在弹性臂上设置螺钉紧固件以控制位移和按压力。