公开(公告)号：US20140174605A1

公开(公告)日：2014-06-26

申请号：US14237404

申请日：2012-08-22

申请人： Sho Nakagawa ,  Hiroki Muraoka ,  Kanji Kuba ,  Yousuke Kawamura

发明人： Sho Nakagawa ,  Hiroki Muraoka ,  Kanji Kuba ,  Yousuke Kawamura

IPC分类号： B23K35/02 ,  B23K35/26

CPC分类号： B23K35/025 ,  B22F1/00 ,  B22F1/02 ,  B22F1/025 ,  B23K35/0238 ,  B23K35/0244 ,  B23K35/22 ,  B23K35/26 ,  B23K35/262 ,  B23K35/3006 ,  B32B15/01 ,  B32B15/018 ,  C22C1/0491 ,  C22C5/06 ,  C22C9/00 ,  C22C9/02 ,  C22C9/04 ,  C22C13/00 ,  C22C2204/00 ,  Y10T428/12028

摘要： In solder powder having an average particle size of 5 μm or less and constituted by a center core and a covering layer covering the center core, wherein the center core consists of an intermetallic compound of silver and tin, or silver and the intermetallic compound of silver and tin, the covering layer consists of tin, and an intermediate layer which consists of an intermetallic compound of copper and tin is interposed between the center core and the covering layer so that at least a part of the center core is covered thereby.

摘要翻译： 在平均粒径为5μm以下的焊料粉末中，由中心芯和覆盖中心芯的覆盖层构成，其中中心芯由银和锡的金属间化合物或银和银的金属间化合物组成 锡，覆盖层由锡组成，并且由中间芯和覆盖层之间插入由铜和锡的金属间化合物组成的中间层，使得中心芯的至少一部分被覆盖。

公开(公告)号：US08882934B2

公开(公告)日：2014-11-11

申请号：US14237404

申请日：2012-08-22

申请人： Sho Nakagawa ,  Hiroki Muraoka ,  Kanji Kuba ,  Yousuke Kawamura

发明人： Sho Nakagawa ,  Hiroki Muraoka ,  Kanji Kuba ,  Yousuke Kawamura

IPC分类号： B23K35/02 ,  B22F1/00 ,  C22C5/06 ,  B32B15/01 ,  B23K35/26 ,  B22F1/02 ,  C22C9/02 ,  B23K35/22 ,  B23K35/30 ,  C22C13/00

CPC分类号： B23K35/025 ,  B22F1/00 ,  B22F1/02 ,  B22F1/025 ,  B23K35/0238 ,  B23K35/0244 ,  B23K35/22 ,  B23K35/26 ,  B23K35/262 ,  B23K35/3006 ,  B32B15/01 ,  B32B15/018 ,  C22C1/0491 ,  C22C5/06 ,  C22C9/00 ,  C22C9/02 ,  C22C9/04 ,  C22C13/00 ,  C22C2204/00 ,  Y10T428/12028

摘要： In solder powder having an average particle size of 5 μm or less and constituted by a center core and a covering layer covering the center core, wherein the center core consists of an intermetallic compound of silver and tin, or silver and the intermetallic compound of silver and tin, the covering layer consists of tin, and an intermediate layer which consists of an intermetallic compound of copper and tin is interposed between the center core and the covering layer so that at least a part of the center core is covered thereby.

摘要翻译： 在平均粒径为5μm以下的焊料粉末中，由中心芯和覆盖中心芯的覆盖层构成，其中中心芯由银和锡的金属间化合物或银和银的金属间化合物组成 锡，覆盖层由锡组成，并且由中间芯和覆盖层之间插入由铜和锡的金属间化合物组成的中间层，使得中心芯的至少一部分被覆盖。

公开(公告)号：US20100009191A1

公开(公告)日：2010-01-14

申请号：US12375054

申请日：2007-07-27

申请人： Kanji Kuba ,  Akihiro Higami ,  Takahiro Uno

发明人： Kanji Kuba ,  Akihiro Higami ,  Takahiro Uno

IPC分类号： B32B5/16 ,  C01B21/00

CPC分类号： B22F9/24 ,  B22F1/0044 ,  B22F2009/088 ,  B22F2998/00 ,  Y10T428/2982 ,  B22F1/0018

摘要： A method for producing fine silver particles which is characterized by making an aqueous silver ammine complex solution and a reducing agent solution come in contact with each other in an open space to reduce the silver ammine complex and deposit fine silver particles, either in which the contacting is conducted by (i) a method of spraying an aqueous silver ammine complex solution and a reducing agent solution through nozzles or (ii) a method of discharging an aqueous silver ammine complex solution and a reducing agent solution from obliquely downward nozzles opposite to each other to thereby produce fine silver particles which are free from coarse particles having particle sizes of 5 μm or more and have a mean particle size of primary particles of 0.08 to 1.0 μm and crystallite sizes of 20 to 150 nm or in which an aqueous silver ammine complex solution having a silver concentration of 20 to 180 g/L and an organic reducing agent solution having a reducing agent concentration of about 0.6 to about 1.4 times the silver concentration by reaction equivalent are used to thereby stably produce fine silver particles having a mean particle size of primary particles of 0.05 to 1.0 μm and crystallite sizes of 20 to 150 nm.

摘要翻译： 特征在于使银氨络合物溶液和还原剂溶液形成的细银粒子的方法在开放空间中彼此接触以减少银氨络合物并沉积细银粒子，其中接触 是通过（i）通过喷嘴喷射银氨络合物溶液和还原剂溶液的方法进行的，或者（ii）从彼此相对的斜向下喷嘴排出银氨络合物溶液和还原剂溶液的方法 从而得到不含粒径为5μm以上的粗粒子，并且具有0.08〜1.0μm的一次粒子的平均粒径和20〜150nm的微晶尺寸的细银粒子，或者其中含有银氨络合物 银浓度为20〜180g / L的溶液和还原剂浓度约为的有机还原剂溶液 使用反应当量的银浓度的0.6〜约1.4倍，从而稳定地制备平均粒径为0.05〜1.0μm的微粒和20〜150nm的微晶尺寸的微细银粒子。

公开(公告)号：US09067800B2

公开(公告)日：2015-06-30

申请号：US14115360

申请日：2012-05-08

申请人： Takuma Katase ,  Akihiro Masuda ,  Kanji Kuba

发明人： Takuma Katase ,  Akihiro Masuda ,  Kanji Kuba

IPC分类号： C01G19/00 ,  C01G19/02 ,  C25D21/14 ,  C25D3/30

CPC分类号： C01G19/02 ,  C01P2004/61 ,  C01P2006/11 ,  C01P2006/12 ,  C01P2006/80 ,  C25D3/30 ,  C25D21/14

摘要： An object of the present invention is to provide tin(II) oxide powder which has extremely high solubility in an acid or an acidic plating solution, excellent in storage stability in the air and can heighten oxidation-preventive effect of Sn2+ ion in the plating solution. The method for manufacturing tin(II) oxide powder of the present invention comprises Step (11) of preparing an aqueous acidic solution containing Sn2+ ions, Step (12) of neutralizing the aqueous acidic solution by adding an aqueous alkaline solution to prepare a slurry of tin(II) hydroxide, Step (13) of dehydrating the prepared slurry to obtain a slurry of tin(II) oxide, Step (14) of separating the slurry of tin(II) oxide into a solid and a liquid to obtain tin(II) oxide, Step (15) of treating the obtained tin(II) oxide with an aqueous antioxidant solution, and Step (16) of vacuum drying the tin(II) oxide treated with the aqueous antioxidant solution.

摘要翻译： 本发明的目的在于提供在酸性或酸性电镀液中溶解度极高的氧化锡（II）粉末，空气中的保存稳定性优异，能够提高镀液中Sn2 +离子的氧化效果 。 制备本发明的氧化锡（II）的方法包括制备含有Sn 2+离子的酸性水溶液的步骤（11），通过加入碱性水溶液中和酸性水溶液的步骤（12），制备 （II）氢氧化物，步骤（13）使制备的浆料脱水以获得氧化锡（II）的浆料，步骤（14）将氧化锡（II）的浆料分离成固体和液体以获得锡（ II）氧化物，用抗氧化剂水溶液处理得到的氧化锡（II）的步骤（15），以及用水性抗氧化剂溶液处理的氧化锡（II）的真空干燥步骤（16）。

公开(公告)号：US09108861B2

公开(公告)日：2015-08-18

申请号：US14115366

申请日：2012-05-08

申请人： Takuma Katase ,  Akihiro Masuda ,  Kanji Kuba

发明人： Takuma Katase ,  Akihiro Masuda ,  Kanji Kuba

IPC分类号： C01G19/02 ,  C25D21/18 ,  C25D3/30

CPC分类号： C01G19/02 ,  C01P2004/61 ,  C01P2006/11 ,  C01P2006/12 ,  C01P2006/80 ,  C25D3/30 ,  C25D21/18

摘要： An object and a problem of the present invention is to provide tin(II) oxide powder which has extremely high solubility in an acid or an acidic plating solution and excellent in storage stability in the air. The tin(II) oxide powder of the present invention is for replenishing a tin component of a tin-alloy plating solution, and comprises 100 to 5000 ppm of an antioxidant being contained in the powder with a mass ratio, and has such a dissolution rate that when 0.1 g of the tin(II) oxide powder is added to 100 ml of 100 g/L aqueous alkylsulfonic acid solution at a temperature of 25° C. and stirred, then the powder dissolves therein within 180 seconds.

摘要翻译： 本发明的目的和问题是提供在酸性或酸性电镀溶液中具有极高溶解度的氧化锡（II）粉末，并且在空气中的储存稳定性优异。 本发明的锡（II）氧化物粉末用于补充锡合金电镀液的锡成分，其中含有质量比为100〜5000ppm的粉末中的抗氧化剂，并具有这样的溶解速度 当将0.1g氧化锡（II）粉末在25℃的温度下加入100ml 100g / L烷基磺酸水溶液中并搅拌时，粉末在180秒内溶解。