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公开(公告)号：US07777398B2
公开(公告)日：2010-08-17
申请号：US11857599
申请日：2007-09-19
IPC分类号： H01L41/047
CPC分类号： H01L41/0472 , H01L41/293
摘要： A piezoelectric actuator includes external conductors formed on an outer surface of a piezoelectric component. The external conductors each include a thick-film conductor and a conductive reinforcer. The thick-film conductor is provided with a first thick-film conductor formed on the outer surface of the piezoelectric component, second thick-film conductors which are formed on part of an outer surface of the first thick-film conductor and which are in surface-contact with the outer surface of the first thick-film conductor. The conductive reinforcer is attached to outer surfaces of the second thick-film conductors.
摘要翻译： 压电致动器包括形成在压电元件的外表面上的外部导体。 外部导体各自包括厚膜导体和导电加强件。 厚膜导体设置有形成在压电元件的外表面上的第一厚膜导体，第二厚膜导体形成在第一厚膜导体的外表面的一部分上， - 与第一厚膜导体的外表面接触。 导电加强件附接到第二厚膜导体的外表面。
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公开(公告)号：US20080007144A1
公开(公告)日：2008-01-10
申请号：US11857599
申请日：2007-09-19
IPC分类号： H01L41/083
CPC分类号： H01L41/0472 , H01L41/293
摘要： A piezoelectric actuator includes external conductors formed on an outer surface of a piezoelectric component. The external conductors each include a thick-film conductor and a conductive reinforcer. The thick-film conductor is provided with a first thick-film conductor formed on the outer surface of the piezoelectric component, second thick-film conductors which are formed on part of an outer surface of the first thick-film conductor and which are in surface-contact with the outer surface of the first thick-film conductor. The conductive reinforcer is attached to outer surfaces of the second thick-film conductors.
摘要翻译： 压电致动器包括形成在压电元件的外表面上的外部导体。 外部导体各自包括厚膜导体和导电加强件。 厚膜导体设置有形成在压电部件的外表面上的第一厚膜导体，第二厚膜导体形成在第一厚膜导体的外表面的一部分上，并且表面 - 与第一厚膜导体的外表面接触。 导电加强件附接到第二厚膜导体的外表面。
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公开(公告)号：US08802998B2
公开(公告)日：2014-08-12
申请号：US12720745
申请日：2010-03-10
申请人： Yoshiko Okada , Osamu Chikagawa , Hidekiyo Takaoka , Shodo Takei
发明人： Yoshiko Okada , Osamu Chikagawa , Hidekiyo Takaoka , Shodo Takei
CPC分类号： H05K3/4629 , H01G2/02 , H01G4/005 , H01G4/30 , H01L2224/82039 , H01L2224/82047 , H01L2924/01004 , H01L2924/01025 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H05K1/0306 , H05K1/092 , H05K1/186 , H05K3/4611 , H05K2201/10636 , Y02P70/611 , Y10T29/49155
摘要： A ceramic multilayer substrate incorporating a chip-type ceramic component, in which, even if the chip-type ceramic component is mounted on the surface of the ceramic multilayer substrate, bonding strength between the chip-type ceramic component and an internal conductor or a surface electrode of the ceramic multilayer substrate is greatly improved and increased. The ceramic multilayer substrate includes a ceramic laminate in which a plurality of ceramic layers are stacked, an internal conductor disposed in the ceramic laminate, a surface electrode disposed on the upper surface of the ceramic laminate, and a chip-type ceramic component bonded to the internal conductor or the surface electrode through an external electrode. The internal conductor or the surface electrode is bonded to the external electrode through a connecting electrode, and the connecting electrode forms a solid solution with any of the internal conductor, the surface electrode, and the external electrode.
摘要翻译： 另外，在芯片型陶瓷部件的陶瓷多层基板中，即使在陶瓷多层基板的表面上安装有芯片型陶瓷部件，也可以将芯片型陶瓷部件与内部导体或表面 陶瓷多层基板的电极大大改善和增加。 陶瓷多层基板包括层叠有多个陶瓷层的陶瓷层叠体，设置在陶瓷层叠体中的内部导体，设置在陶瓷层叠体的上表面的表面电极以及与该陶瓷层叠体接合的芯片型陶瓷构件 内部导体或表面电极通过外部电极。 内部导体或表面电极通过连接电极接合到外部电极，连接电极与内部导体，表面电极和外部电极中的任一个形成固溶体。
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