摘要:
A closed loop heat dissipation apparatus includes a heat transfer seat containing an operation fluid, a seal lid attaching to a heat generating element and sealing one side of the heat transfer seat to hold the operation fluid therein, a tube made of flexible metal to couple on the heat transfer seat in a bendable manner and a radiation fin assembly mounted on the tube. The operation fluid absorbs the heat energy of the heat generating element and circulates in the tube to evenly distribute the heat energy, and is condensed to liquid phase to flow back to the heat transfer seat. The apparatus may be fabricated at a lower cost and achieve an improved heat dissipation effect.
摘要:
A radiation board consists of a case and a lid. The case has a plurality of circulation channels formed on an inner wall. The lid seals the case to confine an operation fluid in the circulation channels of the case. The lid has miniature flutes corresponding to the circulation channels. Heat generated by a heat-generating element during operation is transferred through the lid to the operation fluid to vaporize the operation fluid. The miniature flutes help to condense the vaporized operation fluid into a liquid again. The operation fluid circulates in the case through the circulation channels to evenly distribute heat to the entire device. The radiation board is easy to fabricate at a low cost.
摘要:
A radiator structure includes a radiator frame, a radiator and a plurality of elastic latch members. The radiator frame is mounted onto a main board corresponding to an electronic element, and has a plurality of coupling sections and an opening corresponding to the electronic element and the surface of the electronic element exceeds its peripheral edges. The radiator is mounted on the radiator frame in contact with the surface of the electronic element, and has a plurality of latch sections corresponding to the coupling sections. The elastic latch member coupled on the latch section is bent to form a force applying section, a latch arm and a swinging arm. After the force applying section receives a force, the swinging arm coupled on the latch section is turned to enable the latch arm to latch on the coupling section thereby to anchor the radiator on the radiator frame to disperse heat.
摘要:
A radiator structure includes a radiator frame, a radiator and a plurality of elastic latch members. The radiator frame is mounted onto a main board corresponding to an electronic element, and has a plurality of coupling sections and an opening corresponding to the electronic element and the surface of the electronic element exceeds its peripheral edges. The radiator is mounted on the radiator frame in contact with the surface of the electronic element, and has a plurality of latch sections corresponding to the coupling sections. The elastic latch member coupled on the latch section is bent to form a force applying section, a latch arm and a swinging arm. After the force applying section receives a force, the swinging arm coupled on the latch section is turned to enable the latch arm to latch on the coupling section thereby to anchor the radiator on the radiator frame to disperse heat.
摘要:
A central processing unit (CPU) that has a die on one side and a radiator mounting onto the side of the CPU where the die is located includes a protection wall surrounding the die. The protection wall prevents the radiator from directly hitting the CPU during mounting thereby protects the CPU from being damaged and facilitates installation of the radiator.
摘要:
A plate evaporator includes a first thermal conductive element and a second thermal conducive element. The rim of the first thermal conductive element is formed with a first joining portion. The second thermal conductive element is like a cap having a second joining portion at the rim and correspondent to the first joining portion of the first thermal conductive element. Therefore, upon assembling the two thermal conductive elements, the first and second joining portions are engaged. When brazing, only the joining portions are at high temperature. The temperature rise does not apply to the whole thermal conductive elements and does not influence the strength of the structure.
摘要:
A miniaturized fan module can be accommodated in an electronic system (such as a server) to provide heat dissipation. The miniaturized fan module has a smaller structural size than that of a conventional fan module, such that a larger bump-preventing buffer space between the miniaturized fan module and a framework of the server is provided for preventing the fan module from bumping against the server framework due to vibration generated in practical operation, without degrading a heat dissipating effect and structural strength of the fan module.
摘要:
A serial fan set and rotation speed-matching curve generation method thereof are provided. The serial fan set comprises a rotation speed control module, a first fan and a second fan, in which the rotation speed control module is used to receive the power signal and produce the rotation speed driving signal corresponding to the power signal in accordance with the relations of the rotation speed-matching curve, so that the first fan and the second fan are operated at the matching rotation speed, thus producing the optimum operation efficiency and achieving the purpose of controlling the serial fan set.
摘要:
A radiation apparatus for dispersing heat energy generated by a heat-generating element includes a first and a second board chambers, a condenser tube, an evaporation tube and working fluid. The condenser tube and the evaporation tube have respectively two ends located on the first and the second board chambers. The first and second board chambers, condenser tube and evaporation tube jointly form a closed space to contain the working fluid. The working fluid in the evaporation tube absorbs heat energy from the heat-generating element and vaporizes to flow through the first board chamber to the condenser tube. In the condenser tube, the heat energy previously absorbed in vaporized working fluid is dispersed and the working fluid is condensed to become liquid flowing through the second board chamber to the evaporation tube to proceed another heat dissipation cycle. Thus heat dissipation efficiency may increase in the limited space of the server.
摘要:
A heat sink includes a base, a set of fins mounted to the base and a plurality of fixing portions, wherein the fixing portions extend from a surface of the base and the set of fins are mounted on an opposite surface of the base. The heat sink is secured to a printed circuit board with at least one heat generating component through the fixing portion of the base. The heat sink is improved by forming one or more slots at lateral sides of the base such that one or more deformable portions can be defined on the base. Thus, the deformable length of the base is increased and the heat stress is relaxed.