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    System and method for data packet transmission and reception
    3.
    发明授权
    System and method for data packet transmission and reception 失效
    数据包发送和接收的系统和方法

    公开(公告)号：US08631152B2

    公开(公告)日：2014-01-14

    申请号：US12385885

    申请日：2009-04-22

    申请人： Hidekazu Osano ,  Hiroshi Nakayama

    发明人： Hidekazu Osano ,  Hiroshi Nakayama

    IPC分类号： G06F15/16

    CPC分类号： G06F13/387

    摘要： A system transmits a data packet from a transmitting apparatus to a receiving apparatus. The receiving apparatus includes a receive buffer, and a size specifying information transmitting unit that transmits size specifying information to the transmitting apparatus. The transmitting apparatus includes a transmit buffer, a credit storage unit that stores, as a credit, a value corresponding to a total size of all data packets stored in the receive buffer, a credit adding unit that adds a credit to the stored credit on transmitting a data packet, a credit subtracting unit that specifies a size of a read-out data packet on receiving the size specifying information, subtracts a credit corresponding to the specified size from a stored credit, and a transmission controlling unit that controls data packet transmission based on a credit stored in the credit storage unit.

    摘要翻译： 系统将数据分组从发送装置发送到接收装置。 接收装置包括接收缓冲器和向发送装置发送大小指定信息的大小指定信息发送单元。 发送装置包括发送缓冲器，信用存储单元，作为信用存储对应于存储在接收缓冲器中的所有数据分组的总大小的值;信用增加单元，用于向所发送的存储信用增加信用 数据分组，信用减除单元，其在接收到大小指定信息时指定读出数据分组的大小，从存储的积分中减去与规定大小相对应的信用，以及控制数据分组发送的发送控制部， 存储在信用存储单元中的信用。

    Information processing device, data transmitting device, and data transfer method of data transmitting device
    4.
    发明授权
    Information processing device, data transmitting device, and data transfer method of data transmitting device 失效
    数据发送装置的信息处理装置，数据发送装置以及数据传送方法

    公开(公告)号：US08312340B2

    公开(公告)日：2012-11-13

    申请号：US12926690

    申请日：2010-12-03

    申请人： Shintaro Itozawa ,  Hiroshi Nakayama ,  Junji Ichimiya

    发明人： Shintaro Itozawa ,  Hiroshi Nakayama ,  Junji Ichimiya

    IPC分类号： H03M13/00 ,  H04L1/18

    CPC分类号： H04L1/007 ,  G06F11/0724 ,  G06F11/0763 ,  H04L1/0009 ,  H04L1/0057 ,  H04L25/14

    摘要： A selection-signal generating circuit in an LSI being a transmission-side LSI, when a transmission error is detected on an A-side signal line and degeneration control is performed thereon, instructs a selector to select an input from an ECC generator in order to transmit data and ECC data for this data to be transmitted via the B-side signal line, via the A-side signal line. In this manner, the degenerated signal line is used to transmit the ECC data for transmission data to be transmitted via a signal line which is not degenerated.

    摘要翻译： 作为发送侧LSI的LSI中的选择信号生成电路，当在A侧信号线上检测到发送错误并进行退化控制时，指示选择器从ECC发生器选择输入，以便 通过A侧信号线经由B侧信号线发送该数据的数据和ECC数据。 以这种方式，退化的信号线用于发送经由不退化的信号线发送的发送数据的ECC数据。

    Probe card for semiconductor wafer
    6.
    发明授权
    Probe card for semiconductor wafer 有权
    半导体晶圆探头卡

    公开(公告)号：US08159251B2

    公开(公告)日：2012-04-17

    申请号：US12801790

    申请日：2010-06-25

    申请人： Shunsuke Sasaki ,  Hiroshi Nakayama

    发明人： Shunsuke Sasaki ,  Hiroshi Nakayama

    IPC分类号： G01R31/00

    CPC分类号： G01R1/07314 ,  G01R1/44

    摘要： A probe card includes a plurality of probes that contacts a plurality of electrodes provided in the semiconductor wafer and that inputs or outputs an electrical signal in or from the electrodes, a probe head that holds the probes, a substrate having a wiring which is provided near the surface of the substrate facing the probe head so as to be contactable with the probe head and is connected to the probes, a core layer formed of a material which is buried in the substrate and has a coefficient of thermal expansion lower than that of the substrate, and a connecting member that electrically connects at least some of the probes with an external device via the wiring.

    摘要翻译： 探针卡包括接触设置在半导体晶片中的多个电极并且在电极内或从电极输入或输出电信号的多个探针，保持探针的探针头，具有接近设置的布线的基板 所述基板的表面面向所述探针头，以便能够与所述探针头接触，并且与所述探针相连接，所述芯层由掩埋在所述基板中的材料形成，并且具有低于所述探针的热膨胀系数 基板和连接构件，其通过布线将至少一些探针与外部装置电连接。

    Probe card electrically connectable with a semiconductor wafer
    7.
    发明授权
    Probe card electrically connectable with a semiconductor wafer 有权
    探针卡可与半导体晶圆电连接

    公开(公告)号：US08149008B2

    公开(公告)日：2012-04-03

    申请号：US12452716

    申请日：2008-07-16

    申请人： Yoshio Yamada ,  Hiroshi Nakayama ,  Tsuyoshi Inuma ,  Takashi Akao

    发明人： Yoshio Yamada ,  Hiroshi Nakayama ,  Tsuyoshi Inuma ,  Takashi Akao

    IPC分类号： G01R31/20

    CPC分类号： G01R31/2891 ,  G01R1/06722 ,  G01R1/07371

    摘要： A probe card includes a probe head that holds a plurality of probes; a flat wiring board that has a wiring pattern corresponding to a circuit structure; an interposer that is stacked on the wiring board and relays wirings of the wiring board; a space transformer that is placed between the interposer and the probe head, transforms a space between the wirings relayed by the interposer, and leads the transformed wirings out to a surface facing the probe head; and a plurality of post members that are formed in a substantially columnar shape with a height larger than a sum of a thickness of the wiring board and a thickness of the interposer, and embedded to pierce through the wiring board and the interposer in a thickness direction such that one of end surfaces of each post member comes into contact with the space transformer.

    摘要翻译： 探针卡包括保持多个探针的探针头; 具有对应于电路结构的布线图案的扁平布线板; 叠层在所述布线板上并且中继所述布线板的布线的插入件; 放置在插入器和探针头之间的空间变换器，变换由插入器中继的布线之间的空间，并将变换的布线引导到面向探头的表面; 以及多个柱状部件，其形成为高度大于布线板的厚度和插入件的厚度的总和的大致柱状，并且嵌入以穿过布线板和插入件在厚度方向上穿透 使得每个柱构件的端面中的一个与空间变压器接触。

    Probe card
    8.
    发明授权
    Probe card 有权
    探针卡

    公开(公告)号：US08149006B2

    公开(公告)日：2012-04-03

    申请号：US12086008

    申请日：2006-12-04

    申请人： Hiroshi Nakayama ,  Mitsuhiro Nagaya ,  Yoshio Yamada

    发明人： Hiroshi Nakayama ,  Mitsuhiro Nagaya ,  Yoshio Yamada

    IPC分类号： G01R31/20

    CPC分类号： G01R31/2889 ,  G01R1/07371

    摘要： A probe card includes probes that come into contact with a semiconductor wafer to receive or output an electric signal; a probe head that holds the probes; a substrate that has a wiring pattern corresponding to a circuit structure for generating a signal for a test; a reinforcing member that reinforces the substrate; an interposer that is stacked on the substrate and includes a housing having connection terminals resilient in an axial direction thereof and hole portions each housing one of the connection terminals; and a space transformer that is stacked between the interposer and the probe head and transforms intervals among the wires.

    摘要翻译： 探针卡包括与半导体晶片接触以接收或输出电信号的探针; 保持探头的探针头; 具有对应于用于产生测试信号的电路结构的布线图案的基板; 加强基板的加强构件; 中间层，其堆叠在所述基板上并且包括具有沿其轴向弹性的连接端子的壳体和各自容纳所述连接端子中的一个的孔部; 以及堆叠在插入件和探针头之间的空间变换器，并且在电线之间变换间隔。