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1.发明申请INLINE INSPECTION OF THE CONTACT BETWEEN CONDUCTIVE TRACES AND SUBSTRATE FOR HIDDEN DEFECTS USING WHITE LIGHT INTERFEROMETER WITH TILTED OBJECTIVE LENS 有权使用带有倾斜目标镜头的白光干涉仪对导电导线和底板之间的接触进行隐藏检测的在线检查公开(公告)号：US20150276375A1
公开(公告)日：2015-10-01
申请号：US14229446
申请日：2014-03-28
申请人： Shuhong Liu , Zhiyong Wang , Nilanjan Ghosh , Deepak Goyal
发明人： Shuhong Liu , Zhiyong Wang , Nilanjan Ghosh , Deepak Goyal
CPC分类号： G01N21/9501 , G01B9/0203 , G01B9/0209 , G01B11/0675 , G01B2210/56 , G01N21/956 , G02B21/0016
摘要： Embodiments include devices, systems and processes for using a white light interferometer (WLI) microscope with a tilted objective lens to perform in-line monitoring of both resist footing defects and conductive trace undercut defects. The defects may be detected at the interface between dry film resist (DFR) footings and conductive trace footing formed on insulating layer top surfaces of a packaging substrate. Such footing and undercut defects may other wise be considered “hidden defects”. Using the WLI microscope with a tilted objective lens provides a high-throughput and low cost metrology and tool for non-destructive, non-contact, in-line monitoring.
摘要翻译： 实施例包括使用具有倾斜物镜的白光干涉仪（WLI）显微镜的装置，系统和工艺，以执行两种抗蚀剂基础缺陷和导电迹线底切缺陷的在线监测。 可以在干膜抗蚀剂（DFR）底脚与形成在包装基材的绝缘层顶表面上的导电迹线基底之间的界面处检测到缺陷。 这种基础和底切缺陷可能被认为是“隐藏的缺陷”。 使用具有倾斜物镜的WLI显微镜为非破坏性，非接触式在线监测提供了高吞吐量和低成本的计量和工具。
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2.发明授权Metrology tool for electroless copper thickness measurement for BBUL process development monitoring 有权用于BBUL过程开发监测的无电铜厚度测量的计量工具公开(公告)号：US09441952B2
公开(公告)日：2016-09-13
申请号：US14040178
申请日：2013-09-27
申请人： Nilanjan Ghosh , Zhiyong Wang , Yu-Chun Chen , Shuhong Liu
发明人： Nilanjan Ghosh , Zhiyong Wang , Yu-Chun Chen , Shuhong Liu
CPC分类号： G01B11/0625 , G01B11/026 , H01L2224/16146 , H01L2224/73204 , H01L2924/12042 , H05K3/4644 , H05K2203/163 , H01L2924/00
摘要： A method including measuring a first distance to a surface of an integrated circuit substrate or a portion of an integrated circuit package by measuring an angle to it from two known points; introducing a material onto the surface; measuring a second distance to a surface of the film from the two known points; and determining a thickness of the introduced material by subtracting the second distance from the first distance.
摘要翻译： 一种方法，包括通过从两个已知点测量与其成角度来测量集成电路基板的表面或集成电路封装的一部分的第一距离; 将材料引入表面; 从两个已知点测量到薄膜表面的第二距离; 以及通过从第一距离减去第二距离来确定引入材料的厚度。
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3.发明申请METROLOGY TOOL FOR ELECTROLESS COPPER THICKNESS MEASUREMENT FOR BBUL PROCESS DEVELOPMENT MONITORING 有权电镀铜厚度测量用于BBUL工艺开发监测的计量工具公开(公告)号：US20150092201A1
公开(公告)日：2015-04-02
申请号：US14040178
申请日：2013-09-27
申请人： Nilanjan Ghosh , Zhiyong Wang , Yu-Chun Chen , Shuhong Liu
发明人： Nilanjan Ghosh , Zhiyong Wang , Yu-Chun Chen , Shuhong Liu
CPC分类号： G01B11/0625 , G01B11/026 , H01L2224/16146 , H01L2224/73204 , H01L2924/12042 , H05K3/4644 , H05K2203/163 , H01L2924/00
摘要： A method including measuring a first distance to a surface of an integrated circuit substrate or a portion of an integrated circuit package by measuring an angle to it from two known points; introducing a material onto the surface; measuring a second distance to a surface of the film from the two known points; and determining a thickness of the introduced material by subtracting the second distance from the first distance.
摘要翻译： 一种方法，包括通过从两个已知点测量与其成角度来测量集成电路基板的表面或集成电路封装的一部分的第一距离; 将材料引入表面; 从两个已知点测量到薄膜表面的第二距离; 以及通过从第一距离减去第二距离来确定引入材料的厚度。
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公开(公告)号：US20170284943A1
公开(公告)日：2017-10-05
申请号：US15083883
申请日：2016-03-29
申请人： Nilanjan Ghosh , Deepak Goyal , Jing Cheng , Leonel R. Arana
发明人： Nilanjan Ghosh , Deepak Goyal , Jing Cheng , Leonel R. Arana
CPC分类号： G01N21/95 , G01N21/55 , G01N21/8422 , G01N21/956 , G01N2201/0612 , G01N2201/13
摘要： A system for detecting a void in a photoresist layer can include: a detector, a processor, and a memory. The detector can be arranged to receive reflected light from a surface of a sample. The processor can be in electrical communication with the detector, The memory can store instructions that, when executed by the processor, can cause the processor to perform operations. The operations can comprise: receiving optical data from the detector, receiving calibrated data, and determining an existence of the void. the optical data can include information regarding a signature of the reflected light. The calibrated data can include information regarding a signature for a known sample of photoresist. The determination of the existence of the void can be based on a deviation of the optical data from the calibrated data.
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