Method of manufacturing an acoustic wave device
    2.
    发明授权
    Method of manufacturing an acoustic wave device 失效
    制造声波装置的方法

    公开(公告)号:US07721411B2

    公开(公告)日:2010-05-25

    申请号:US11987175

    申请日:2007-11-28

    IPC分类号: H04R31/00

    摘要: A method of manufacturing an acoustic wave device includes: forming a conductive pattern on a wafer made of a piezoelectric substrate having an acoustic wave element, the conductive pattern including a first conductive pattern being continuously formed on a cutting region for individuating the wafer, a second conductive pattern being formed on an electrode region where a plated electrode is to be formed and being connected to the acoustic wave element and a third conductive pattern connecting the first conductive pattern and the second pattern; forming an insulating layer on the wafer so as to have an opening on the second conductive pattern; forming the plated electrode on the second conductive pattern by providing an electrical current to the second conductive pattern via the first conductive pattern and the third conductive pattern; and cutting off and individuating the wafer along the cutting region.

    摘要翻译: 一种制造声波器件的方法包括:在由具有声波元件的压电基片制成的晶片上形成导电图案,所述导电图案包括连续形成在用于个别晶片的切割区域上的第一导电图案,第二 导电图案形成在要形成镀覆电极的电极区域上,并连接到声波元件;连接第一导电图案和第二图案的第三导电图案; 在所述晶片上形成绝缘层,以在所述第二导电图案上具有开口; 通过经由第一导电图案和第三导电图案向第二导电图案提供电流,在第二导电图案上形成电镀电极; 并沿着切割区域切割和分离晶片。

    ACOUSTIC WAVE DEVICE
    3.
    发明申请
    ACOUSTIC WAVE DEVICE 有权
    声波设备

    公开(公告)号:US20080174207A1

    公开(公告)日:2008-07-24

    申请号:US12018460

    申请日:2008-01-23

    IPC分类号: H01L41/08

    CPC分类号: H03H3/08 H01L2224/11

    摘要: An acoustic wave device includes an acoustic wave element formed on a substrate, a first seal portion provided on the substrate so as to form a cavity above the acoustic wave element, and a second seal portion provided on the first seal portion, the first seal portion having a step so that the first seal portion has a width on a first side and another width on a second side arranged so that the first side is closer than the second side to the substrate, and the width on the first side is greater than the another width on the second side.

    摘要翻译: 声波装置包括形成在基板上的声波元件,设置在基板上以在声波元件上方形成空腔的第一密封部分和设置在第一密封部分上的第二密封部分,第一密封部分 具有使所述第一密封部在第一侧具有宽度,在所述第二侧具有第二侧的另一宽度,使得所述第一侧比所述基板的所述第二侧更靠近,所述第一侧的宽度大于所述第一侧的宽度 第二侧的另一个宽度。

    Acoustic wave device
    4.
    发明授权
    Acoustic wave device 有权
    声波装置

    公开(公告)号:US07586240B2

    公开(公告)日:2009-09-08

    申请号:US12018460

    申请日:2008-01-23

    IPC分类号: H01L41/08

    CPC分类号: H03H3/08 H01L2224/11

    摘要: An acoustic wave device includes an acoustic wave element formed on a substrate, a first seal portion provided on the substrate so as to form a cavity above the acoustic wave element, and a second seal portion provided on the first seal portion, the first seal portion having a step so that the first seal portion has a width on a first side and another width on a second side arranged so that the first side is closer than the second side to the substrate, and the width on the first side is greater than the another width on the second side.

    摘要翻译: 声波装置包括形成在基板上的声波元件,设置在基板上以在声波元件上方形成空腔的第一密封部分和设置在第一密封部分上的第二密封部分,第一密封部分 具有使所述第一密封部在第一侧具有宽度,在所述第二侧具有第二侧的另一宽度,使得所述第一侧比所述基板的所述第二侧更靠近,所述第一侧的宽度大于所述第一侧的宽度 第二侧的另一个宽度。

    Acoustic wave device and method of manufacturing the same
    6.
    发明申请
    Acoustic wave device and method of manufacturing the same 失效
    声波装置及其制造方法

    公开(公告)号:US20080122318A1

    公开(公告)日:2008-05-29

    申请号:US11987175

    申请日:2007-11-28

    IPC分类号: H01L41/083 B05D5/12

    摘要: A method of manufacturing an acoustic wave device includes: forming a conductive pattern on a wafer made of a piezoelectric substrate having an acoustic wave element, the conductive pattern including a first conductive pattern, a second conductive pattern and a third conductive pattern, the first conductive pattern being continuously formed on a cutting region for individuating the wafer, the second conductive pattern being formed on an electrode region where a plated electrode is to be formed and being connected to the acoustic wave element, the third conductive pattern connecting the first conductive pattern and the second conductive pattern; forming an insulating layer on the wafer so as to have a opening on the second conductive pattern; forming the plated electrode on the second conductive pattern by providing an electrical current to the second conductive pattern via the first conductive pattern and the third conductive pattern; and cutting off and individuating the wafer along the cutting region.

    摘要翻译: 一种制造声波器件的方法包括:在由具有声波元件的压电基片制成的晶片上形成导电图案,所述导电图案包括第一导电图案,第二导电图案和第三导电图案,所述第一导电 图案连续地形成在用于个别晶片的切割区域上,第二导电图案形成在要形成镀覆电极的电极区域上,并连接到声波元件,第三导电图案连接第一导电图案和 第二导电图案; 在所述晶片上形成绝缘层以在所述第二导电图案上具有开口; 通过经由第一导电图案和第三导电图案向第二导电图案提供电流,在第二导电图案上形成电镀电极; 并沿着切割区域切割和分离晶片。

    Acoustic wave device
    7.
    发明申请
    Acoustic wave device 审中-公开
    声波装置

    公开(公告)号:US20080122314A1

    公开(公告)日:2008-05-29

    申请号:US11987268

    申请日:2007-11-28

    IPC分类号: H01L41/08

    摘要: An acoustic wave device includes an acoustic wave element provided on a substrate, a wiring that is provided on the substrate and is electrically connected to the acoustic wave element, a sealing portion that is provided on the substrate so as to cover the acoustic wave element and the wiring, and an insulating layer that is provided on a whole area between the substrate and the sealing portion and between the wiring and the sealing portion.

    摘要翻译: 声波装置包括:设置在基板上的声波元件,设置在基板上并与声波元件电连接的布线;密封部,其设置在基板上以覆盖声波元件;以及 布线和设置在基板和密封部分之间以及布线和密封部分之间的整个区域上的绝缘层。

    Elastic wave device and manufacturing method of the same
    8.
    发明申请
    Elastic wave device and manufacturing method of the same 失效
    弹性波装置及其制造方法相同

    公开(公告)号:US20080018414A1

    公开(公告)日:2008-01-24

    申请号:US11730961

    申请日:2007-04-05

    IPC分类号: H03H9/72

    摘要: An elastic wave device formed by bonding at least two surface acoustic wave devices by filling a resin therebetween is disclosed. Each of surface acoustic wave (SAW) devices includes a substrate; a functioning portion configured on the substrate; a recess that forms a space portion necessary for operation of the functioning portion, and a package that covers the surface of the substrate, and side faces of the package of the at least two SAW devices, corresponding to a portion bonded by filling of the resin between at least two SAW devices, includes the at least one cutout, and a first resin covers a portion of each of the side faces, the back faces, and the front faces of the substrate of the at least two SAW devices, and the first resin is filled with in the at least one cutout on the side faces of the package.

    摘要翻译: 公开了一种通过在其间填充树脂来粘合至少两个表面声波装置而形成的弹性波装置。 每个表面声波(SAW)器件包括衬底; 配置在所述基板上的功能部; 形成操作功能部分所需的空间部分的凹部和覆盖基板表面的封装以及至少两个SAW器件的封装的侧面,对应于通过填充树脂粘合的部分 在至少两个SAW器件之间,包括至少一个切口,并且第一树脂覆盖所述至少两个SAW器件的基板的每个侧面,背面和前表面的一部分,并且第一树脂 树脂填充在包装的侧面上的至少一个切口中。

    Elastic wave device and manufacturing method of the same
    9.
    发明授权
    Elastic wave device and manufacturing method of the same 失效
    弹性波装置及其制造方法相同

    公开(公告)号:US07602262B2

    公开(公告)日:2009-10-13

    申请号:US11730961

    申请日:2007-04-05

    IPC分类号: H03H9/00 H03H9/10

    摘要: An elastic wave device formed by bonding at least two surface acoustic wave devices by filling a resin therebetween is disclosed. Each of surface acoustic wave (SAW) devices includes a substrate; a functioning portion configured on the substrate; a recess that forms a space portion necessary for operation of the functioning portion, and a package that covers the surface of the substrate, and side faces of the package of the at least two SAW devices, corresponding to a portion bonded by filling of the resin between at least two SAW devices, includes the at least one cutout, and a first resin covers a portion of each of the side faces, the back faces, and the front faces of the substrate of the at least two SAW devices, and the first resin is filled with in the at least one cutout on the side faces of the package.

    摘要翻译: 公开了一种通过在其间填充树脂来粘合至少两个表面声波装置而形成的弹性波装置。 每个表面声波(SAW)器件包括衬底; 配置在所述基板上的功能部; 形成操作功能部分所需的空间部分的凹部和覆盖基板表面的封装以及至少两个SAW器件的封装的侧面,对应于通过填充树脂粘合的部分 在至少两个SAW器件之间,包括至少一个切口,并且第一树脂覆盖所述至少两个SAW器件的基板的每个侧面,背面和前表面的一部分,并且第一树脂 树脂填充在包装的侧面上的至少一个切口中。