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    Method of manufacturing an acoustic wave device
    3.
    发明授权
    Method of manufacturing an acoustic wave device 失效
    制造声波装置的方法

    公开(公告)号：US07721411B2

    公开(公告)日：2010-05-25

    申请号：US11987175

    申请日：2007-11-28

    申请人： Shunichi Aikawa ,  Jyouji Kimura ,  Keiji Tsuda ,  Kazunori Inoue ,  Takashi Matsuda

    发明人： Shunichi Aikawa ,  Jyouji Kimura ,  Keiji Tsuda ,  Kazunori Inoue ,  Takashi Matsuda

    IPC分类号： H04R31/00

    CPC分类号： H03H3/08 ,  H03H9/1092 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/4908 ,  Y10T29/49798

    摘要： A method of manufacturing an acoustic wave device includes: forming a conductive pattern on a wafer made of a piezoelectric substrate having an acoustic wave element, the conductive pattern including a first conductive pattern being continuously formed on a cutting region for individuating the wafer, a second conductive pattern being formed on an electrode region where a plated electrode is to be formed and being connected to the acoustic wave element and a third conductive pattern connecting the first conductive pattern and the second pattern; forming an insulating layer on the wafer so as to have an opening on the second conductive pattern; forming the plated electrode on the second conductive pattern by providing an electrical current to the second conductive pattern via the first conductive pattern and the third conductive pattern; and cutting off and individuating the wafer along the cutting region.

    摘要翻译： 一种制造声波器件的方法包括：在由具有声波元件的压电基片制成的晶片上形成导电图案，所述导电图案包括连续形成在用于个别晶片的切割区域上的第一导电图案，第二 导电图案形成在要形成镀覆电极的电极区域上，并连接到声波元件;连接第一导电图案和第二图案的第三导电图案; 在所述晶片上形成绝缘层，以在所述第二导电图案上具有开口; 通过经由第一导电图案和第三导电图案向第二导电图案提供电流，在第二导电图案上形成电镀电极; 并沿着切割区域切割和分离晶片。

    ACOUSTIC WAVE DEVICE
    4.
    发明申请
    ACOUSTIC WAVE DEVICE 有权
    声波设备

    公开(公告)号：US20080174207A1

    公开(公告)日：2008-07-24

    申请号：US12018460

    申请日：2008-01-23

    申请人： Keiji Tsuda ,  Jyouji Kimura ,  Shunichi Aikawa ,  Kazunori Inoue ,  Takashi Matsuda

    发明人： Keiji Tsuda ,  Jyouji Kimura ,  Shunichi Aikawa ,  Kazunori Inoue ,  Takashi Matsuda

    IPC分类号： H01L41/08

    CPC分类号： H03H3/08 ,  H01L2224/11

    摘要： An acoustic wave device includes an acoustic wave element formed on a substrate, a first seal portion provided on the substrate so as to form a cavity above the acoustic wave element, and a second seal portion provided on the first seal portion, the first seal portion having a step so that the first seal portion has a width on a first side and another width on a second side arranged so that the first side is closer than the second side to the substrate, and the width on the first side is greater than the another width on the second side.

    摘要翻译： 声波装置包括形成在基板上的声波元件，设置在基板上以在声波元件上方形成空腔的第一密封部分和设置在第一密封部分上的第二密封部分，第一密封部分 具有使所述第一密封部在第一侧具有宽度，在所述第二侧具有第二侧的另一宽度，使得所述第一侧比所述基板的所述第二侧更靠近，所述第一侧的宽度大于所述第一侧的宽度 第二侧的另一个宽度。

    Acoustic wave device
    5.
    发明授权
    Acoustic wave device 有权
    声波装置

    公开(公告)号：US07586240B2

    公开(公告)日：2009-09-08

    申请号：US12018460

    申请日：2008-01-23

    申请人： Keiji Tsuda ,  Jyouji Kimura ,  Shunichi Aikawa ,  Kazunori Inoue ,  Takashi Matsuda

    发明人： Keiji Tsuda ,  Jyouji Kimura ,  Shunichi Aikawa ,  Kazunori Inoue ,  Takashi Matsuda

    IPC分类号： H01L41/08

    CPC分类号： H03H3/08 ,  H01L2224/11

    摘要： An acoustic wave device includes an acoustic wave element formed on a substrate, a first seal portion provided on the substrate so as to form a cavity above the acoustic wave element, and a second seal portion provided on the first seal portion, the first seal portion having a step so that the first seal portion has a width on a first side and another width on a second side arranged so that the first side is closer than the second side to the substrate, and the width on the first side is greater than the another width on the second side.

    摘要翻译： 声波装置包括形成在基板上的声波元件，设置在基板上以在声波元件上方形成空腔的第一密封部分和设置在第一密封部分上的第二密封部分，第一密封部分 具有使所述第一密封部在第一侧具有宽度，在所述第二侧具有第二侧的另一宽度，使得所述第一侧比所述基板的所述第二侧更靠近，所述第一侧的宽度大于所述第一侧的宽度 第二侧的另一个宽度。

    Acoustic wave device and method of manufacturing the same
    6.
    发明申请
    Acoustic wave device and method of manufacturing the same 失效
    声波装置及其制造方法

    公开(公告)号：US20080122318A1

    公开(公告)日：2008-05-29

    申请号：US11987175

    申请日：2007-11-28

    申请人： Shunichi Aikawa ,  Jyouji Kimura ,  Keiji Tsuda ,  Kazunori Inoue ,  Takashi Matsuda

    发明人： Shunichi Aikawa ,  Jyouji Kimura ,  Keiji Tsuda ,  Kazunori Inoue ,  Takashi Matsuda

    IPC分类号： H01L41/083 ,  B05D5/12

    CPC分类号： H03H3/08 ,  H03H9/1092 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/4908 ,  Y10T29/49798

    摘要： A method of manufacturing an acoustic wave device includes: forming a conductive pattern on a wafer made of a piezoelectric substrate having an acoustic wave element, the conductive pattern including a first conductive pattern, a second conductive pattern and a third conductive pattern, the first conductive pattern being continuously formed on a cutting region for individuating the wafer, the second conductive pattern being formed on an electrode region where a plated electrode is to be formed and being connected to the acoustic wave element, the third conductive pattern connecting the first conductive pattern and the second conductive pattern; forming an insulating layer on the wafer so as to have a opening on the second conductive pattern; forming the plated electrode on the second conductive pattern by providing an electrical current to the second conductive pattern via the first conductive pattern and the third conductive pattern; and cutting off and individuating the wafer along the cutting region.

    摘要翻译： 一种制造声波器件的方法包括：在由具有声波元件的压电基片制成的晶片上形成导电图案，所述导电图案包括第一导电图案，第二导电图案和第三导电图案，所述第一导电 图案连续地形成在用于个别晶片的切割区域上，第二导电图案形成在要形成镀覆电极的电极区域上，并连接到声波元件，第三导电图案连接第一导电图案和 第二导电图案; 在所述晶片上形成绝缘层以在所述第二导电图案上具有开口; 通过经由第一导电图案和第三导电图案向第二导电图案提供电流，在第二导电图案上形成电镀电极; 并沿着切割区域切割和分离晶片。

    Method of manufacturing a surface acoustic wave device
    7.
    发明授权
    Method of manufacturing a surface acoustic wave device 失效
    声表面波装置的制造方法

    公开(公告)号：US07854050B2

    公开(公告)日：2010-12-21

    申请号：US12239525

    申请日：2008-09-26

    申请人： Shunichi Aikawa ,  Takumi Kooriike ,  Jyouji Kimura

    发明人： Shunichi Aikawa ,  Takumi Kooriike ,  Jyouji Kimura

    IPC分类号： H04R17/10

    CPC分类号： H03H9/059 ,  H01L2224/11 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/16195 ,  H03H3/08 ,  H03H9/1092 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/49146 ,  H01L2924/00014

    摘要： A surface acoustic wave device is enable to prevent electrode erosion, without any specific environmental process. The surface acoustic wave device includes a piezoelectric substrate, an electrode for the formation of surface acoustic wave, being formed on the piezoelectric substrate, on the piezoelectric substrate, a frame-shaped layer surrounding the electrode for the formation of surface acoustic wave, and a lid body formed on the frame-shaped layer by bonding, so as to form a hollow portion between the lid body and the electrode for the formation of surface acoustic wave. The frame-shaped layer and the lid body include photosensitive resin, and the lid body includes a through hole, and the through hole is sealed with a halogen-free thermosetting resin.

    摘要翻译： 表面声波装置能够在没有任何特定的环境过程的情况下防止电极腐蚀。 表面声波装置包括压电基片，形成表面声波的电极，形成在压电基片上，压电基片上，围绕用于形成表面声波的电极的框状层，以及 盖体通过接合而形成在框状层上，从而在盖体和用于形成表面声波的电极之间形成中空部分。 框状层和盖体包括感光性树脂，盖体包括通孔，并且通过无卤热固性树脂密封通孔。

    SURFACE ACOUSTIC WAVE DEVICE, AND MANUFACTURING METHOD THEREFOR
    8.
    发明申请
    SURFACE ACOUSTIC WAVE DEVICE, AND MANUFACTURING METHOD THEREFOR 失效
    表面声波装置及其制造方法

    公开(公告)号：US20090096321A1

    公开(公告)日：2009-04-16

    申请号：US12239525

    申请日：2008-09-26

    申请人： Shunichi Aikawa ,  Takumi Kooriike ,  Jyouji Kimura

    发明人： Shunichi Aikawa ,  Takumi Kooriike ,  Jyouji Kimura

    IPC分类号： H01L41/08 ,  H01L41/22

    CPC分类号： H03H9/059 ,  H01L2224/11 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/16195 ,  H03H3/08 ,  H03H9/1092 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/49146 ,  H01L2924/00014

    摘要： A surface acoustic wave device is enable to prevent electrode erosion, without any specific environmental process. The surface acoustic wave device includes a piezoelectric substrate, an electrode for the formation of surface acoustic wave, being formed on the piezoelectric substrate, on the piezoelectric substrate, a frame-shaped layer surrounding the electrode for the formation of surface acoustic wave, and a lid body formed on the frame-shaped layer by bonding, so as to form a hollow portion between the lid body and the electrode for the formation of surface acoustic wave. The frame-shaped layer and the lid body include photosensitive resin, and the lid body includes a through hole, and the through hole is sealed with a halogen-free thermosetting resin.

    摘要翻译： 表面声波装置能够在没有任何特定的环境过程的情况下防止电极腐蚀。 表面声波装置包括压电基片，形成表面声波的电极，形成在压电基片上，压电基片上，围绕用于形成表面声波的电极的框状层，以及 盖体通过接合而形成在框状层上，从而在盖体和用于形成表面声波的电极之间形成中空部分。 框状层和盖体包括感光性树脂，盖体包括通孔，并且通过无卤热固性树脂密封通孔。

    Acoustic wave device with adhesive layer and method of manufacturing the same
    9.
    发明授权
    Acoustic wave device with adhesive layer and method of manufacturing the same 有权
    具有粘合剂层的声波装置及其制造方法

    公开(公告)号：US08004160B2

    公开(公告)日：2011-08-23

    申请号：US12341279

    申请日：2008-12-22

    申请人： Keiji Tsuda ,  Jyouji Kimura ,  Shunichi Aikawa

    发明人： Keiji Tsuda ,  Jyouji Kimura ,  Shunichi Aikawa

    IPC分类号： H01L41/04 ,  H01L41/08

    CPC分类号： H03H9/059 ,  H01L2224/11 ,  H01L2924/16235 ,  H03H9/1092 ,  Y10T29/42

    摘要： An acoustic wave device includes a substrate, an acoustic wave element, an electrode pad, a resin portion and a metal post. The acoustic wave element is provided on the substrate. The electrode pad is provided on the substrate, is electrically coupled to the acoustic wave element, and has an Au layer and an adhesive layer formed on the Au layer and having an opening. The resin portion is provided on the substrate so as to cover the acoustic wave element and the electrode pad, and has a through-hole formed to expose a surface of the electrode pad. The metal post is provided in the through-hole and contacts with the Au layer through the opening of the adhesive layer. The adhesive layer is provided between the Au layer and the resin portion.

    摘要翻译： 声波装置包括基板，声波元件，电极焊盘，树脂部和金属柱。 声波元件设置在基板上。 电极焊盘设置在基板上，电耦合到声波元件，并且具有形成在Au层上并具有开口的Au层和粘合层。 树脂部分设置在基板上以覆盖声波元件和电极焊盘，并且具有形成为暴露电极焊盘的表面的通孔。 金属柱设置在通孔中，并通过粘合剂层的开口与Au层接触。 粘合剂层设置在Au层和树脂部之间。

    ACOUSTIC WAVE DEVICE AND METHOD OF MANUFACTURING THE SAME
    10.
    发明申请
    ACOUSTIC WAVE DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
    声波装置及其制造方法

    公开(公告)号：US20090160290A1

    公开(公告)日：2009-06-25

    申请号：US12341279

    申请日：2008-12-22

    申请人： Keiji Tsuda ,  Jyouji Kimura ,  Shunichi Aikawa

    发明人： Keiji Tsuda ,  Jyouji Kimura ,  Shunichi Aikawa

    IPC分类号： H01L41/047 ,  H01L41/22

    CPC分类号： H03H9/059 ,  H01L2224/11 ,  H01L2924/16235 ,  H03H9/1092 ,  Y10T29/42

    摘要： An acoustic wave device includes a substrate, an acoustic wave element, an electrode pad, a resin portion and a metal post. The acoustic wave element is provided on the substrate. The electrode pad is provided on the substrate, is electrically coupled to the acoustic wave element, and has an Au layer and an adhesive layer formed on the Au layer and having an opening. The resin portion is provided on the substrate so as to cover the acoustic wave element and the electrode pad, and has a through-hole formed to expose a surface of the electrode pad. The metal post is provided in the through-hole and contacts with the Au layer through the opening of the adhesive layer. The adhesive layer is provided between the Au layer and the resin portion.

    摘要翻译： 声波装置包括基板，声波元件，电极焊盘，树脂部和金属柱。 声波元件设置在基板上。 电极焊盘设置在基板上，电耦合到声波元件，并且具有形成在Au层上并具有开口的Au层和粘合层。 树脂部分设置在基板上以覆盖声波元件和电极焊盘，并且具有形成为暴露电极焊盘的表面的通孔。 金属柱设置在通孔中，并通过粘合剂层的开口与Au层接触。 粘合剂层设置在Au层和树脂部之间。