公开(公告)号：US06787711B2

公开(公告)日：2004-09-07

申请号：US10195547

申请日：2002-07-16

申请人： Shunichi Kikuchi ,  Mitsutaka Yamada ,  Kenji Iketaki

发明人： Shunichi Kikuchi ,  Mitsutaka Yamada ,  Kenji Iketaki

IPC分类号： H05K111

CPC分类号： H05K1/0209 ,  H05K1/0201 ,  H05K3/3494 ,  H05K2201/066 ,  H05K2201/09781 ,  H05K2201/10204 ,  H05K2203/1121 ,  H05K2203/304 ,  Y10T29/4913 ,  Y10T29/49144

摘要： A printed wiring board device includes circuit parts which are mounted on a wiring board and constitute parts of a circuit in the printed wiring board device. Pads are provided on the wiring board in the circumference of the circuit parts, and the pads being electrically isolated from the circuit. Heat-absorbing dummy parts are mounted on the pads, and the dummy parts absorb heat from the circuit parts through the pads during reflow soldering.

摘要翻译： 印刷电路板装置包括安装在布线板上并构成印刷线路板装置中的电路的一部分的电路部分。 在电路部分的圆周上的布线板上设置有焊盘，并且焊盘与电路电隔离。 吸热虚拟部件安装在焊盘上，并且虚拟部件在回流焊接期间通过焊盘吸收来自电路部件的热量。

公开(公告)号：US06193905B1

公开(公告)日：2001-02-27

申请号：US08380312

申请日：1995-01-30

申请人： Mitsutaka Yamada ,  Kishio Yokouchi ,  Nobuo Kamehara ,  Koichi Niwa

发明人： Mitsutaka Yamada ,  Kishio Yokouchi ,  Nobuo Kamehara ,  Koichi Niwa

IPC分类号： C09K504

CPC分类号： H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A coolant for cooling a semiconductor element by direct immersion, cooling, which has an improved cooling capability, is disclosed. The coolant comprises a low boiling point fluorocarbon having a boiling point of 30° C. to 100° C. and a high boiling point fluorocarbon having a boiling point higher than that of the low boiling point fluorocarbon by at least 100° C.; an amount of the high boiling point fluorocarbon being less than 20% by volume, based on the volume of the low boiling point fluorocarbon.

摘要翻译： 公开了一种用于通过直接浸入，冷却来冷却半导体元件的冷却剂，其具有改进的冷却能力。 冷却剂包括沸点为30℃至100℃的低沸点碳氟化合物和沸点高于低沸点碳氟化合物的沸点至少为100℃的高沸点碳氟化合物; 基于低沸点碳氟化合物的体积，高沸点碳氟化合物的量小于20体积％。

公开(公告)号：US5038571A

公开(公告)日：1991-08-13

申请号：US437710

申请日：1989-11-17

申请人： Kishio Yokouchi ,  Mitsutaka Yamada ,  Nobuo Kamehara ,  Koichi Niwa

发明人： Kishio Yokouchi ,  Mitsutaka Yamada ,  Nobuo Kamehara ,  Koichi Niwa

IPC分类号： C09K5/04 ,  F25D3/10 ,  H01L23/44

CPC分类号： C09K5/045 ,  C09K5/04 ,  H01L23/445 ,  C09K2205/128 ,  F25D3/10 ,  H01L2924/0002

摘要： A coolant for use in cryogenic devices of closed cycle system which comprises a mixture of a liquid nitrogen and a fluorocarbon of the formula: C.sub.n F.sub.2n+2, wherein n is an integer of 2 to 4. The coolant, when used to cool heat generating semiconductor devices and other devices to a cryogenic temperature, exhibits an increased heat flux and thus an increased cooling capability, in addition to a simple and small structure of the cooling system, and a prevention of environmental pollution.

公开(公告)号：US5349499A

公开(公告)日：1994-09-20

申请号：US53452

申请日：1993-04-28

申请人： Mitsutaka Yamada ,  Kishio Yokouchi ,  Nobuo Kamehara ,  Koichi Niwa

发明人： Mitsutaka Yamada ,  Kishio Yokouchi ,  Nobuo Kamehara ,  Koichi Niwa

IPC分类号： H01L23/427 ,  H05K7/20

CPC分类号： H01L23/427 ,  H01L2924/0002

摘要： A coolant for cooling a semiconductor element by direct immersion, cooling, which has an improved cooling capability, is disclosed. The coolant comprises a low boiling point fluorocarbon having a boiling point of 30.degree. C. to 100.degree. C. and a high boiling point fluorocarbon having a boiling point higher than that of the low boiling point fluorocarbon by at least 100.degree. C.; an amount of the high boiling point fluorocarbon being less than 20% by volume, based on the volume of the low boiling point fluorocarbon.

摘要翻译： 公开了一种用于通过直接浸入，冷却来冷却半导体元件的冷却剂，其具有改进的冷却能力。 冷却剂包括沸点为30℃至100℃的低沸点碳氟化合物和沸点高于低沸点碳氟化合物的沸点至少为100℃的高沸点碳氟化合物; 基于低沸点碳氟化合物的体积，高沸点碳氟化合物的量小于20体积％。